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Adhesives & Sealants
Products in Adhesives & Sealants: Bisphenol Epoxy Resins
9 Products found in Adhesives & Sealants
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Mitsubishi Chemical Group Corporation
jER™ 1750
Polymer Name:
Epoxy Resins & Compounds
Functions:
Binder & Resin, Resins, Binders & Matrix Materials, Resin, Adhesion Promoter, Coupling Agent
Chemical Family:
Bisphenol F Type Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
Labeling Claims:
High Purity
jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX8000D
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Adhesion Promoter, Coupling Agent, Binder & Resin, Resin
Chemical Family:
Bisphenol A Type Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
End Uses:
Radiation Curable Coating, Semiconductor Applications
Compatible Substrates & Surfaces:
Glass, Fibers & Fabrics, Concrete, Metal, Ceramic, Aluminum, Plastics, Steel
Features:
Transparency, Low Chlorine Content, Faster Cure Time, LED-curable, Radiation Curable, Fast Cure, UV Curable, Excellent Adhesion
jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL980
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Resins, Binders & Matrix Materials, Adhesion Promoter, Binder & Resin, Resin
Chemical Family:
Bisphenol A Type Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Concrete, Aluminum, Fibers & Fabrics, Metal, Ceramic, Plastics, Steel, Glass
Features:
Low Chlorine Content, Excellent Electrical Insulation, Good Mechanical Properties, Water Resistant, Chemical Resistant, Electrically Insulating, Abrasion Resistance, Water Resistance, Improved Dimensional Stability, Reduced Wear, Good Electrical Properties, Chemical Resistance, Heat Resistance, Improved Flexibility, Flame Retardant
jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL983U
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Resins, Binders & Matrix Materials, Adhesion Promoter, Binder & Resin, Resin
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Concrete, Aluminum, Fibers & Fabrics, Metal, Ceramic, Plastics, Steel, Glass
Features:
Low Chlorine Content, Excellent Electrical Insulation, Good Mechanical Properties, Water Resistant, Chemical Resistant, Low Viscosity, Electrically Insulating, Abrasion Resistance, Water Resistance, Improved Dimensional Stability, Reduced Wear, Good Electrical Properties, Good Elastic Recovery, Chemical Resistance, Heat Resistance, Improved Flexibility
jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Leuna-Harze GmbH
Epilox® A 17-01
Applications:
Electronics Adhesives, Appliances & Electronics, Potting Compounds
Product Families:
Epoxies, Resins & Binders
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
End Uses:
Epoxy Adhesive
Epilox A 17-01 is a colorless, low-molecular-weight bisphenol A epoxy resin.
Leuna-Harze GmbH
Epilox® A 19-03
Applications:
Electronics Adhesives, Appliances & Electronics, Housings & Enclosures
Product Families:
Epoxies, Resins & Binders
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
End Uses:
Epoxy Adhesive
Epilox A 19-03 is a medium viscosity bisphenol A epoxy resin which may crystallize on storage.
BB Resins
BB Resins BB-EPA 1100
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Coating
BB Resins BB-EPA 1100 is a medium viscosity unmodified epoxy resin obtained by blend of Bisphenol A/Bisphenol F based resins.
Leuna-Harze GmbH
Epilox® A 19-04
Applications:
Electronics Adhesives, Appliances & Electronics, Potting Compounds
Product Families:
Epoxies, Resins & Binders
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
End Uses:
Epoxy Adhesive
Epilox A 19-04 is a low molecular weight bisphenol A epoxy resin with medium viscosity.
Leuna-Harze GmbH
Epilox® F 16-01
Applications:
Electronics Adhesives, Appliances & Electronics, Potting Compounds
Product Families:
Epoxies, Resins & Binders
Chemical Family:
Phenols & Phenolics, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
End Uses:
Epoxy Adhesive
Epilox F 16-01 is a colorless, low-molecular-weight bisphenol F epoxy resin.
