Products in Adhesives & Sealants: Low Viscosity

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3700B is UV curable urethane acrylate oligomer with high elongation and soft rubbery elasticity. It is relatively low viscosity despite its high molecular weight. EB and Thermal cure systems are also applicable. Features Soft elastic type, High elongation High molecular weight but relatively low viscosity Non-solvent (100% hardening ingredient) For UV adhesion with monomers Non-yellowing Applications Adhesive: UV/ EB/ Thermal-curable adhesive for electronics device, optical use and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

Viplex LS is a low viscosity diluent of PU and epoxy systems with excellent compatibility.

UNI-REZ 2632 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2632 hot melt polyamide adhesive has excellent low temperature flexibility and adhesion to various plastic substrates. The low viscosity and moderate softening point allows for lower application temperatures when used with temperature sensitive substrates.

UNI-REZ 2294 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2294 has a moderate softening point and low viscosity which allows for a lower application temperature and fast set.

UNI-REZ 2940 polyamide resin is a co-solvent type resin which is soluble in alcohols, but typically requires mixtures of aliphatic hydrocarbons and alcohols for gel stability. UNI-REZ 2940 polyamide resin provides fast solvent release and good grease resistance in flexographic / gravure inks for plastic substrates and is especially effective as an overprint lacquer.

TAFIGEL PUR 54 is a low viscous, solvent-free associative thickener which builds up and stabilizes viscosity by forming a network between polyurethane, binder molecules and other paint ingredients. TAFIGEL PUR 54 can be used alone or in combination with other TAFIGEL thickeners, as well as with further technology thickeners.TAFIGEL PUR 54 is recommended for use in following systems: Interior and exterior paints, latex paints, anti-corrosive paints, emulsion plasters, adhesives, putties and printing inks. TAFIGEL PUR 54 is suitable for indirect food contact applications.

UNI-REZ 138 polyamide resin is an alcohol soluble type resin of comparatively low viscosity. It has low odor, high gel and water resistance, together with excellent solvent release and blocking resistance. Its high ester tolerance permits addition of small proportions of nitrocellulose without loss of any of these properties.

UNI-REZ 2221 polyamide resin is an alcohol soluble type resin for flexographic printing. It has high compatibility with nitrocellulose and low viscosity, allowing for high heat resistance and high color strength.

UNI-REZ 2720 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2720 hot melt polyamide adhesive offers good chemical resistance, low softening point and low viscosity which allows for a lower application temperature and fast set.

UNI-REZ 2224 polyamide resin is an alcohol soluble type resin for flexographic printing. It has high compatibility with nitrocellulose and very low viscosity, allowing for high heat resistance and high color strength.

UNI-REZ 2633 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2633 hot melt polyamide adhesive has good low temperature flexibility and adhesion to various plastic substrates.

SPUR+™ 3040 prepolymer is an excellent candidate to consider as a binder for high strength adhesives requiring adhesion to a variety of substrates. The low viscosity o SPUR+™ 3040 prepolymer has shown it to be easy to formulate and use for the manufacture of adhesives. Many applications have benefited from the excellent heat resistance of SPUR+™ 3040 prepolymer in circumstances where thermal stability is required.

UNI-REZ 119 polyamide resin is an alcohol soluble / co-solvent type resin with excellent solvent release and blocking properties. UNI-REZ 119 polyamide resin was developed for release lacquers and has the lowest solution viscosity but fast solvent release.

UNI-REZ 2620 hot melt polyamide adhesive is a resin based on dimer acid. UNI-REZ 2620 offers good chemical resistance, low softening point and low viscosity which allows for a lower application temperature and fast set.

BONDiT™ B-755 is a unique low viscosity, two-part, high strength, 100% solids, room-temperature curing semi-rigid cyclo-aliphatic epoxy resin system with good scratch and impact resistance. Suitable for clear coat, conformal coating and electrical potting applications. The B-755 handles harsh environments easily and is effective against moisture, salt water, acids, alkalies, oils, fuels, solvents and detergents. B-755 produces very low extract products in soak tests and provides corrosion resistance.