Products in Other Industrial & Assembly Applications: Enamel

Sunspheres™ 200 Nm are optically clear, solid fused amorphous microspheres designed for use in a wide variety of coatings, inks, adhesives, powder coatings, and thermoplastics, including UV curable compositions. These sub-micron sized spheres can be used to improve physical and mechanical properties including reduced shrinkage, improved adhesion, impact resistance, and enhanced surface qualities such as hardness, mar and scratch resistance. The average particle size is 200 nanometers and range in size from about 50 nm to 500 nm.

POLYTONE™ AP 108 is a heat reactive alkyl phenolic resin formulated for use in the manufacture of contact adhesives / cements based on polychloroprene or other elastomers.

POLYTONE™ AP 109 is a heat reactive alkyl phenolic resin formulated for use in the manufacture of contact adhesives / cements based on polychloroprene or other elastomers.

POLYTONE™ AP 111 is a heat reactive alkyl Phenolic resin formulated for use in Neoprene rubber adhesives. It imparts low initial viscosity and viscosity stability to adhesives of this type.

POLYTONE™ AP 110 is a heat reactive alkyl phenolic resin formulated for use in the manufacture of contact adhesives / cements based on polychloroprene or other elastomers.

POLYTONE™ AP 112 is a heat reactive alkyl phenolic resin formulated for use in Neoprene rubber adhesives. It imparts low initial viscosity and viscosity stability to adhesives of this type.

POLYTONE™ AP 114 is a heat reactive alkyl Phenolic resin formulated for use in Neoprene rubber adhesives. It imparts low initial viscosity and viscosity stability to adhesives of this type