Knowde Enhanced TDS
Identification & Functionality
- Polymer Name
- Composite Materials Functions
- Technologies
Features & Benefits
- Materials Features
- Product Highlights
- Low stress-free cure temperature capable
- Low temperature cure for low stress-free part stability
- Passes and exceeds space requirements for outgassing
- Low CTE and CME
- Extremely low moisture absorption.
- Resin is asymptotic after 200 days with less than 0.35% moisture absorption in a 75% RH environment
- Good dielectric and loss tangent
Applications & Uses
- Markets
- Composites Processing Methods
- Recommended Applications
- Space & Satellite
- Optical benches
- Reflectors
- High dimensional stability space structures
- Ideal for radomes and radar transparent structures
Properties
- Physical Form
- Typical Properties
- Thermal Properties
Value | Units | Test Method / Conditions | |
Density | 1.16 | g/cc | — |
Density after 177°C (350°F) Post cure | 1.14 | g/cc | — |
Dimensional Stability CME | 1205 | μin/in/% | — |
Dimensional Stability CTE | 32.475 | in/in/°F | — |
Moisture Absorption after 313 days at 71°C (160°F), 85% RH | 1.7 | % | — |
Outgassing (CVCM) | max. 0.01 | % | ASTM E595 |
Outgassing (TML) | 0.29 | % | ASTM E595 |
Outgassing (TML-WVR) | 0.12 | % | ASTM E595 |
Outgassing (WVR) | 0.17 | % | ASTM E595 |
Value | Units | Test Method / Conditions | |
Dry Tg by DMA cured at 127°C (260°F) | 112 (234) | °C (°F) | — |
Dry Tg by DMA post cured at 177°C (350°F) for 2 hours | 181 (358) | °C (°F) | — |
Wet Tg by DMA cured at 127°C (260°F) conditioned at 71°C (160°F), 85% RH for 21 days | 123 (253) | °C (°F) | — |
Wet Tg by DMA post cured at 177°C (350°F) for 2 hours conditioned at 71°C (160°F), 85% RH for 21 days | 176 (349) | °C (°F) | — |
Storage & Handling
- Shelf Life
- Out Life: Up to 7 days at ambient
- Frozen Storage Life: 6 months at -18°C (< 0°F)
Out life is the maximum time allowed at ambient temperature before cure. *Ambient is 18–22°C (65–72°F).