Products in Adhesives & Sealants: Electrically Insulating

WACKER® Silicone Paste P 12 is a pure white, soft-consistency heat sink paste with marked thermal conductivity. It is electrically insulating. WACKER® PASTE P 12 is used especially in semiconductor technology as a heat sink paste. When there is a need for good heat transfer from a semiconductor to a cooling element, applying a thin coating of WACKER® PASTE P 12 is advisable. In the assembly of semiconductors such as diodes, transistors, and thyristors, microscopic irregularities may exist on the mating surfaces of the semiconductor and the cooling surface. These surface irregularities can hinder firm metal-to-metal contact when assembled.

RTV5810 series sealants are neutral cure, one-component, ready-to-use silicone adhesive sealants that cure to tough resilient silicone rubber on exposure to atmospheric moisture at room temperature. These sealants are fast curing, paste consistency products that may be considered for use where quick initial adhesion build is desired. This may allow for movement of the sealed assemblies in a shorter period of time, increasing productivity.

9200FR is a toughened, flame retardant, 2-part epoxy adhesive, designed to create long-lasting load-bearing joints. It creates tough vibration resistant bonds and is especially useful for joining dissimilar materials that will experience thermal cycling stresses or harsh environmental conditions. This smooth, non-sagging, thixotropic adhesive is excellent for use on vertical surfaces, for gap filling, and for potting electronics enclosures with gaps where a non-thixotropic encapsulant would flow through.

8329TFS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermally conductive adhesive is used to glue heatsinks to LED’s, CPU’s, and other heat generating components. This product cures slowly. For a faster cure version, use 8329TFF or 8349TFM.

One-part Epoxy Potting Compound 9510 is a black, rigid, one-part epoxy potting compound. It is a heat cure epoxy that provides unlimited working time at room temperature and does not require frozen storage. Our 1-part epoxy resin provides exceptional chemical resistance against a wide variety of mild to harsh chemicals, including toluene, acetone and ethyl acetate. It also provides excellent electrical insulation and protects against static discharge, vibration, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

8329TFM is a thermally conductive two-part epoxy adhesive. It is dark gray, smooth, thixotropic, and bonds well to a wide variety of substrates. This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips, and automatic dispensing systems. For a faster working life, use 8329TFF. For a longer working life, use 8329TFS.

RTV106 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. RTV102, RTV103, RTV106, RTV108, RTV109, RTV112, RTV116 and RTV118 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. Since all these sealants utilize a moisture cure system, they must not be used in thicknesses of greater than 6mm (1/4 in.). Where section depths exceed 6mm (1/4 in.), Momentive Performance Materials one component, addition cure or two-component silicone rubber compounds are recommended.

9310 is a 1-part, fast curing, electrically insulative epoxy adhesive. It is a smooth, thixotropic paste that stays in place without tailing when dispensed. This surface mount adhesive is specially designed for die attach applications in electronics assembly operations. It can be readily used in manual, pneumatic and robotic dispensing processes. It can also be used as a general-purpose adhesive for household, industrial and manufacturing applications. It has an unlimited working life at room temperature and does not require mixing or frozen storage.

RTV108 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. RTV102, RTV103, RTV106, RTV108, RTV109, RTV112, RTV116 and RTV118 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. Since all these sealants utilize a moisture cure system, they must not be used in thicknesses of greater than 6mm (1/4 in.). Where section depths exceed 6mm (1/4 in.), Momentive Performance Materials one component, addition cure or two-component silicone rubber compounds are recommended.

RTV162 adhesive sealants from Momentive Performance Materials are one-component, ready-to-use electronic grade silicone sealants. They cure to a tough, resilient silicone rubber on exposure to atmospheric moisture at room temperature. These electronic-grade silicone adhesive sealants differ somewhat in physical properties including consistency.

9200 is a toughened, 2-part epoxy adhesive, designed to create long-lasting load-bearing joints. It creates tough vibration-resistant bonds and is especially useful for joining dissimilar materials that will experience thermal cycling stresses or harsh environmental conditions. This smooth, non-sagging, thixotropic adhesive is excellent for use on vertical surfaces, for gap filling, and for potting electronics enclosures with gaps where a non-thixotropic encapsulant would flow through. For a flame retardant version, use 9200FR.

Thermal Adhesive 8349TFM is a 2-part, flame retardant, thermally conductive epoxy adhesives. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is most often used to bond heatsinks to CPUs, LEDs and other electronics components. For a shorter working time, use 8329TFF. For a longer working time, use 8329TFS.

9460TC is a 1-part, heat cured only, thermally conductive epoxy adhesive with an unlimited working time. It is an off-white, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This 1-part adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. It does not require mixing and is suitable for use with manual, pneumatic, and automatic dispensing systems.

RTV103 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. RTV102, RTV103, RTV106, RTV108, RTV109, RTV112, RTV116 and RTV118 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. Since all these sealants utilize a moisture cure system, they must not be used in thicknesses of greater than 6mm (1/4 in.). Where section depths exceed 6mm (1/4 in.), Momentive Performance Materials one component, addition cure or two-component silicone rubber compounds are recommended.

RTV167 adhesive sealants from Momentive Performance Materials are one-component, ready-to-use electronic grade silicone sealants. They cure to a tough, resilient silicone rubber on exposure to atmospheric moisture at room temperature. These electronic-grade silicone adhesive sealants differ somewhat in physical properties including consistency.

RTV102 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. RTV102, RTV103, RTV106, RTV108, RTV109, RTV112, RTV116 and RTV118 one-component, ready-to-use adhesive sealants are extremely versatile. They cure to a tough, durable, resilient silicone rubber on exposure to atmospheric moisture at room temperature. Acetic acid vapors are released from the sealant surface as a by-product of cure. Since all these sealants utilize a moisture cure system, they must not be used in thicknesses of greater than 6mm (1/4 in.). Where section depths exceed 6mm (1/4 in.), Momentive Performance Materials one component, addition cure or two-component silicone rubber compounds are recommended.

CGSTAPE - 8958 is a anti-static treated polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat.

Tack-Free ESP 7455 is an alumina-filled, epoxy film adhesive designed for bonding component and substrate to a mismatched substrate or carrier. The dry, tack-free handling of the film makes it suitable for an automated assembly. The adhesive film has very low ionic impurities of less than 10 ppm and high thermal stability with TGA degradation at 450°C. ESP7455 has good thermal conductivity. The extra low Tg of -60°C helps to minimize thermal stress on the bonded parts during thermal cycling or shock testing from -55 to 150°C.

EG7635 is a alumina filled, electrically insulating and thermally conductive rigid epoxy paste adhesive. While bonding at ambient temperature can be achieved overnight, elevated temperatures will accelerate curing, exponentially. EG7635 high thermal conductivity and high strength makes it excellent for bonding substrates, components and heat sinks where thermal management is critical. It has more than 15 years of proven records of providing bonding to difficult substrates. EG7635 exibits reduced bond strength at 80-100°C for easier rework.

ME7863 is a one part, quartz filled cyanate ester die attach adhesive. It was designed for solder-sealed ceramic packages. It can withstand temperatures up to 300°C without thermal degradation. ME7863 has processing characteristics required in high speed automation. Its unique chemistry results in very low moisture absorption, high adhesive strength and low CTE.

CGSTAPE - 8458 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

ME7158 is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The very high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. It can be readily reworked at 80-150°C with torque or peel stress.

ESP7666-FOW is the modified boron nitride filled thermally conductive version of the high flow DAF of ESP7660-FOW. It is a high-bond strength epoxy film adhesive tor high flow when melted to easily flow over Wire-bond in stack chip die attach application. This new generation wafer level die- attach film is flexible before curing. This ESP7660-FOW is mounted onto the back of the wafer at 80-100°C, which is then diced into predetermined sizes using standard dicing tape. Depending on the different dicing tape used and with suitable releasing action such as UV or heat, the diced chip is picked and placed directly onto a lead frame or substrate. It is designed for bonding component and substrate to substrate and carrier with matched thermal coefficients of expansion. ESP7660-FOW has good thermal stability. The dry, tack-free handling of the film makes it suitable for an automated assembly.

ME7159 is a reworkable, diamond filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The ultra high thermal conductivity of this diamond filled material makes it useful for bonding high-powered, large area die and components. It can be readily reworked at 80-100°C.

CGSTAPE - 8258K is a Kapton® HN backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

CGSTAPE - 8258 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

ME7635-RC is an thermally conductive insulating epoxy adhesive for die-attach applications. This thixotropic paste is solvent free. It is designed for automated, inline bonding processing ME7635-RC is low in ionic impurities (<60 ppm total) and meets all requirements for MIL-Std 883D 5011.4 specification for dielectric adhesive. Fast curing can be achieved from 80°C and higher temperatures.

CGSTAPE - 6458 is a glass cloth tape with a acrylic pressure-sensitive adhesive. This tape is used to electrically insulate and provide mechanical protection at temperatures to 150°C . This tape provides insulation and solvent- resistant protection for use as coil cover, anchor, banding and core, layer and crossover insulation.

ME7857-SC is a medium viscosity, silicon carbide filled, flexible epoxy for snap curing application. It is a reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility down to -60°C. Ideal for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible adhesive maintains good stable bond strength of 100 psi from 150-250°C and has outstanding thermal stability.

CGSTAPE - 7658 (1mil) is a CGS polyimide film was developed specifically to withstand the damaging effects of “corona,” which can cause ionization and eventual breakdown of an insulation material or system when the voltage stress reaches a critical level.

CGSTAPE - 8468 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

CGSTAPE - 8459 is a polyimide backing and acrylic adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat are required.

CGSTAPE - 8258BL is a black polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required. Light shielding.

TP7155 is an aluminum oxide filled, medium bond strength thermoplastic film adhesive designed for bonding die, component, and substrate. It has good thermal conductivity. The dry, tack-free handling of the film makes it suitable for automated assembly. TP7155 is designed for bonding parts that may be operaung at 160 continuously. If excessive tensile stress is expected at temperature above 150°C, additional mechanical support may be considered.