jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.
Features
- Excellent adhesion
- Fast cure time
- Low chlorine content
- Excellent transparency
- LED-curable
- UV-curable
Applications
- Consumer appliances and electronics
- Electrical and electronic displays
- Electronics adhesives
- Potting compounds
- Semiconductor manufacturing
- LEDs
*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
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Identification & Functionality
jER™ YX8000D Features & Benefits
- Liquid type (easy to handle)
- Excellent Tranparency even after full-curing
- Adhesion
- High Photo cure rate
- Low chlorine level
- Highly adhesive to metal, porcelain, concrete
- Excellent insulation property
- High heat resistance
- High chemical resistance
- High water resistance
Applications & Uses
- Photocure process (UV/LED)
- LED/OLED encapsulant
- LED reflector
- Adhesives for optical devices, electro-optic assemblies, and laser components.
Properties
Value | Units | Test Method / Conditions | |
Refractive Index (589nm) | 1.50 | - | D line |
Value | Units | Test Method / Conditions | |
Density (at 25°C) | 1.1 | g/cm3 | Density Meter (Vibration type) |
Value | Units | Test Method / Conditions | |
Epoxy Equivalent Weight (WPE) | 175 - 195 | g/eq | Potentiometric Titration |
Chloride Content | max. 1200 | ppm | Potentiometric Titration |
Viscosity (at 25°C) | max. 1500 | mPa.s | Capillary Viscometer |
Value | Unit | Method | ||||
jER™ YX8000D | 100 | - | phr | |||
Other company’s hydrogenated bisphenol A type epoxy | - | 100 | ||||
Anhydride curing agent (Methylhexahydrophthalic anhydride/Hexahydrophthalic anhydride = 70/30) | 89 | 77 | phr | |||
Curing accelerator (Methyltributylphosphonium dimethylphosphate) | 1 | 1 | phr | |||
Gel time @ 120 °C | 30 | 36 | ||||
Curing condition |
100°C/3h + 130°C/3 h |
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Cured State Properties | ||||||
Tg (tanδ) | 135 | - | °C |
Dynamic Mechanical Analysis |
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Elastic modulus @ 30 °C | 3.4 | - | GPa |
Dynamic Mechanical Analysis |
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Elastic modulus @ 220 °C | 17 | - | MPa |
Dynamic Mechanical Analysis |
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Tg | 136 | 110 |
Thermo Mechanical Analysis |
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Coefficient of Thermal Expansion (α1) | 68 | 75 | ppm |
Thermo Mechanical Analysis |
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Coefficient of Thermal Expansion (α2) | 172 | 186 | ppm |
Thermo Mechanical Analysis |
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Moisture absorption rate |
72hr | 0.8 | 0.9 | % |
85°C 85%RH |
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168hr | 0.83 | 0.92 | % | |||
Light resistance (Weathermeter, 0.4kw/m^2) |
Yellowness index |
0hr | 1 | 1 | - | |
168hr | 7 | 16 | - | |||
Light transmittance at 360 nm |
0hr | 86 | 85 | % | ||
168hr | 53 | 35 | % |
Technical Details & Test Data
YX8000D significantly decreases photo curing time to reach sufficient crosslinking reaction level compared to a conventional CER.
CER: Cycloaliphatic epoxy resin
Light source 200mW/cm2, no filter, 25°C
Photo cationic catalyst CPI 100P San Apro Ltd.
Transparency data of YX8000*
High transparency can be achieved by YX8000D.
*YX8000 is a former version of YX8000D with higher Cl impurity.
Curing condition: 100°C x 3hr + 130°C x 3hr
Curing agent: Acid anhydride type
YX8000 addition to CER improves adhesiveness to metal substrates.
*YX8000 is a former version of YX8000D with higher Cl impurity.
Share adhesive strength
Curing condition: 100°C x 3hr + 130°C x 3hr
Curing agent: Acid anhydride type
Share adhesive strength test: ISO4587 (JIS K 6850)
Appropriate choice of Hardener for a desired curing temperature
- Epoxy resin forms 3D crosslinked network structure
- Abundant choices of Epoxy/Hardener combination
Packaging & Availability
Storage & Handling
Carefully read the SDS before using, handling, transporting, storing or disposing. jER™ YX8000D should be stored in tightly closed containers under exclusion of humidity at gentle temperatures. Avoid exposure to direct sunlight. Under these storage conditions the product has a minimum shelf life of three months from date of delivery.