Products in Other Devices & Assemblies: Polyimides (PI)

P96/P26 consist of a flame resistant, polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

85N is the ultimate polyimide and laminate prepreg system fo PWB's requiring resistance to high temperature, both in process and in end-use applications. Bromine-free chemistry provides Bestin-Class thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.

84N is a high performance ceramic-filled polyimide prepreg based on Arlon’s 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper layers and for filling clearance holes in metal cores. The ceramic filler in the resin serves to reduce shrinkage and inhibit crack formulation during through-hole drilling in filled clearance areas.

CORIN® XLS Polyimide is Transparent polyimide with exceptional Atomic Oxygen resistance. CORIN® XLS Polyimide is a colorless, clear, organic/inorganic nanocomposite with exceptional resistance to atomic oxygen erosion. CORIN® XLS exhibits a glass transition temperature in excess of 250°C, making it suitable for many high temperature applications. CORIN® XLS is available as a raw polymer powder, liquid casting resin, or film product.

CP1™ Polyimide Colorless, transparent polyimide with low moisture uptake and low dielectric constant CP1™ Polyimide exhibits the lowest moisture uptake, lowest dielectric constant, and lowest color of all commercially available polyimides, making it an ideal choice for electronics, displays, and aerospace applications. Material is available as a raw powder, liquid resin or in continuous rolls in thicknesses as low as 2.5 microns (0.1 mil) and in widths up to 60 inches (152 cm).

VTEC™ PI is a High temperature resistance and it is Superior mechanical properties

Novastrat® 905 Polyimide has High temperature polyimide with essentially zero coefficient of thermal expansion Novastrat® 905 is a high temperature polyimide film with essentially zero coefficient of thermal expansion (CTE). Because of this unique property, Novastrat® 905 has been successfully used in demanding optics, satellite and industrial applications that are exposed to severe temperature fluctuations. Novastrat® 905 is the recommended grade for applications that require essentially zero CTE and stable properties across a wide range of operating temperatures. Novastrat® 905 is available as a film in sheet form, or liquid resin for spray or flow casting operations. As a liquid, it bonds well to metals and metal oxides, and is supplied with and without a variety of internal adhesion promoters.

38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.

VTEC™ GF63 is a High temperature resistance and it is Superior mechanical properties

VTEC™ BG21 is a High temperature resistance and it is Superior mechanical properties

Thermalbright® Polyimide is a High performance white polyimide Thermalbright® Polyimide is a high performance white polyimide with wide ranging uses in display applications, electrical insulators, composites, industrial tapes, space structures, and many others. Thermalbright® Polyimide is useful in thermal control applications requiring low absorptivity, high emissivity, UV stability, and high temperature colorfastness. Thermalbright® Polyimide exhibits high optical density and hiding, making it an excellent high temperature white paint replacement material. Thermalbright® Polyimide is available in two grades: Thermalbright® C for Electrostatic Dissipative (ESD) applications, and Thermalbright® N for applications that require electrical insulation. Thermalbright® Polyimide is available as a liquid casting resin or film product.

Conductive Black CP1™ Polyimide Lower RF loss than other black and conductive black polyimides NeXolve’s Conductive Black CP1™ Polyimide is filled with carbon nanoparticles to produce a conductive black polyimide material with lower RF loss than other black and conductive black polyimides. Conductive Black CP1™ Polyimide exhibits very high optical density (>4) and light blocking. It is useful in applications requiring static dissipation, as it exhibits ESD-level surface resistivity. Conductive Black CP1™ Polyimide also exhibits high emissivity, surpassing 0.80 at 1 mil thickness. This material can be sprayed and cast into a variety of shapes using low-temperature curing (< 100 °C) for solvent removal. Conductive Black CP1™ Polyimide is available as a liquid casting resin or film product.

35NQ is a pure polyimide laminate and prepreg system. Reinforced with woven Quartz fabric, combining the advantages of a reduced cure cycle, high temperature polyimide system (Tg >/=250°C), with low dielectric constant and loss tangent (DK = 3.5, loss 0.009 at 1 MHz) for applications requiring operation at RF/Microwave frequencies. Polyimide Quartz materials also exhibit reduced in-plane CTE for expansion matched SMT applications.

37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.

Arlon 85HP’s unique blend of pure polyimide resin and micro-fi ne proprietary fi llers results in superior performance for demanding applications. Compared to conventional polyimide systems, 85HP has a lower Z-axis expansion and twice the thermal conductivity. 85HP reduces resin cracking and wicking in designs with high density plated through holes and vias. 85HP prepreg has resin fl ow characteristics and pressed thickness matching standard polyimides.