Products in Displays: Epoxy & Epoxy Derivatives

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

8329TCS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. 8329TCS has been designed for maximum thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity, use 8329TFS. For a shorter working time, use 8329TCM.

8329TCF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. It is also flame retardant and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 4 hours. This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems. 8329TCF has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFF. For a longer working life, use 8329TCM or 8329TCS.

8329TFF is a 2-part, flame retardant, thermally conductive epoxy adhesive with a 5-minute working time. It is an off white, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal glue is often used to bond heatsinks to CPUs, LEDs and other electronics components. This product has a very short working time. For a longer working time, use 8349TFM or 8329TFS.

Valtron® AD5038A-AD5038B Epoxy System is a low viscosity, temporary adhesive system ideal for slicing applications where polyethylene glycol (PEG), PEG/water and water coolant is used as a slicing vehicle or a coolant. It has good water resistance.

Valtron® AD1846A-AD1851B Epoxy System is a temporary adhesive system for mounting monocrystalline and multicrystalline ingots for the photovoltaic and LED wafer slicing process. It has good water resistance. Applicable for diamond wire saw with selected debonding solutions.

Valtron® AD1238A-AD3848BR Epoxy System is a temporary adhesive system for monocrystalline and multicrystalline ingots for the wafer slicing, fast-curing and high bond strength. Applicable for automatic dispensing systems.

Tack-Free ESP8350 is a reworkable, silver-filled, epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. This novel, B-staged electrically conductive adhesive offers excellent reworkability from 80 to 150°C. The dry, tack-free handling of the film makes it suitable for an automated assembly. ESP8350 has excellent thermal conductivity. Its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing. This frilm is reinforced with 1.5 mil fiberglass.

EC-1106 is an electronic grade Optically Clear Epoxy, Encapsulating and Potting Compound. This heat curing system has very low viscosity and long work life.

127-03-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 127-03-F include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and high temperature properties and is able to absorb stress when bonding mismatched CTE substrates. This product has been formulated to have improved handling in the B-staged form and is available in thicknesses from 1 to 5 milsFeatures Excellent Thermal Conductivity. Easy Liner Release. Excellent Chemical Resistance. Minimal Flow During Cure. Low CTE. Excellent High Temperature Performance.

CM 15 is a Visual composites, Semi Structural and Fast Isothermally Press Curable, Class A Surface quality for painting, Hot Demoldable, Improved UV and environmental resistance, Improved fiber imprinting resistance

CM11 resin is Mid Tg and its prepregs are suitable for hot painting, hot gluing and cataphoresis processes. New resin system not only cures under 3 minutes at 150°C at press under isothermal curing conditions but also hot de-moldable and long out-life of two weeks at ambient temperature. These extreme conditions does not affect the visual Performance of prepreg system with CM11, capable of Class A Surface. Drapability is suitable for press molds and low to medium tack optimized for press curing.

Robnor ResinLab Ltd PX590EF-1 is a three-component epoxy foam system with a customizable blow ratio.

CM14 resin is Mid Tg fast cure press curable prepreg system which is also dicy free formulated against waterspot/whitespot problems. CM14 resin system is especially formulated for cosmetic grade visual carbon look. Drapability is suitable for press molds and low to medium tack optimized for press curing.

OM13 is a structural resin system. It is translucent when cured.

OM15 is for visual applications. It is translucent when cured without any white washes. It is Low Tg , about 110 °C.

Methylhexahydrophthalic anhydride (MHHPA) is a thermo-setting epoxy resin curing agent mainly used in electric and electron field