Conductive Silver Spheres (CHS) are highly conductive, low density, spherical powders and particles with a dry bulk resistivity of .001 ohms/cm. Offering seamless electrical continuity of pure silver at a fraction of the cost and weight. The CHS additives are noticeably lighter than solid silver in paints, Composites and adhesive, while providing excellent conductivity, the low particle density of the CSGS and large surface area facilitates slow phase separation in paints and adhesives compared to heavy metallic and organic fillers. The CHS also works well when used as catalysts, laser fusion targets, and electrically conducting bond line spacers in advanced electronics and other applications. The CHS additives are engineered for high conductivity and shielding electromagnetic interference while improving the applications impact strength. The spheres can be customized from size to silver % to fit the application.

Chemical Family: Glass Beads & Fibers

Functions: Anti-Static Agent, Conductive Agent, Conductive Agent

Processing Methods: Injection Molding

Features: Conductive, Electrically Conductive, Electromagnetic Interference Shielding, Electromagnetic Shielding (EMI), Good Flow, High Surface Area, High Tensile Strength, Light Weight, Low Density

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Knowde Enhanced TDS

Identification & Functionality

Chemical Family
Chemical Name
CASE Ingredients Functions
Composite Materials Functions
Plastics & Elastomers Functions
CAS No.
7440-22-4
EC No.
231-131-3

Features & Benefits

CASE Ingredients Features
Benefits
  • Excellent conductivity
  • Easily mixed into paint systems
  • Spherical shape gives good flow in injection molding
  • Light in color, Very low density, high Crush strength

Applications & Uses

Plastics & Elastomers End Uses
Plastics & Elastomers Processing Methods
Applications
  • EMI shielding, Conductive paints and coatings.
  • mass-critical applications including light Aerospace , Conductive plastics & composites.
  • Z-axis electrical film & adhesives.
Other Applications
  • Conductive flooring, EMI/RFI Shielding, Electrically conductive polymers and Adhesives, Coatings, Sealants, Caulks Composites, Reinforced polymers,Cu, Ag, Ag, Pd electronic, Conductive films, Pastes, micro applications, Conductive /Shield Flooring, Anti-static carpet, Aerospace, polymers and Ceramic/metal joints, pastes, Ceramic/metal joints.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Crush Strength250psi
Densitiy0.07 - 0.09g/c³
Dry Bulk Resistivity0.01OHMS/CM
Particle Size Distribution
ValueUnitsTest Method / Conditions
D 108microns
D 5025microns
D 9050microns
Mean Particle Size27microns