Products in Electronics Adhesives: Varnishes

Dianhydrides & Imides BISDA (4,4-bisphenol A dianhydride, dianhydrides of BPA) are flakes that can serve as a comonomer in polyimide synthesis or as an anhydride curing agent in epoxy applications. When utilized as an epoxy curative, it can enhance thermal performance compared to monoanhydrides and aromatic amine curing agents. Its application areas include electronics encapsulation, composites, and adhesives. Dianhydrides & Imides BISDA-derived polyimide varnishes, coatings, adhesives, films, and wire enamels offer desired solubility and stability in organic solvents even after complete imidization, heat resistance, flexibility/softness, dimensional stability, and adhesion properties for the ever-increasing design complexity of electronic devices. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Omnirad 127 D is a highly efficient Type I Photoinitiator that may be used to initiate the photo polymerization of unsaturated pre-polymers like acrylates – in combination with mono- or multifunctional monomers. Omnirad 127 D is especially suitable for all types of pigmented UV inks (offset, screen, flexo and inkjet) and clear coatings, particularly in thin coatings (such as overprint varnishes) but also in a variety of coating applications.