HP series™ HM200

1 of 3 products in this brand
Pure high density polyethylene homopolymer polymer in finely sized rounded powder form. Avg. = ~140 micron, D100 = 250 micron.

Chemical Family: Polyethylenes

End Uses: Hot Melt Adhesive

Features: Chemical Resistance, Excellent Adhesion, Heat Resistance, Narrow Particle Size Distribution

Synonyms: Ethene polymer, Ethylene polymer, Evanite Submicro

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Knowde Enhanced TDS

Identification & Functionality

Chemical Family
Chemical Name
CASE Ingredients Functions
CAS No.
9002-88-4
EC No.
618-339-3
Technologies

Features & Benefits

Applications & Uses

Adhesive & Sealant Type

Properties

Physical Form

Regulatory & Compliance