Products

Toray Toray MicroPly™ TCF4045 is a low dielectric, low density epoxy syntactic film. The material displays both good mechanical and dielectric properties. Toray MicroPly™ TCF4045’s base resin chemistry features low moisture absorption with good high temperature properties. 177°C (350°F) Cure, Low Dielectric Epoxy Syntactic Film.

Toray Toray MicroPly™ ES72A-2 is a 125°C (257°F) curing low-density, expanding, unsupported, epoxy syntactic core. ES72A-2 offers reduced processing, a one-shot cure, the ability to anchor inserts or fastenings, and increases the opportunity to consider lightweight, thin-walled composite sandwich structures. ES72A-2 can be easily contoured and shaped. Toray MicroPly™ ES72A-2 expands using a closed cell process ensuring complete homogeneous cell structure, the density/strength may be altered simply by changing cure pressure or limiting the volume available for expansion, the material is capable of expanding up to 650%. Toray MicroPly™ ES72A-2, formerly Amspand, is available in a variety of thicknesses down to 1 mm, and is supplied in sheets (625 mm x 400 mm).

Toray Toray AmberTool® HX42 is a low temperature curing epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 190°C (374°F) is achieved. Toray AmberTool® HX42 is an exceptional and very well proven system that exhibits a high end use temperature and extended out life. 50–75°C (122–167°F) Low Temperature Curing Epoxy Tooling Prepreg.

Toray BT250E-1 resin system is a 121°C (250°F) cure epoxy prepreg system with excellent toughness and strength. It provides an outstanding surface finish under vacuum-bag/oven-cure only. The resin system, which is self-adhesive to honeycomb and foam core, is MIL-R-9300 qualified and makes a great choice for many Applicationss in the low-tomedium-service temperature range.

Toray Toray MicroPly™ TCF4035 is a syntactic film compatible with 121°C (250°F) epoxy prepregs. It features a 30-day out time and is offered in a density of approximately 0.6 g/cc (40 ± 4 pounds per cubic foot). It features a higher service temperature than Toray TCF4025. Syntactic Epoxy Film.

Toray RS-50 is a toughened low viscosity epoxy RTM resin. It features a long 4-hour pot life and a low minimum viscosity for excellent RTM and VARTM processing. It can also be used in wet winding Applicationss. 177°C (350°F) Curing Epoxy RTM Resin

Toray RS-36 is an advanced modified epoxy system for structural composite Applicationss. RS-36 offers an excellent balance of mechanical properties, low moisture absorption, high glass transition temperatures, and a range of processing options. A higher Tg version, RS-36-1, with similar mechanical properties, is available. 177°C (350°F) Cure Epoxy Resin System

Toray E745 is a 135°C (275°F) cure toughened epoxy component prepreg. E745 has been developed for impact structures and other mechanically demanding structural Applicationss. E745 can be impregnated into a range of fiber and fabric types. 135°C (275°F) Cure Mid Temperature Curing Toughened Epoxy Component Prepreg.

Toray Toray AmberTool® HX50 is a low temperature curing epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 180°C (356°F) is achieved. Toray AmberTool® HX50 achieves an excellent surface finish for small to medium sized autoclave tooling. 40–55°C (104–131°F) Low Temperature Curing Epoxy Tooling Prepreg.

Toray’s TC250 offers an excellent balance of toughness, mechanical properties, and hot/wet performance. It is easily processed via vacuum bag/oven, autoclave, or press curing operations. Although TC250 is a 130°C (265°F) cure system, it can be post cured for a higher dry and wet Tg, which enhance the product’s elevated temperature performance. TC250 can also be cured or freestanding post cured to 177°C (350°F) to increase its high temperature performance. TC250 is available with virtually all fiber reinforcements in uni-directional tape, slit unidirectional tape, woven, and non-woven prepreg forms. 130°C (265°F) Cure, Toughened Epoxy Resin System

Toray Toray AmberTool® HX32-1 New is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 140°C (284°F) is achieved. Toray AmberTool® HX32-1 prepreg is ideal for large tooling Applicationss. 65–80°C (149–176°F) Curing Epoxy Tooling Prepreg.

Toray Toray Microply™ TC235SF-1 is a composite surfacing film designed to provide paintable composite surfaces off of the tool. It may be cured under vacuum-only pressure or under low autoclave pressure. The surfacing properties of Toray MicroPly™ TC235SF-1 allow smooth, paintable surfaces, even with thin-skinned honeycomb-stiffened composite structure. Epoxy Surfacing System 121°C–177°F (250°F–350°F).

Toray Toray MicroPly™ SC72A is a 120°C (248°F) curing low-density unsupported epoxy syntactic core. Toray MicroPly™ SC72A offers reduced processing, a one-shot cure, the ability to anchor inserts or fastenings, and increases the opportunity to consider lightweight, thin-walled composite sandwich structures. Considerable cost reductions can be realized when SC72A replaces prepreg as the core material, and where sandwich cores below 3 mm are difficult to achieve in honeycomb core, Toray MicroPly™ is a superior alternative. Toray MicroPly™ SC72A is available in a variety of thicknesses down to 1 mm and is easily contoured and shaped. SC72A is supplied on a roll (15 m x 400 mm) or in sheets (625 mm x 400 mm). Toray MicroPly™ SC72A is compatible for co-cure with Toray E720 and E722 mid temperature curing prepregs.

Toray BT250E-6 resin system is a 121°C (250°F) cure epoxy prepreg with excellent strength and stiffness. It provides an outstanding surface finish under vacuum bag/oven cure. BT250E-6 has an FAA-conformed database on carbon IM-7 uni-directional tape, S2-glass, and AS-4C plain weave.

Toray E750 is a toughened epoxy component prepreg developed for structural Applicationss within Formula 1 and high performance automotive. Toray E750 allows curing from 80°C (176°F) to 180°C (356°F) and can be impregnated into a range of fiber and fabric types.

Toray MS-1A is a high performance carbon fiber/epoxy resin compression molding system based on high-modulus carbon fiber. MS-1A compression molding compound yields unparalleled stiffness and high strength. MS-1A is qualified for space Applicationss. 138°C (280°F) Cure High-Modulus Compression Molding System

Toray E731 is a toughened epoxy resin system designed to deliver enhanced resin clarity for cosmetic components within high performance automotive. The resin formulation ensures that components are free from white-spots and exhibit high clarity.

Toray TC346 is a high temperature epoxy component prepreg developed for structural Applicationss within Formula 1 and high performance automotive. Toray TC346 is designed to deliver enhanced compression properties to manufactured parts while maintaining a good fracture toughness. When exposed to elevated temperature environments, TC346 composites demonstrate excellent retention of mechanical performance.

Toray E721-FR is a modified epoxy resin system of medium viscosity for cures at 120°C (248°F), pre-impregnated into high performance fibers such as carbon, glass, and aramid. Toray E721-FR offers excellent structural properties, flame retardancy, and exceptional toughness allowing direct lamination to honeycomb without the use of resin film. Toray E721-FR is designed for structural Applicationss in the motor racing, marine industries, and for a wide range of engineering Applicationss. If fire-retardant properties are not required, consult separate data sheet for Toray E720.

Toray TC380 sets a new benchmark for toughened epoxy prepreg systems. TC380 is extremely tough with an excellent balance of OHC, OHT, CAI, and GIC/GIIC properties. It features low moisture absorption with outstanding hot/wet mechanical properties to 121°C (250°F). TC380 is optimized for out-of-autoclave/vacuum bag only (OOA/VBO) cures, facilitating construction of large or complex composite parts and assemblies. Unlike some other highly toughened systems, there is no need to sequence the prepreg front and back face, assuring robustness and simplifying lay-up. TC380 out life are 21 and 28 days, respectively. 180°C (356°F) Cure, Toughened Epoxy Resin System

Toray Toray AmberTool® HX56 is a low temperature curing epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 180°C (356°F) is achieved. Toray AmberTool® HX56 achieves an excellent surface finish for small to medium sized autoclave tooling.

Toray E722 is a 120°C (248°F) cure toughened epoxy component prepreg. E722 is designed for structural Applicationss in the motorsport and marine industries. Toray E722 would also suit general aircraft fittings, sporting equipment, and a wide range of engineering Applicationss. Toray E722 is compatible for co-cure with Toray MicroPly™ EF72, a 120°C (248°F) cure resin film, and Toray MicroPly™ SC72A syntactic core. 120°C (248°F) Cure Toughened Epoxy Resin System

Toray TC275-1 is a dual-cure toughened epoxy prepreg designed to facilitate composite part construction with low pressure or vacuum pressure cures. The resin system features a 14-day tack life and 14-day total out time to allow the construction of thick or larger composite structure. TC275-1 may be cured at a lower temperature of 135°C (275°F) or can be cured at 177°C (350°F) for higher temperature service. 135–177°C (275–350°F) Cure Toughened Epoxy Resin System

Toray MS-4H is a 25.4 mm (1”) carbon fiber/epoxy resin compression molding system using high strength standardmodulus (HS) carbon fiber. MS-4H is an excellent low-cost, high performance molding compound that has been qualified to military and commercial Applicationss. It has excellent out time stability and processes very well in medium-to-large heavy parts. 138°C (280°F) Fast Cure Standard-Modulus Compression Molding System

Toray Toray MicroPly™ SC8020A is a low-density unsupported epoxy syntactic core. The material has been developed to offer a long out life and flexible cure schedules at 70°C to 130°C (158°F–266°F). Toray MicroPly™ SC8020A offers reduced processing, a one-shot cure, the ability to anchor inserts or fastenings, and increases the opportunity to consider lightweight, thin walled composite sandwich structures. Considerable cost reductions can be realized when SC8020A replaces prepreg as the core material, and where sandwich cores below 3 mm are difficult to achieve in honeycomb core, Toray MicroPly™ is a superior alternative. Toray MicroPly™ SC8020A is available in a variety of thicknesses down to 1 mm, is easily contoured and shaped. SC8020A is supplied on a roll (15 m x 400 mm) or in sheets (625 mm x 400 mm). Toray MicroPly™ SC8020A is compatible for co-cure with Toray’s E720, E722, and 8020 prepregs.

Toray MS-1H is a carbon fiber/epoxy resin compression molding system using a high-modulus PAN carbon fiber. This is an excellent high stiffness molding compound that has been qualified to military and commercial Applicationss. It has excellent out time stability and processes very well in small and thin cross-section parts. It is the performance alternative to MS-4H 25.4 mm (1”) molding compound. MS-1H is offered with 25.4 mm (1”) carbon fibers, or for smaller parts, a 12.7 mm (1/2”) fiber version is available. 138°C (280°F) Fast Cure Intermediate-Modulus Compression Molding System

Toray RS-17B is a modified epoxy resin that delivers extremely low moisture absorption while providing excellent mechanical properties, toughness, and modulus. RS-17B is a flexible cure system that may be cured from 135°C to 177°C (275°F to 350°F). RS-17B has a long spaceflight heritage. 135°C–177°C (275°F–350°F) Cure Epoxy.

Toray TC350-1 is a toughened matrix for structural advanced composite Applicationss. TC350-1 offers an excellent balance of toughness, mechanical property translation, and hot/wet performance. It is easily processed via out-ofautoclave or press curing operations. TC350-1 develops a 191°C (376°F) Tg after a 177°C (350°F) cure, which coupled with low moisture absorption translates into excellent hot/wet performance. TC350-1 is available with virtually all fiber reinforcements in uni-directional tape, slit uni-directional tape, woven, and non-woven prepreg formats. 177°C (350°F) Cure, Toughened Epoxy Prepreg.

Toray TC264-1 is a flame-retardant epoxy prepreg that has been developed for oven cure composite fabrication processes utilizing either expendable or reusable lay-up mandrels. This epoxy-based prepreg system is ideal for use in Applicationss where flame retardency is needed such as air management system ducting, decorative enclosures, and fire-retardent composite panel assemblies. 127°C (260°F) Cure, Fire Retardant Epoxy Prepreg

Toray RS-1 is an epoxy prepreg resin that provides an excellent balance of mechanical properties, toughness, and modulus. RS-1 has been evaluated and qualified in areas ranging from marine to aerospace and dielectric structures. RS-1 is also available in a lower temperature curing formulation 80°C (176°F).

Toray E726 is a toughened epoxy resin system with controlled flow for cures at 120°C (248°F), pre-impregnated into high performance fibers such as carbon, glass and aramid. It is designed for use within medical and industrial Applicationss and would also suit a wide range of engineering Applicationss. Toray E726 is compatible for co-cure with Toray EF72, a 120°C (248°F) cure resin film and Toray MicroPly™ SC72A syntactic core.

Toray 8020 is a new generation of toughened epoxy resin systems offering a balance of mechanical properties and excellent surface finish. The resin system has been developed to offer a long out life and flexible cure schedules and can be applied to a wide range of high performance fibers. Toray 8020 is compatible for co-cure with Toray’s resin film, Toray 8020, and Toray’s syntactic core, Toray MicroPly™ SC8020A.

Toray E732 is a snap cure toughened epoxy resin matrix optimized for press curing (compression molding) prepreg Applicationss. With a cure time of 4 minutes at 160°C (320°F), an onset Tg of 170°C (338°F) is achieved. At this higher temperature, medium-to-high production rates can be accomplished, with customers able to produce beyond 50,000 parts per year. Toray E732 is a versatile matrix with a range of processing options allowing a variety of automotive and industrial Applicationss to be realized.

8020 Rapi-Ply is a Outstanding vacuum-bag-only (out-of-autoclave) processing capability. No debulking required off Bi-layer form facilitates fast lay-up

TC275-1E is an extended out time version of the TC275-1 resin system. TC275-1E is a flexible cure toughened epoxy prepreg designed to enable composite part construction with low pressure or vacuum bag only (VBO) cures. The resin system provides a 28-day total out time to facilitate construction of thick or larger composite structures. TC275-1E may be cured at temperatures from 135°C (275°F) to 177°C (350°F) for higher temperature service. 135–177°C (275–350°F) Cure Toughened Epoxy Resin System

Toray E720 is a 120°C (248°F) cure toughened epoxy prepreg. E720 offers excellent adhesive properties, allowing direct lamination to honeycomb without the use of a film adhesive. E720 is designed for structural Applicationss in motorsport and marine industries. E720 would also suit general aircraft fittings, sporting equipment, and a wide range of engineering Applicationss. Toray E720 is compatible for co-cure with Toray’s 120°C (248°F) cure resin film MicroPly™ EF72 and syntactic core Toray MicroPly™ SC72A. If fire retardant properties are required, refer to Toray E721-FR. 120°C (248°F) Cure Toughened Epoxy Resin System