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PELECTRON LMP-FS

PELECTRON LMP-FS is an excellent dispersibility into PE and heat-sealing property. Low resistivity which is achieved surface resistivity range to 10^8-9 ohm/sq. Low dosage minimally affects the mechanical properties and moldability

Brand: PELECTRON (4 products)

Functions: Anti-Static Agent

Compatible Polymers & Resins: Polyethylenes (PE), Polypropylenes (PP)

Processing Methods: Blown Film Extrusion, Dry Blending, Extrusion, Film Extrusion

Features: Anti-Static, Good Dispersibility, Good Retention of Properties, Heat Sealable, Low Melting Point, Reduced Surface Resistivity

Enhanced TDS

Knowde-enriched technical product data sheet

Identification & Functionality

Features & Benefits

Materials Features
Features
  • Excellent dispersibility into PE
  • Excellent Heat-sealing property
  • Low resistivity; Achieved surface resistivity range to 10^8-90/sq.
  • Low dosage; Minimally affects the mechanical properties and moldability

Applications & Uses

Properties

Physical Form
Appearance
Pale Yellow Pellet
Typical Properties
ValueUnitsTest Method / Conditions
Melt Flow Rate (at 190°C 374°F, 21.18 N)approx. 15g/10min-
Adapted Thermoplastic ResinsPE blown film PE, PP extrusion sheet--
Melting Pointapprox. 115°C-
Melt Flow Rate (190°C (374°F), 21.18 N)approx. 15g/10min-
Surface Resistivity (23°C 73°F, 50% R.H)3×10^6--
Thermal Degradation Temperatureapprox. 250°C-
Surface Resistivity (23℃ (73 °F), 50% R.H)3×10*6Ω/sq.-
Physical properties
Property (Units) Test Method Dosage (wt %)
LDPE
Blank
PELESTAT
LMP-FS
0 10 wt%
Surface resistivity*1 (Ω/sq.) ASTM D257 10^16 10^10
Tensil Strength*2 (MPa) ASTM D638 24 23
Fracture elongation (%) ASTM D638 530 480
Haze (%) JIS K 7105 7 14
Total light transmittance JIS K 7105 91 89

*1 : 23℃ (73 °F), 50% R.H

<Extrusion and film conditions>
Temp.:170℃ (338 °F), Filmthickness:100 μm

Technical Details & Test Data

LDPE BLOWN FILM EXTRUSION

 

                                                                             SANAM Corporation PELECTRON LMP-FS LDPE BLOWN FILM EXTRUSION - 1

<Matrix resin:>
LDPE① [MFR=0.3 g/10min]


<Extrusion and blown film conditions>
Temp.:170℃(338 °F) , Filmthickness:100 μm, Blow rate:2.0

SANAM Corporation PELECTRON LMP-FS LDPE BLOWN FILM EXTRUSION - 2

Improvement of Heat Sealability

SANAM Corporation PELECTRON LMP-FS Improvement of Heat Sealability

Contribution of
1. Low melting point
2. Dispersibility into PE

 

<Composition>
LDPE① /L-LDPE④ /PELECTRON LMP-FS (or PELESTAT230)/Metallocene PE⑤
=67/15/13/5 (wt%)


<Extrusion and blown film conditions>
Temp.:170℃(338 °F) , Filmthickness:100 μm, Blow rate:2.0


<Heat-sealing conditions>
Both sides, Time:1 sec, Pressure:98 kPa, Temp.:120℃(248 °F),

Dispersibility into LDPE (TEM image)

SANAM Corporation PELECTRON LMP-FS Dispersibility into LDPE (TEM image)<LDPE resin> LDPE① [MFR=0.3 g/10min]
<Kneading conditions> Temp.:170℃ (338 °F), time:5 min

Effect of MFR(LDPE) on Surface Resistivity

 

                                           SANAM Corporation PELECTRON LMP-FS Effect of MFR(LDPE) on Surface Resistivity

<Extrusion and blown film conditions>
Temp.:170℃ (338 °F), Filmthickness:100 μm, Blow rate:2.0

Effect of Die Temp on Surface Resistivity (blown film )

SANAM Corporation PELECTRON LMP-FS Effect of Die Temp on Surface Resistivity (blown film )

<Composition>
LDPE① /L-LDPE④ /PELECTRON LMP-FS=72/15/13(wt%)


<Extrusion and blown film conditions>
Temp.:160℃~180℃ , Filmthickness:100 μm, Blow rate:2.0

Effect of Blow rate on Surface Resistivity (Blown film)

SANAM Corporation PELECTRON LMP-FS Effect of Blow rate on Surface Resistivity (Blown film)

<Composition>
LDPE① /L-LDPE④ /PELECTRON LMP-FS
=72/15/13(wt%)
<Extrusion and blown film conditions>
Temp.:170℃ (338 °F), Filmthickness:100 μm, Blow rate:2.0

LDPE Sheet Extrusion

SANAM Corporation PELECTRON LMP-FS LDPE Sheet Extrusion

                                                                      Dosage (wt%)

<Matrix resin:>
LDPE③ [MFR=2.0 g/10min


<Extrusion condition>
Temp.:170℃(338 °F)

Temperature dependence on heat-sealing Strength

SANAM Corporation PELECTRON LMP-FS Temperature dependence on heat-sealing Strength

<Composition>
LDPE①/L-LDPE④/PELECTRON LMP-FS/Metallocene PE⑤=67 /15 /13/5 (wt%)


<Extrusion and blown film conditions>
Temp.:170℃(338 °F) , Filmthickness:100 μm, Blow rate:2.0


<Heat-sealing conditions>
Both sides, Time:1 sec, Pressure:98 kPa

Polyethylene Resin used in the Evaluation
PE resin Supplier Grade MFR [190℃(374 °F) ,21.18 N]
LDPE① Japan Polyethylene Co. LF128 0.3
LDPE② UBE-MARUZEN POLYETHYLENE  Co. F022 0.7
LDPE③ UBE-MARUZEN POLYETHYLENE Co. F222 2.0
L-LDPE④ Sumitomo Chemical Co. FX CX4002 8.0
Metallocene PE Japan Polyethylene Co. KERNEL  KS340T 3.5
Correlation with Static Decay Time and Surface Resistivity

SANAM Corporation PELECTRON LMP-FS Correlation with Static Decay Time and Surface Resistivity

Hygroscopic Properties of PELECTRON LMP-FS

SANAM Corporation PELECTRON LMP-FS Hygroscopic Properties of PELECTRON LMP-FS

<Example of drying conditions >
Drying under reduced pressure
Vacuum : Below 1,300 Pa (0.2 psi)
Temperature : 70 – 80 ℃ (158 – 176 °F)
Duration : 2 – 3 hours

Hot-air drying
Temperature: 85 – 95 ℃ (185 – 203 °F)
Duration: 4 – 6 hours

LDPE Blown Film Extrusion (multi-layer)

Multi-layer film can reduce total amount of PELECTRON compared to single-layer film.

SANAM Corporation PELECTRON LMP-FS LDPE Blown Film Extrusion (multi-layer) - 1

                                Figure 1: schematic view of multi-layer film

SANAM Corporation PELECTRON LMP-FS LDPE Blown Film Extrusion (multi-layer) - 2

                                          PELECTRON LMP-FS dosage in surface layer (wt%)

 

SANAM Corporation PELECTRON LMP-FS LDPE Blown Film Extrusion (multi-layer) - 3

       Figure 2:forming method of multi-layer film