Products in Adhesives & Sealants: Coupling Agent

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.