Products in Electronics Adhesives: Enamel

Dianhydrides & Imides BISDA (4,4-bisphenol A dianhydride, dianhydrides of BPA) are flakes that can serve as a comonomer in polyimide synthesis or as an anhydride curing agent in epoxy applications. When utilized as an epoxy curative, it can enhance thermal performance compared to monoanhydrides and aromatic amine curing agents. Its application areas include electronics encapsulation, composites, and adhesives. Dianhydrides & Imides BISDA-derived polyimide varnishes, coatings, adhesives, films, and wire enamels offer desired solubility and stability in organic solvents even after complete imidization, heat resistance, flexibility/softness, dimensional stability, and adhesion properties for the ever-increasing design complexity of electronic devices. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Sunspheres™ 200 Nm are optically clear, solid fused amorphous microspheres designed for use in a wide variety of coatings, inks, adhesives, powder coatings, and thermoplastics, including UV curable compositions. These sub-micron sized spheres can be used to improve physical and mechanical properties including reduced shrinkage, improved adhesion, impact resistance, and enhanced surface qualities such as hardness, mar and scratch resistance. The average particle size is 200 nanometers and range in size from about 50 nm to 500 nm.