Products in Transportation: Polyimides (PI)

P25N consist of a polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Renegade Materials Corporation RM-3002-CF Bismaleimide (BMI) prepreg product line includes Autoclave, Press and Out-of-Autoclave (vacuum bag only) processable BMI’s. Renegade Materials offers compatible BMI Film and Paste Adhesives, as well as BMI Infusion Resins for RTM/VaRTM processing. All of these products are formulated using next generation formulating technologies and a global supply chain. Renegade Materials' BMI's outperform the competition and exceed industry standards for quality, availability and price. It is a BMI Press Cure Prepreg.

Toray TC890 high temperature polyimide prepreg system utilizes PROOF Research Advanced Composites Division 900HT resin system. TC890 is a high temperature, polyimide-based thermoset prepreg with outstanding dry property retention at 343°C (650°F), wet service property retention at 288°C (550°F), and short-term and intermittent service temperature capability to 427°C (800°F). TC890 has been successfully demonstrated in short term, transient heating Applicationss to temperatures as high as 1300°F. TC890 is an excellent non-MDA replacement for high temperature PMR-15 Applicationss. TC890 prepreg system is easily processable and thermally stable, exhibiting the highest glass transition temperature of commercially available structural matrices. This system displays exceptional toughness, excellent dielectric properties, and low toxicity. High Temperature Polyimide

HTC™ 9510 is an E-Glass Fiber reinforced Bismaleimide (BMI) ESC® molding compound. It exhibits outstanding elevated temperature characteristics providing greatly extended service temperature range versus epoxy compounds for compression molding applications.

HexPly® F655™ is a bismaleimide resin that cures via an addition reaction in a toughened two-phase thermoset matrix with no condensation by-products. HexPly® F655™ is a controlled flow polyimide resin system designed for alternative processing capabilities such as co-curing over honeycomb core, compression molding, as well as standard autoclave processing.

P95/P25 consist of an HB flammability rated polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

SKYBOND® 875 is a polymide precursor which is 2 stage cured.

35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.

Comco PLAVIS S has best physical properties at high temperatures, with a continuous operating temperature of 350°C. Modification: non-filled.

33N is a flame retardant (UL94 V-O) polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance. High Tg (250°C) results in low overall z-axis expansion, and minimizes risk of latent PTH defects in-service.

AX-3611 is a MDA-free Condensation Polyimide Fiberglass Prepreg.

Champion Tape S1406 masks printed circuit boards during the wave solder or solder dip process.

Solver Polyimide Polyimide Resin Composite 15% Graphite can be used for aircraft, aviation, automobile, office equipment, electrical and electronic equipment, scientific instrument, industrial machinery production equipment, and so on. The polyimide is fit for the application surroundings which can be temperature resisting, sealed, dimensional stability, deformation without fracture, such as sealing ring, thrust washer, sliding bearing, vacuum pump vane, valve seat, gear and so on.

Champion Tape S1410 is a 2 mil heavy-duty polyimide tape which performs well at high temperatures.

VTEC™ GF63 is a High temperature resistance and it is Superior mechanical properties

VTEC™ BG21 is a High temperature resistance and it is Superior mechanical properties

SKYBOND® 705 is a heat reactive aromatic resin which can be thermally cured to a crosslinked polyimide with high heat resistance. It has good film forming properties and it is designed for coating applications where extended high temperature exposure is required.

SKYBOND® 701 is a solution of aromatic polyimide precursor in ethanol and methanol.

Tubus Bauer GmbH PEI 4,0-144C is a tubus core made with Polyetherimide.

SKYBOND® 703 is a heat reactive aromatic resin which can be thermally cured to a crosslinked polyimide. It is specifically designed for structual, and specialty applications where extended high temperature exposure is required. It represents an excellent balance of processing advantages and high thermal stability .Excellent strength retention is maintained up to temperatures of 650° F.

Maverick Corporation AFR-PE-4 is a high-temperature thermosetting polyimide resin with service capability up to 343°C (260°C wet). Developed by the Air Force and commercialized by Maverick, it is intended for use in the highest temperature applications for structural composites. AFR-PE-4 does not contain the toxic diamine 4,4’-methylenedianiline (MDA) or any other mutagenic or carcinogenic components. Although it is most suited for autoclave processing, its chemistry also allows for the use of compression molding. AFR-PE-4 is available as a PMR-type resin solution from Maverick Corporation, or as a prepreg from Renegade Materials Corporation.

SKYBOND® 700 is a heat reactive aromatic resin which can be thermally cured to a crosslinked polyimide. It is specifically designed for structural and specially applications where extended exposure at temperatures up to 700° F is required.

Conductive Black CP1™ Polyimide Lower RF loss than other black and conductive black polyimides NeXolve’s Conductive Black CP1™ Polyimide is filled with carbon nanoparticles to produce a conductive black polyimide material with lower RF loss than other black and conductive black polyimides. Conductive Black CP1™ Polyimide exhibits very high optical density (>4) and light blocking. It is useful in applications requiring static dissipation, as it exhibits ESD-level surface resistivity. Conductive Black CP1™ Polyimide also exhibits high emissivity, surpassing 0.80 at 1 mil thickness. This material can be sprayed and cast into a variety of shapes using low-temperature curing (< 100 °C) for solvent removal. Conductive Black CP1™ Polyimide is available as a liquid casting resin or film product.

Comco PLAVIS G15 is a self-lubricating grade for wear and friction applications. Modification: 15% graphite.

GMS Composites BP – 190 is a formulated Bismaleimide matrix prepreg, with long out life. The product is suitable for continuous use up to 200°C. BP-190 has been developed for the manufacture of high performance composite tools. After initial curing in an autoclave the tool can be demoulded and cured in a fan forced oven as a free standing component.

C-Stock RH-7 a series of rigid Polymethacrylimide foams which will withstand temperatures to 380ºF. C-STOCK RH has a high compression and shear strength and a very low dielectric constant and low loss factor. It is easily machined to close tolerances.

Solver Polyimide Polyimide Resin Composite 15% Graphite And 10% PTFE can be used for aircraft, aviation, automobile, office equipment, electrical and electronic equipment, scientific instruments, industrial machinery, production equipment, and so on. The polyimide is fit for the application surroundings which can be temperature resisting, sealed, dimensional stability, deformation without fracture, such as sealing ring, thrust washer sliding bearing, vacuum pump vane, valve seat, gear and so on.

HTC™ 9593 is a chopped carbon fiber reinforced ESC® molding compound. It is easily moldable and provides parts that are high strength, fatigue resistant, with high heat resistance and a low density. The carbon fiber is standard modulus PAN based 3K tow.

HexPly® F652 is a bismaleimide resin that cures via an addition reaction with no condensation by-products. HexPly® F652 is a controlled flow polyimide resin system designed for alternative processing capabilities such as co-curing over honeycomb core, compression molding, as well as standard autoclave processing.

Comco PLAVIS MS is a self-lubricating grade for vacuum environments. Modification: 15% MoS2.

Soundfoam HTC is lightweight, flexible, open cell polyimide foam.

CORIN® XLS Polyimide is Transparent polyimide with exceptional Atomic Oxygen resistance. CORIN® XLS Polyimide is a colorless, clear, organic/inorganic nanocomposite with exceptional resistance to atomic oxygen erosion. CORIN® XLS exhibits a glass transition temperature in excess of 250°C, making it suitable for many high temperature applications. CORIN® XLS is available as a raw polymer powder, liquid casting resin, or film product.

MVK-14 FreeForm® is a high-temperature thermosetting polyimide resin with service capability up to 316°C (204°C wet). It is accompanied by an extensive database of mechanical and thermal properties. This database, generated by the National Center for Advanced Materials Performance (NCAMP), includes over 5,000 data points and makes MVK-14 FreeForm® ready for use in virtually any application requiring a high-temperature structural composite material. Jointly developed by Maverick and GE Aviation to replace PMR-15 and its highly toxic diamine 4,4’-methylenedianiline (MDA), MVK-14 FreeForm® contains no mutagenic or carcinogenic components. Although it is most suited for autoclave processing, its chemistry also allows for the use of compression molding. MVK-14 FreeForm® is available as a PMR-type resin solution from Maverick Corporation, or as a prepreg from Renegade Materials Corporation.

85N is the ultimate polyimide and laminate prepreg system fo PWB's requiring resistance to high temperature, both in process and in end-use applications. Bromine-free chemistry provides Bestin-Class thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.

CP1™ Polyimide Colorless, transparent polyimide with low moisture uptake and low dielectric constant CP1™ Polyimide exhibits the lowest moisture uptake, lowest dielectric constant, and lowest color of all commercially available polyimides, making it an ideal choice for electronics, displays, and aerospace applications. Material is available as a raw powder, liquid resin or in continuous rolls in thicknesses as low as 2.5 microns (0.1 mil) and in widths up to 60 inches (152 cm).

Renegade Materials Corporation AFR-PE-4 Polyimide produces thousands of pounds of polyimide prepregs for flight hardware every month with a perfect quality and delivery record! Renegade Materials' high temperature prepregs and adhesives are powered by next generation polyimide resin technology. As the largest production supplier of polyimide composite materials in the world, we are the industry's most-trusted commercial source for AFR-PE-4 and other aerospace grade polyimide materials. Renegade Materials is the exclusive supplier of prepregs made with proprietary RM-1100 polyimide resin technology offering the highest temperature polymeric solution for commercial and military engine/aircraft applications up to 700°F. Renegade Materials is also the exclusive supplier of prepregs made with patented MVK-14M FreeFormTM, a polyimide prepreg used in global commercial aircraft applications up to 550°F.