jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jERTM YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.
Features
- Excellent adhesion
- Good toughness
- Good mechanical, impact and crack resistance
- Excellent elasticity and flexibility
Applications
- Printed electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)
- Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)
- Base film and sheet for wearable devices
- Coatings
- Adhesives
*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group
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Identification & Functionality
jER™ YX7105 Features & Benefits
- Liquid type (easy to handle)
- Flexibility, stretchability
- Tough, High resistant to mechanical pressure (thermal decomposition, bending/warpage)
- Strong adhesion
- Highly adhesive to metal, porcelain, concrete
- Excellent insulation property
- High heat resistance
- High chemical resistance
- High water resistance
Applications & Uses
- Coating
- Adhesives
- Additives (Stress relaxer, Impact modifier)
- Base film and sheet for wearable devices,
- Printed Electronics (Resist Ink, Build-up wire board, Flexible printed wire board, Metal core printed circuit board)
- Semiconductor (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)
jERTM YX7105 is a liquid-type epoxy resin with flexible properties that increases the impact resistance of e.g. coatings, adhesives, composites and potting & encapsulation materials.
Properties
| Value | Units | Test Method / Conditions | |
| Density (25°C) | 1.2 | Kg/m3 | Volumetric |
| Viscosity (at 50°C) | 65 | P | Brookfield Viscometer |
| Value | Units | Test Method / Conditions | |
| Epoxy Equivalent Weight (WPE) | 440-500 | g/eq | Potentiometric Titration |
| SAP Chloride | max. 100 | ppm | Potentiometric Titration |
| Total Chloride Content | 500 | ppm | - |
| Value | Unit | Method | |
| jER™ YX7105 | 100 | phr | |
| Bisphenol A Novolac | 25 | phr | |
| 2-Ethyl-4-methylimidazole | 0.05 | phr | |
| Curing condition |
170°C/1hr + 180°C/1hr |
||
| Cured State Properties | |||
| Tg | 31 | °C |
Thermomechanical Analysis |
| Td5 | 336 | °C |
Thermogravimetry-Differential, Thermal Analysis (Heating rate: 10°C/min, in air) |
| Tensile Modulus | 63 | MPa | Autograph |
| Tensile Strength | 8.8 | MPa | Autograph |
| Tensile Elongation | 153 | MPa | Autograph |
Technical Details & Test Data
Appropriate choice of Hardener for a desired curing temperature
- Epoxy resin forms 3D crosslinked network structure
- Abundant choices of Epoxy/Hardener combination
Packaging & Availability
Storage & Handling
Carefully read the SDS before using, handling, transporting, storing or disposing. jER™ YX7105 should be stored in tightly closed containers under exclusion of humidity at gentle temperatures. Avoid exposure to direct sunlight. Under these storage conditions the product has a minimum shelf life of three months from date of delivery.