Products in Industrial Automation: Cost Effective

SABIC's Specialties Business LNP THERMOCOMP LF006 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP LC008EXP compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.

SABIC's Specialties Business LNP THERMOCOMP LF008 compound is based on Polyetheretherketone (PEEK) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP LC004XXP compound is based on Polyetheretherketone (PEEK) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP LF004E compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP 2X95787 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 15% glass fiber.

LNP THERMOCOMP LC00APXQ compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Exceptional Processing, Electrically Conductive.

LNP™ THERMOCOMP™ Compound 5C003 is a Polyvinylidene Fluoride (PVDF) resin-based compound with 15% carbon fiber, offering electrically conductive properties. It is characterized by its high stiffness and strength, making it ideal for applications in electrical and electronics, energy management, electronic components, and industrial material handling. This compound is processed through injection molding.

SABIC's Specialties Business LNP™ THERMOCOMP™ LC00AEX1 compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Electrically Conductive, Ultra High Modulus and Strength, Easy Molding, Excellent Wear Resistance and Low CTE.

LNP THERMOCOMP LX03447 compound is based on Polyetheretherketone (PEEK) resin containing 35% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP 2C003 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive.

SABIC's Specialties Business LNP THERMOCOMP MF006AS compound is based on Polypropylene (PP) resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP LF002XXP-WT02005 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. Added features of this grade include: Custom Color.

SABIC's Specialties Business LNP™ THERMOCOMP™ LC006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: High Modulus, High impact, Easy Molding, Electrical Conductive.

SABIC's Specialties Business LNP THERMOCOMP LC006 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP LF002EXD compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. Added features of this grade include: Custom Color, Easy Molding.

SABIC's Specialties Business LNP™ THERMOCOMP™ LX08411 compound is based on Polyetheretherketone (PEEK) resin containing 45% carbon fiber. Added features of this grade include: Electrically Conductive, High Modulus, Easy Molding.

SABIC's Specialties Business LNP THERMOCOMP OF006 compound is based on linear Polyphenylene Sulfide (PPS) resin containing 30% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP LX04015 compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.

LNP THERMOCOMP 2Z004 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% milled glass.

SABIC's Specialties Business LNP™ THERMOCOMP™ LF008EX1 compound is based on Polyetheretherketone (PEEK) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength, Easy Molding and Low Warpage.

SABIC's Specialties Business LNP THERMOCOMP OF00AN compound is based Polyphenylene Sulfide (PPS) containing 50% glass fiber. Added features include: High Modulus, Impact Modified, Low Chloride content, Good Warpage Control, Inherently Flame Retardant. Excellent High Heat and Chemical Resistance and Good Metal Bonding Strength suitable for Nano-Molding Technology (NMT) applications. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP 2C004 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

SABIC's Specialties Business LNP THERMOCOMP LF006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. Added features of this grade include: Low warpage, Easy Molding. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP LC008E compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP 2X98703 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP LC003E compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive

SABIC's Specialties Business LNP™ THERMOCOMP™ LX97024 compound is based on Polyetheretherketone (PEEK) resin containing 15% glass fiber, 5% PTFE. Added features of this grade include: Internally Lubricated, Easy Molding.

LNP THERMOCOMP 2F004 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% glass fiber.

SABIC's Specialties Business LNP THERMOCOMP LX09404 compound is based on Polyetheretherketone (PEEK) resin containing 45% carbon fiber. Added features of this grade include: Electrically Conductive, High Modulus This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP 2X04505 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

SABIC's Specialties Business LNP THERMOCOMP LF002 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP LF006E compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. Added features of this grade include: Easy Molding. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP LF003 compound is based on Polyetheretherketone (PEEK) resin containing 15% glass fiber.

SABIC's Specialties Business LNP THERMOCOMP RC003 compound is based on Nylon 6/6 resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP LC006EXQ compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.