Toray MicroPly™ TCF4045

1 of 21 products in this brand
Toray Toray MicroPly™ TCF4045 is a low dielectric, low density epoxy syntactic film. The material displays both good mechanical and dielectric properties. Toray MicroPly™ TCF4045’s base resin chemistry features low moisture absorption with good high temperature properties. 177°C (350°F) Cure, Low Dielectric Epoxy Syntactic Film.

Functions: Core Material

Core Type: Thermoset Foam

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet

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Identification & Functionality

Composite Materials Functions
Product Type
  • Product Configuration Film Thickness ~ 1.91 mm (75 mils) (Other thicknesses may be available upon request)
  • Sheet Size 30.5 cm x 61 cm (12”x 24”)

Features & Benefits

Product Highlights
  • Good high temperature properties
  • Lightweight core fill
  • Good dielectric properties

Applications & Uses

Composites Processing Methods
Recommended Applications
  • Aerostructures
  • Radome
  • Radomes and antennae core fill
  • Lightweight core fil
  • Good dielectric properties

Properties

Thermal Properties
ValueUnitsTest Method / Conditions
Dry Tg180 (356)°C (°F)
Wet Tg166 (331)°C (°F)
Typical Properties
ValueUnitsTest Method / Conditions
Density0.61 (38)g/cc (pcf)
Dielectric Constant at 10 GHz1.57ASTM D 2520
Loss Tangent at 10 GHz0.0078ASTM D 2520

Storage & Handling

Shelf Life
  • Out Life: 14 days out life ≤ 21°C (70°F) and ≤ 60% RH
  • Frozen Storage Life: 6 months at ≤-18°C (≤ 0°F)

Out life is the maximum time allowed at 21°C (70°F) or below and 60% or less RH before cure, after a single frozen storage cycle in the original unopened packaging at -18°C (0°F) or below for a period not exceeding the frozen storage life noted above.