jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage.
Features
- Excellent adhesion
- Good toughness
- Good mechanical, impact and crack resistance
- Excellent elasticity and flexibility
Applications
- Printed electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)
- Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)
- Base film and sheet for wearable devices
- Coatings
- Adhesives
Chemical Family: Epoxy & Epoxy Derivatives
End Uses: Semiconductor Applications
Polymer Name: Epoxy Resins & Compounds
Compatible Substrates & Surfaces: Glass, Fibers & Fabrics, Metal, Plastics, Steel, Aluminum, Ceramic, Concrete & Masonry
Product Resources
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Knowde Enhanced TDS
Identification & Functionality
Chemical Family
Polymer Name
CASE Ingredients Functions
Composite Materials Functions
Plastics & Elastomers Functions
Technologies
Molecular Structure
jER™ YX7105 Features & Benefits
CASE Ingredients Features
Product Highlights
- Liquid type (easy to handle)
- Flexibility, stretchability
- Tough, High resistant to mechanical pressure (thermal decomposition, bending/warpage)
- Strong adhesion
Applications & Uses
Markets
Plastics & Elastomers End Uses
Usage & Application
- Coating
- Adhesives
- Additives (Stress relaxer, Impact modifier)
- Base film and sheet for wearable devices,
- Printed Electronics (Resist Ink, Build-up wire board, Flexible printed wire board, Metal core printed circuit board)
- Semiconductor (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)
Properties
Compatible Substrates & Surfaces
Physical Form
Appearance
Colorless liquid
Physical Properties
| Value | Units | Test Method / Conditions | |
| Density (at 25°C) | 1.2 | kg/m3 | - |
| Viscosity (at 50°C) | 65 | P | Brookfield Viscometer |
Typical Properties
| Value | Units | Test Method / Conditions | |
| Epoxy Equivalent Weight (WPE) | 440-500 | g/eq | Potentiometric Titration |
| SAP Chloride | max. 100 | ppm | Potentiometric Titration |
| Total Chloride Content | 500 | ppm | - |
Cured Properties
| Value | Units | Test Method / Conditions | |
| Glass Transition Temperature | 31 | °C | Differential Scanning Calorimetry |
| Td5 (Heating rate: 10°C/min, in air) | 336 | °C | Thermogravimetry-Differential Thermal Analysis |
| Tensile Elongation | 153 | MPa | Autograph |
| Tensile Modulus | 63 | MPa | Autograph |
| Tensile Strength | 8.8 | MPa | Autograph |
Technical Details & Test Data
Film Stretching
Sheet Bending
Packaging & Availability
Storage & Handling
Shelf Life
3 months
Storage and Handling
Carefully read the SDS before using, handling, transporting, storing or disposing. jER™ YX7105 should be stored in tightly closed containers under exclusion of humidity at gentle temperatures. Avoid exposure to direct sunlight. Under these storage conditions the product has a minimum shelf life of three (3) months from date of delivery.
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