Products in Devices & Assemblies: Phenols & Phenolics

Resinoid 1360HR is a glass reinforced, two-step phenolic molding compound. It exhibits outstanding impact strength, electrical and thermal properties. It is particularly suitable for high temperature and strength applications. This material comes in pelletized from and is suitable for transfer or compression molding. It can be preformed on automatic equipment.

Resinoid 2005 is a cellulose reinforced, two-step phenolic molding compound. It exhibits excellent electrical and thermal properties and dimensional stability. This material comes in pelletized from and is suitable for transfer or compression molding. It can be preformed on automatic equipment.

Resinoid 2016P is a fabric reinforced, two-step phenolic molding compound offering excellent resistance to mechanical shock. It is supplied in pellet form suitable for transfer and compression molding. This material can also be used in injection molding systems with deep flight screws

Durez™ 00156 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used Durez™ 00156 is certified as UL Flame Rated. It is available in Granules form.

Resinoid 2002-4A is a fabric reinforced, two-step phenolic molding compound. It has been modified to meet gear requirements and other stressed applications. It possesses excellent impact and flexural strength. It is available in bulk form and is recommended for compression or transfer molding.

Fudow Company F5980F is inorganic filler.

Acculam™ Phenolfab Linen L/LE comprised of a phenolic resin and a woven linen (cotton) substrate. This material qualifies to NEMA L/LE and MIL-I-24768/13/15.This material's improved moisture resistance and machining characteristics allow its use in a wider range of electrical and structural applications than paper grades. Its finer weave fabric also allows for finer machined details& thinner sheets than grades C and CE.

Resinoid Compound 1322 is a glass reinforced, two step molding compound. It may be preformed. Recommended for transfer, injection or compression molding

MELOPAS® MP 183 is a Cellulose-reinforced molding compounds based on melamine resin & melamine

DuraCore® is a lightweight, highly resilient, blanket-type insulation made from borosilicate glass fibers. Its insulation blanket is fiberglass bonded with a thermosetting phenolic resin and is designed to provide this product with excellent core strength.

Resinoid 2020 is a fabric reinforced, two-step phenolic molding compound. It exhibits excellent moldability in transfer molding. It possesses excellent dimensional stability and impact strength properties. It is available in bulk form and is recommended for compression or transfer molding.

Resiten® LFBI (0.062 in Thick) are extremely durable, lightweight, and moisture resistant. they are available in sheet, strip, block, and fabricated parts.Applications are Military Service and Industrial Applications

Durez™ 00153 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used Durez™ 00153 is certified as UL Flame Rated. It is available in Granules form.

Durez™ SUMIKON PM-6430 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used It is available in Granules form.

MELOPAS® MP 182 is a Cellulose-reinforced molding compounds based on melamine resin & melamine

Resinoid 1505 is a milled glass reinforced, two-step phenolic molding compound offering good mechanical and electrical properties. This product has been specifically formulated for electrical applications where very low post-molded shrinkage is desired. This material comes in granular form and is suitable for injection, transfer or compression molding. It can be preformed on automatic equipment.

Acculam™ Phenolfab G3 comprised of a high temperature phenolic resin binder and a woven fiberglass substrate. It qualifies to NEMA G-3 and MIL-I-24768/18.This material has good heat resistance, high mechanical strength and low thermal expansion. It finds applications in motor slot insulation, valve plates, and other applications requiring good thermal insulation characteristics.

Everaox® 1010 has a long-term thermal stability and is a multifunctional antioxidant.

Resinoid 2101 is an organic fiber reinforced, two-step phenolic molding compound. It was specifically developed for molded parts requiring nominal mechanical strengths and excellent electrical properties. This material comes in pelletized form an d in grades suitable for injection, transfer or compression molding.

Fudow Company F5760F is a glass fiber.

Durez™ 32633 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used Durez™ 32633 is certified as UL Flame Rated. It is available in Granules form.

Beijing New Friend Insulation Material F828 Phenolic Paper Laminate is from the bleached wood pulp paper impregnated with phenolic resin, drying, hot pressing made. Implementation is in enterprise standard.

Durez™ 00118 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used Durez™ 00118 is certified as UL Flame Rated. It is available in Granules form.

MELOPAS® MP 180 is a Cellulose-reinforced molding compounds based on melamine resin & melamine

Resinoid 2016 is a fabric reinforced, two-step phenolic molding compound. It is available in bulk form and is recommended for compression or transfer molding.

Durez™ 25378 by Sumitomo Bakelite Company is comprised of Phenolic Compound. It is commonly used Durez™ 25378 is certified as UL Flame Rated. It is available in Granules form.

Fudow Company F5910F is a organic filler.

Fudow Company F5637 is a glass fiber.

Fudow Company F5773F is a glass fiber.