PELECTRON LMP-FS

1 of 4 products in this brand
PELECTRON LMP-FS is an excellent dispersibility into PE and heat-sealing property. Low resistivity which is achieved surface resistivity range to 10^8-9 ohm/sq. Low dosage minimally affects the mechanical properties and moldability

Functions: Anti-Static Agent

Compatible Polymers & Resins: Polyethylenes (PE), Polypropylenes (PP)

Processing Methods: Blown Film Extrusion, Dry Blending, Extrusion, Film Extrusion

Features: Anti-Static, Good Dispersibility, Good Retention of Properties, Heat Sealable, Low Melting Point, Reduced Surface Resistivity

    Knowde Enhanced TDS

    Identification & Functionality

    Plastics & Elastomers Functions

    Features & Benefits

    Features
    • Excellent dispersibility into PE
    • Excellent Heat-sealing property
    • Low resistivity; Achieved surface resistivity range to 10^8-90/sq.
    • Low dosage; Minimally affects the mechanical properties and moldability

    Applications & Uses

    Compatible Polymers & Resins
    Plastics & Elastomers End Uses
    Plastics & Elastomers Processing Methods

    Properties

    Physical Form
    Appearance
    Pale Yellow Pellet
    Typical Properties
    ValueUnitsTest Method / Conditions
    Melt Flow Rate (at 190°C 374°F, 21.18 N)approx. 15g/10min
    Adapted Thermoplastic ResinsPE blown film PE, PP extrusion sheet
    Melting Pointapprox. 115°C
    Melt Flow Rate (190°C (374°F), 21.18 N)approx. 15g/10min
    Surface Resistivity (23°C 73°F, 50% R.H)3×10^6
    Thermal Degradation Temperatureapprox. 250°C
    Surface Resistivity (23℃ (73 °F), 50% R.H)3×10*6Ω/sq.
    Physical properties
    Property (Units) Test Method Dosage (wt %)
    LDPE
    Blank
    PELESTAT
    LMP-FS
    0 10 wt%
    Surface resistivity*1 (Ω/sq.) ASTM D257 10^16 10^10
    Tensil Strength*2 (MPa) ASTM D638 24 23
    Fracture elongation (%) ASTM D638 530 480
    Haze (%) JIS K 7105 7 14
    Total light transmittance JIS K 7105 91 89

    *1 : 23℃ (73 °F), 50% R.H

    <Extrusion and film conditions>
    Temp.:170℃ (338 °F), Filmthickness:100 μm

    Technical Details & Test Data

    LDPE BLOWN FILM EXTRUSION

     

                                                                                 SANAM Corporation PELECTRON LMP-FS LDPE BLOWN FILM EXTRUSION - 1

    <Matrix resin:>
    LDPE① [MFR=0.3 g/10min]


    <Extrusion and blown film conditions>
    Temp.:170℃(338 °F) , Filmthickness:100 μm, Blow rate:2.0

    SANAM Corporation PELECTRON LMP-FS LDPE BLOWN FILM EXTRUSION - 2

    Improvement of Heat Sealability

    SANAM Corporation PELECTRON LMP-FS Improvement of Heat Sealability

    Contribution of
    1. Low melting point
    2. Dispersibility into PE

     

    <Composition>
    LDPE① /L-LDPE④ /PELECTRON LMP-FS (or PELESTAT230)/Metallocene PE⑤
    =67/15/13/5 (wt%)


    <Extrusion and blown film conditions>
    Temp.:170℃(338 °F) , Filmthickness:100 μm, Blow rate:2.0


    <Heat-sealing conditions>
    Both sides, Time:1 sec, Pressure:98 kPa, Temp.:120℃(248 °F),

    Dispersibility into LDPE (TEM image)

    SANAM Corporation PELECTRON LMP-FS Dispersibility into LDPE (TEM image)<LDPE resin> LDPE① [MFR=0.3 g/10min]
    <Kneading conditions> Temp.:170℃ (338 °F), time:5 min

    Effect of MFR(LDPE) on Surface Resistivity

     

                                               SANAM Corporation PELECTRON LMP-FS Effect of MFR(LDPE) on Surface Resistivity

    <Extrusion and blown film conditions>
    Temp.:170℃ (338 °F), Filmthickness:100 μm, Blow rate:2.0

    Effect of Die Temp on Surface Resistivity (blown film )

    SANAM Corporation PELECTRON LMP-FS Effect of Die Temp on Surface Resistivity (blown film )

    <Composition>
    LDPE① /L-LDPE④ /PELECTRON LMP-FS=72/15/13(wt%)


    <Extrusion and blown film conditions>
    Temp.:160℃~180℃ , Filmthickness:100 μm, Blow rate:2.0

    Effect of Blow rate on Surface Resistivity (Blown film)

    SANAM Corporation PELECTRON LMP-FS Effect of Blow rate on Surface Resistivity (Blown film)

    <Composition>
    LDPE① /L-LDPE④ /PELECTRON LMP-FS
    =72/15/13(wt%)
    <Extrusion and blown film conditions>
    Temp.:170℃ (338 °F), Filmthickness:100 μm, Blow rate:2.0

    LDPE Sheet Extrusion

    SANAM Corporation PELECTRON LMP-FS LDPE Sheet Extrusion

                                                                          Dosage (wt%)

    <Matrix resin:>
    LDPE③ [MFR=2.0 g/10min


    <Extrusion condition>
    Temp.:170℃(338 °F)

    Temperature dependence on heat-sealing Strength

    SANAM Corporation PELECTRON LMP-FS Temperature dependence on heat-sealing Strength

    <Composition>
    LDPE①/L-LDPE④/PELECTRON LMP-FS/Metallocene PE⑤=67 /15 /13/5 (wt%)


    <Extrusion and blown film conditions>
    Temp.:170℃(338 °F) , Filmthickness:100 μm, Blow rate:2.0


    <Heat-sealing conditions>
    Both sides, Time:1 sec, Pressure:98 kPa

    Polyethylene Resin used in the Evaluation
    PE resin Supplier Grade MFR [190℃(374 °F) ,21.18 N]
    LDPE① Japan Polyethylene Co. LF128 0.3
    LDPE② UBE-MARUZEN POLYETHYLENE  Co. F022 0.7
    LDPE③ UBE-MARUZEN POLYETHYLENE Co. F222 2.0
    L-LDPE④ Sumitomo Chemical Co. FX CX4002 8.0
    Metallocene PE Japan Polyethylene Co. KERNEL  KS340T 3.5
    Correlation with Static Decay Time and Surface Resistivity

    SANAM Corporation PELECTRON LMP-FS Correlation with Static Decay Time and Surface Resistivity

    Hygroscopic Properties of PELECTRON LMP-FS

    SANAM Corporation PELECTRON LMP-FS Hygroscopic Properties of PELECTRON LMP-FS

    <Example of drying conditions >
    Drying under reduced pressure
    Vacuum : Below 1,300 Pa (0.2 psi)
    Temperature : 70 – 80 ℃ (158 – 176 °F)
    Duration : 2 – 3 hours

    Hot-air drying
    Temperature: 85 – 95 ℃ (185 – 203 °F)
    Duration: 4 – 6 hours

    LDPE Blown Film Extrusion (multi-layer)

    Multi-layer film can reduce total amount of PELECTRON compared to single-layer film.

    SANAM Corporation PELECTRON LMP-FS LDPE Blown Film Extrusion (multi-layer) - 1

                                    Figure 1: schematic view of multi-layer film

    SANAM Corporation PELECTRON LMP-FS LDPE Blown Film Extrusion (multi-layer) - 2

                                              PELECTRON LMP-FS dosage in surface layer (wt%)

     

    SANAM Corporation PELECTRON LMP-FS LDPE Blown Film Extrusion (multi-layer) - 3

           Figure 2:forming method of multi-layer film