Products in Adhesives & Sealants: Resin

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3700B is UV curable urethane acrylate oligomer with high elongation and soft rubbery elasticity. It is relatively low viscosity despite its high molecular weight. EB and Thermal cure systems are also applicable. Features Soft elastic type, High elongation High molecular weight but relatively low viscosity Non-solvent (100% hardening ingredient) For UV adhesion with monomers Non-yellowing Applications Adhesive: UV/ EB/ Thermal-curable adhesive for electronics device, optical use and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3300B is UV curable urethane acrylate oligomer with excellent soft-elasticity, and very high elongation. It also shows good mechanical properties even at low temperature. EB and Thermal cure systems are also applicable. Features Soft-elastic, High elongation Suitable for adhesion bond and metalizing undercoat with monomers Good mechanical properties at low temperature Non-yellowing Applications Adhesive : UV/ EB/ Thermal-curable adhesive for electronics device, optical use, and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UT-7792 is a bio-based urethane acrylate oligomer. (Development product) Its biomass degree is 71% while its mechanical properties are the same as a non-biomass grade UV-3300B, with higher elongation and very soft rubbery elasticity suitable for using UV-curable adhesives for electronics devices. Features Bio-based Soft-elastic, High elongation Suitable for adhesion bond and metalizing undercoat with monomers Non-yellowing Applications Adhesive : UV/ EB/ Thermal-curable adhesive for electronics device, optical use, and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SHIKOH™ UV-3520TH is an aliphatic urethane acrylate oligomer with soft elasticity, good toughness and high elongation. It shows unique mechanical properties with various reactive diluents. Features Soft-Elastic type, Good toughness, High elongation Diluted in Tetrahydrofurfuryl Acrylate (THFA) (oligomer/ THFA = 70/30 wt%) Non-solvent (100% hardening ingredient) Unique mechanical properties with various reactive diluents Applications UV/ EB/ Thermal-curable adhesive UV adhesive for electric device use 3D printer, and Inkjet *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

BB Resins BB-EPA 1100 is a medium viscosity unmodified epoxy resin obtained by blend of Bisphenol A/Bisphenol F based resins.

BB Resins BB-Amide 5036 a reactive high viscosity polyamide resin.

Yparex® 9403 M is a family of maleic-anhydride-(MAH)-functionalised polyolefins. For each of its many application areas Yparex® has suitable grades. The grades are characterized by density and melt flow index, melting temperature and the level of functional groups. Functionality for the varying application range is also obtained by using a large array of different base polymers and production technologies. The materials are produced under the highest quality standards allowing no residual unbonded maleic anhydride in the final product.

Dugdale Plc Intumescent PVC Materials incorporate specially treated graphite flakes that add intumescent properties. At a temperature of around 250°C the layers in each graphite flake separate and this increases the volume of the PVC material by approximately 300 percent. In a fire situation, this reaction would typically be triggered by hot smoke.

BB Resins BB-Amide 5011 is a low viscosity polyamidoimidazoline resin.