Products in Adhesives & Sealants: Chemical Resistant

RTV5810 series sealants are neutral cure, one-component, ready-to-use silicone adhesive sealants that cure to tough resilient silicone rubber on exposure to atmospheric moisture at room temperature. These sealants are fast curing, paste consistency products that may be considered for use where quick initial adhesion build is desired. This may allow for movement of the sealed assemblies in a shorter period of time, increasing productivity.

8329TCF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. It is also flame retardant and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 4 hours. This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems. 8329TCF has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFF. For a longer working life, use 8329TCM or 8329TCS.

9200FR is a toughened, flame retardant, 2-part epoxy adhesive, designed to create long-lasting load-bearing joints. It creates tough vibration resistant bonds and is especially useful for joining dissimilar materials that will experience thermal cycling stresses or harsh environmental conditions. This smooth, non-sagging, thixotropic adhesive is excellent for use on vertical surfaces, for gap filling, and for potting electronics enclosures with gaps where a non-thixotropic encapsulant would flow through.

One-part Epoxy Potting Compound 9510 is a black, rigid, one-part epoxy potting compound. It is a heat cure epoxy that provides unlimited working time at room temperature and does not require frozen storage. Our 1-part epoxy resin provides exceptional chemical resistance against a wide variety of mild to harsh chemicals, including toluene, acetone and ethyl acetate. It also provides excellent electrical insulation and protects against static discharge, vibration, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

8329TCS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. 8329TCS has been designed for maximum thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity, use 8329TFS. For a shorter working time, use 8329TCM.

RTV106 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. RTV102, RTV103, RTV106, RTV108, RTV109, RTV112, RTV116 and RTV118 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. Since all these sealants utilize a moisture cure system, they must not be used in thicknesses of greater than 6mm (1/4 in.). Where section depths exceed 6mm (1/4 in.), Momentive Performance Materials one component, addition cure or two-component silicone rubber compounds are recommended.

The 1035 Premium RTV Silicone Adhesive Sealant is a one-part, spreadable, non-corrosive, translucent paste. It is a fast curing and designed to provide quick initial adhesion build. The adhesive sealant retains elastomeric properties for long periods at temperatures from -60 to 204 °C (-76 to 399 °F). The 1035 is excellent for the sealing and bonding of electronic components onto printed circuit boards and protecting copper connections on electronic part assemblies. It also provides excellent weather proofing where power cords enter motors. It can be used as a gasket for leak resistant sealing and insulating.

RTV108 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. RTV102, RTV103, RTV106, RTV108, RTV109, RTV112, RTV116 and RTV118 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. Since all these sealants utilize a moisture cure system, they must not be used in thicknesses of greater than 6mm (1/4 in.). Where section depths exceed 6mm (1/4 in.), Momentive Performance Materials one component, addition cure or two-component silicone rubber compounds are recommended.

RTV162 adhesive sealants from Momentive Performance Materials are one-component, ready-to-use electronic grade silicone sealants. They cure to a tough, resilient silicone rubber on exposure to atmospheric moisture at room temperature. These electronic-grade silicone adhesive sealants differ somewhat in physical properties including consistency.

9200 is a toughened, 2-part epoxy adhesive, designed to create long-lasting load-bearing joints. It creates tough vibration-resistant bonds and is especially useful for joining dissimilar materials that will experience thermal cycling stresses or harsh environmental conditions. This smooth, non-sagging, thixotropic adhesive is excellent for use on vertical surfaces, for gap filling, and for potting electronics enclosures with gaps where a non-thixotropic encapsulant would flow through. For a flame retardant version, use 9200FR.

8329TCM is a 2-part thermally conductive epoxy adhesive. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This adhesive is most often used as heatsink glue, attaching heatsinks to CPUs, LEDs, or other heat generating electronics components. This compound has been formulated for high thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity use 8349TFM. For a shorter working time, use 8349TFM. For a longer working time, use 8329TCS.

9410 is a 1-part electrically conductive epoxy adhesive. It has unlimited working time at room temperature. It bonds well to a wide variety of substrates, and offers strong chemical resistance. 9410 is designed for semi-conductor flip chip packaging as well as die attach for small chips, LEDs and diodes. It provides excellent EMI/RFI shielding and is very effective at filling in seams between metal plates. It can be readily used in manual, pneumatic and robotic dispensing processes.

High Temperature Rigid Urethane 8820 is a black, tough, high temperature, two-part polyurethane potting compound. It has a low mixed viscosity and properties similar to epoxy compounds, but with exceptional low temperature stability. As well, it adheres strongly to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics. 8820 offers exceptional physical protection, a high continuous operating temperature, and superior protection from acids, bases, and many organic solvents.

8329TFF is a 2-part, flame retardant, thermally conductive epoxy adhesive with a 5-minute working time. It is an off white, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal glue is often used to bond heatsinks to CPUs, LEDs and other electronics components. This product has a very short working time. For a longer working time, use 8349TFM or 8329TFS.

RTV103 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. RTV102, RTV103, RTV106, RTV108, RTV109, RTV112, RTV116 and RTV118 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. Since all these sealants utilize a moisture cure system, they must not be used in thicknesses of greater than 6mm (1/4 in.). Where section depths exceed 6mm (1/4 in.), Momentive Performance Materials one component, addition cure or two-component silicone rubber compounds are recommended.

RTV167 adhesive sealants from Momentive Performance Materials are one-component, ready-to-use electronic grade silicone sealants. They cure to a tough, resilient silicone rubber on exposure to atmospheric moisture at room temperature. These electronic-grade silicone adhesive sealants differ somewhat in physical properties including consistency.

RTV102 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. RTV102, RTV103, RTV106, RTV108, RTV109, RTV112, RTV116 and RTV118 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. Since all these sealants utilize a moisture cure system, they must not be used in thicknesses of greater than 6mm (1/4 in.). Where section depths exceed 6mm (1/4 in.), Momentive Performance Materials one component, addition cure or two-component silicone rubber compounds are recommended.

UV-8403 is a low viscosity, light curing epoxy adhesive that bonds well to a wide variety of substrates including engineered plastics such as UltemTM, LexanTM, and ABS. This product exhibits good surface wetting and adhesion to glass and many plastics. UV-8403 cures to a clear polymer when properly cured. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of UVA light (310-365nm).

UV-8311 is a low viscosity, fast curing, light curing epoxy adhesive that offers excellent strenth wetting properties. UV-8311 cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass.This product requires direct light exposure during cure. UV-8311 can cure fully in under 10 seconds using optimal cure conditions. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cures best in the UVA wavelengths

122-07-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 122- 07-F include, but are not limited to, die attach bonding, circuit board fabrication, advanced material composites, sealing, and high performance coatings. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the B-staged form. This product is available in thicknesses from 1 to 5 mils.Features Excellent Thermal Conductivity Easy Liner Release Excellent Chemical Resistance Low Ionics

FLASHBOND™ UV-5402 is a low viscosity, flexible, light curing epoxy adhesive that offers excellent strenth and flexibility for reduced cracking. UV-5402 is low viscosity and high elongation. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400-415nm) and can also cure down to 365nm.

118-06-F is a B-staged, electrically conductive, transferable, epoxy adhesive film. The 118-06-F Series was developed with wafer manufacturing in mind. Some other applications for 118-06-F include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembling electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the B-staged form. This product is available in thicknesses from 1 to 5 mils (see product codes below). 118-06-F is designed with the performance criteria of Mil-Std-883 5011.4 in mind and is expected to pass ASTM E-595 outgassing testing when fully and properly cured.Features Excellent Electrical Conductivity. Easy Liner Release. Excellent Chemical Resistance. Low Ionics.

124-07-F is a B-staged, one part epoxy coating and laminating adhesive film. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings. This product is available in thicknesses from 1 to 5 mils.

FLASHBOND™ UV-8300LV is a low viscosity, light curing epoxy adhesive that bonds well to a wide variety of substrates including metals, glass, ceramics and some plastics. This product exhibits good surface wetting and adhesion to glass and many plastics. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (405nm) as well as down to 365nm. Flashbond UV-8300LV has been tested to and passes ISO-10993-5 for cytotoxicity.

EPOXIBOND™ EB-116 is high strength, structural epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties and is excellent for cryogenic applications. It is recommended for bonding glass, metal, ceramics, and engineering thermoplastics. Due to its low viscosity, it can be also used for potting and encapsulating electrical/electronic coponents

125-22-F is a B-staged, electrically conductive, transferable, epoxy adhesive film. Some applications for 125-22-F include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembling electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the Bstaged form. This product is available in thicknesses from 1 to 5 milsFeatures Excellent Electrical Conductivity Easy Liner Release Excellent Chemical Resistance Minimal Flow During Cure Low CTE Excellent High Temperature Performance

FLASHBOND™ UV-8504E is a low viscosity, fast curing, light-curing epoxy adhesive that offers excellent strength wetting properties. UV-8504E cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass.This product requires direct light exposure during cure. UV-8504E can cure fully in 30 seconds using optimal cure conditions. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cures best in the UVA wavelengths (315-365nm). FLASHBOND™ UV-8504E has been tested to and passes ISO-10993-5 standards for cytotoxicity.

SetWORX 90 is a toughened, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties. It is recommended for bonding engineering thermoplastics, SMC (sheet molding compounds) in aerospace and automotive applications. SetWORX 90 is BPA-Free and non-hazardous for shipping.

CGSTAPE - 8257S is a polyimide backing and silicone adhesive offers ex- cellent chemical and thermal resistance with excellent electrical insulating properties.

CGSTAPE - 7659 is a CM polyimide film formed by sputtering metal aluminum, then develops thin aluminum layer, with one side insulation, the other side high conduct electricity. It not only has the performance of excellent heat resistant, mechanical, chemical stability, radiation resistant, and self-extinguishing, but also emi shielding, high thermal conductivity. Now we have HN polyimide film sputtering aluminum and black polyimide film sputtering aluminum.

SetWORX™ 411HP is a toughened, high strength, industrial grade structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. 411HP is a one component, heat cure, conductive epoxy adhesive. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties. It is recommended for bonding engineering thermoplastics, SMC (sheet molding compounds) in aerospace and automotive applications.

127-03-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 127-03-F include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and high temperature properties and is able to absorb stress when bonding mismatched CTE substrates. This product has been formulated to have improved handling in the B-staged form and is available in thicknesses from 1 to 5 milsFeatures Excellent Thermal Conductivity. Easy Liner Release. Excellent Chemical Resistance. Minimal Flow During Cure. Low CTE. Excellent High Temperature Performance.

CGSTAPE - 7659AL is a polyimide film laminated with virgin pure annealed alloy 1235-0 aluminum foil. It has great flexibility and high tensile strength. Polyimide film plyer imparts high-temperature ability provides a moisture barrier and enhances chemical resistance.

CGSTAPE - 8158 is a polyimide backing and acrylic adhesive offers excellent chemical and thermal resistance with excellent electrical insulating properties. This tape is used where toughness and puncture resistance are required.

SetWORX™ 1510 is a fast setting, toughened epoxy adhesive designed for industrial grade applications. This epoxy system has 1:1 mixing ratio by volume & cure fast at room temperature. When cured it is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator. The cured adhesive exhibits high impact resistance and exceptional bond strength. It can be used for bonding glass, metals, woods and some plastics.

SETWORX™ 60 is a toughened, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties.