TEPIC® S Tris (2,3-Epoxy propyl) Isocyanurate, is a unique symmetrical triazine contains tri-functional epoxy compound which entirely different from conventional bisphenol type epoxy resin. TEPIC is well suited for electronic coatings and plays a crucial role as the the cross-linker integrity of solder mask, in transparency of LEDs, and in outdoor durability of powder coating.

Functions: Crosslinking Agent

Chemical Family: Polyisocyanates

Compatible Polymers & Resins: Polyesters

End Uses: Powder Coating

Knowde Enhanced TDS

Identification & Functionality

Chemical Family
CASE Ingredients Functions
Technologies
Chemical Structure

TEPIC® S - Chemical Structure

Features & Benefits

CASE Ingredients Features
Properties
  • High cross-linking density with excellent heat
    resistance and thermosetting performance.
  • Minimum UV and lighting absorption provide with superb
    visibility.
  • Disperse fine powder with suspension stability for
    reactive latency.
  • Low chlorine contents, inhibit deterioration and electrolytic
    corrosion.

Applications & Uses

Compatible Polymers & Resins
Compatible Substrates & Surfaces
Coating Type
Application

TEPIC consists of triazine nucleus and three glycidyl group. TEPIC triazine nucleus imparts outdoor durability due to low UV absorption.
TEPIC three glycigyl group imparts high heat resistance due to high cross link density. TEPIC has a wide variety of industrial applications such as:

  • Print circuit board (PCB)
    – Top-coated ink
    – Solder-resistant ink (PCB solder mask)
    – High performance SRI for PC and Cell Phone
    – Short circuit prevention: Permanent protective coating of PCB
    – Increased heat and solvent resistance– Resolving power up
  • Transparent encapsulate (LED, CCD)
  • Semiconductor encapsulate
  • Plastic, rubber, and adhesive additive
  • Outdoor polyester powder coating

Properties

Physical Form
Appearance
Powder
Typical Properties
ValueUnitsTest Method / Conditions
Epoxy Equivalent Weightmax. 105g/equiv.
Hydrolyzable Chlorinemax. 0.15%
Melting Point95 - 125°C
Particle Size (mesh pass min. 99%)42nm
Solubility in DMF at 20°C6.4g/100g
Solubility in Ethyl acetate at 25°C1.5g/100g
Solubility in Ethyl acetate at 40°C4.6g/100g
Solubility in MEK at 20°C1.1g/100g
Solubility in MEK at 25°C2g/100g
Solubility in MEK at 40°C6.8g/100g
Solubility in PGME at 25°C1.6g/100g
Solubility in PGME at 40°C2.9g/100g
Solubility in PGMEA at 25°C2.2g/100g
Solubility in PGMEA at 40°C4g/100g
Viscosity at 120°Cmax. 100CPS

Technical Details & Test Data

Test Data

TEPIC-S/DGEBA ratio and Tg

TEPIC® S - Test Data

Solubility of TEPIC-S

TEPIC has high crystallization, high melting point, and hard solubility.

TEPIC® S - Test Data - 1