jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.
Features
- Excellent adhesion
- Good toughness
- Good mechanical, impact and crack resistance
- Excellent elasticity and flexibility
Applications
- Printed electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)
- Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)
- Base film and sheet for wearable devices
- Coatings
- Adhesives
*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
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Identification & Functionality
jER™ YX7105 Features & Benefits
- Liquid type (easy to handle)
- Flexibility, stretchability
- Tough, High resistant to mechanical pressure (thermal decomposition, bending/warpage)
- Strong adhesion
- Highly adhesive to metal, porcelain, concrete
- Excellent insulation property
- High heat resistance
- High chemical resistance
- High water resistance
Applications & Uses
- Coating
- Adhesives
- Additives (Stress relaxer, Impact modifier)
- Base film and sheet for wearable devices,
- Printed Electronics (Resist Ink, Build-up wire board, Flexible printed wire board, Metal core printed circuit board)
- Semiconductor (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)
jERTM YX7105 is a liquid-type epoxy resin with flexible properties that increases the impact resistance of e.g. coatings, adhesives, composites and potting & encapsulation materials.
Properties
| Value | Units | Test Method / Conditions | |
| Density (25°C) | 1.2 | Kg/m3 | Volumetric |
| Viscosity (at 50°C) | 65 | P | Brookfield Viscometer |
| Value | Units | Test Method / Conditions | |
| Epoxy Equivalent Weight (WPE) | 440-500 | g/eq | Potentiometric Titration |
| SAP Chloride | max. 100 | ppm | Potentiometric Titration |
| Total Chloride Content | 500 | ppm | - |
| Value | Unit | Method | |
| jER™ YX7105 | 100 | phr | |
| Bisphenol A Novolac | 25 | phr | |
| 2-Ethyl-4-methylimidazole | 0.05 | phr | |
| Curing condition |
170°C/1hr + 180°C/1hr |
||
| Cured State Properties | |||
| Tg | 31 | °C |
Thermomechanical Analysis |
| Td5 | 336 | °C |
Thermogravimetry-Differential, Thermal Analysis (Heating rate: 10°C/min, in air) |
| Tensile Modulus | 63 | MPa | Autograph |
| Tensile Strength | 8.8 | MPa | Autograph |
| Tensile Elongation | 153 | MPa | Autograph |
Technical Details & Test Data
Appropriate choice of Hardener for a desired curing temperature
- Epoxy resin forms 3D crosslinked network structure
- Abundant choices of Epoxy/Hardener combination
Packaging & Availability
Storage & Handling
Carefully read the SDS before using, handling, transporting, storing or disposing. jER™ YX7105 should be stored in tightly closed containers under exclusion of humidity at gentle temperatures. Avoid exposure to direct sunlight. Under these storage conditions the product has a minimum shelf life of three months from date of delivery.