Products in Adhesives & Sealants: Excellent Substrate Adhesion

CHT Group AS1707 is a non-corrosive, neutral-cure, 1-part, RTV (Room Temperature Vulcanizing) silicone adhesive sealant. It is one in a range of alkoxy cure products that are solvent-free. It exhibits excellent primerless adhesion to many substrates and cures at room temperature to form a tough rubber when in contact with atmospheric moisture. This product will not corrode copper or its alloys and is suitable for use with electronic components.

8329TCM is a 2-part thermally conductive epoxy adhesive. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This adhesive is most often used as heatsink glue, attaching heatsinks to CPUs, LEDs, or other heat generating electronics components. This compound has been formulated for high thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity use 8349TFM. For a shorter working time, use 8349TFM. For a longer working time, use 8329TCS.

8329TCS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. 8329TCS has been designed for maximum thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity, use 8329TFS. For a shorter working time, use 8329TCM.

8331 is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8331 has been formulated to be economical. For a higher fill that maximizes conductivity, use 8330. For a longer working time, use 8331S.

8331S – Silver Conductive Epoxy Adhesive This electrically conductive paste is a 2-part heat-cured epoxy with a long working time. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This electrically conductive epoxy paste can be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. It provides excellent EMI/RFI shielding and is very effective in filling seams between metal plates. 8331S has been formulated to be economical. For a higher fill version that maximizes conductivity, use 8330S. For a shorter working time or room temperature cure, use 8331 or 8331D. For a 1-part alternative use 9410 or 9400. We also offer a full line of thermally conductive electrically insulating epoxy adhesives.

9310 is a 1-part, fast curing, electrically insulative epoxy adhesive. It is a smooth, thixotropic paste that stays in place without tailing when dispensed. This surface mount adhesive is specially designed for die attach applications in electronics assembly operations. It can be readily used in manual, pneumatic and robotic dispensing processes. It can also be used as a general-purpose adhesive for household, industrial and manufacturing applications. It has an unlimited working life at room temperature and does not require mixing or frozen storage.

8810 urethane resin is a black, tough, 2-part potting compound. It features a low mixed viscosity and excellent moisture resistance. In addition, this rigid urethane potting compound adheres strongly to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics. This 2-part polyurethane resin offers exceptional physical protection and is designed for potting and encapsulating intricate electronic components and cable jointing boxes.

8329TCF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. It is also flame retardant and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 4 hours. This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems. 8329TCF has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFF. For a longer working life, use 8329TCM or 8329TCS.

One-part Epoxy Potting Compound 9510 is a black, rigid, one-part epoxy potting compound. It is a heat cure epoxy that provides unlimited working time at room temperature and does not require frozen storage. Our 1-part epoxy resin provides exceptional chemical resistance against a wide variety of mild to harsh chemicals, including toluene, acetone and ethyl acetate. It also provides excellent electrical insulation and protects against static discharge, vibration, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Black Flexible Urethane 8800 is a black, 2-part, flexible polyurethane resin. It has a low mixed viscosity and maintains excellent flexibility at low temperatures. In addition, this flexible urethane adheres strongly to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics. It is a cost-effective flexible potting option that provides exceptional physical protection and creates minimum stress on circuit boards and surface-mounted devices. It offers superior moisture resistance and is an ideal choice for harsh environments, especially saltwater exposure and marine applications.

8330S Silver Conductive Epoxy Adhesive: Slow Cure / Extreme Conductivity

Silver Conductive Epoxy Adhesive 8330 is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, and for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8330 is highly filled to maximize electrical conductivity. For a more economical version, use 8331. For a longer working life, use 8330S.

8330D is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8330D is highly filled to maximize electrical conductivity. For a more economical version, use 8331D. For a longer working life, use 8330S.

High Temperature Rigid Urethane 8820 is a black, tough, high temperature, two-part polyurethane potting compound. It has a low mixed viscosity and properties similar to epoxy compounds, but with exceptional low temperature stability. As well, it adheres strongly to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics. 8820 offers exceptional physical protection, a high continuous operating temperature, and superior protection from acids, bases, and many organic solvents.

8331D is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8331D has been formulated to be economical. For a higher fill that maximizes conductivity, use 8330D. For a longer working time, time, use 8331S.

EG7655 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE'S (i.e., alumina to aluminum, silicon to copper). EG7655's high thermal conductivity and flexibility make it excellent for bonding large area substrates, components and heat sinks where thermal management is critical. EG7655 exhibits reduced bond strength at 80-100°C for easier rework. The cured adhesive is flexible with Type A hardness of 80 and tensile elongation of more than 30%.

ME8630-DA is an extra fine silver filled 100% solid low viscosity die-attach for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. ME8630-DA has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes. It maintains more than 300 psi bond strength at 250°C for high temperature wire-bonding.

128-26 is a pourable, thermally conductive, silicone adhesive and potting compound suitable for application by stamping, screen printing, stencil printing, and syringe dispensing. This product features excellent adhesion to Kynar, Kapton, Mylar, glass, and a variety of other surfaces and is very resistant to flexing and creasing. Some applications for 128-26 include but are not limited to potting and encapsulation of stress-sensitive components, thermal management, and low-stress bonding applications.Features One Component thermally conductive heat cured adhesive.

MEB650-DA is a low viscosity silver filled flexible epoxy paste. This low ionic silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It is ideal for automatic dispensing in die- attach application with fine definition. Absolutely solvent-free and diluent free composition with low ionic impurities for high reliability. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This stress free adhesive shows consistent medium bond strength up to 250°C at 200 psi.

EG7635 is a alumina filled, electrically insulating and thermally conductive rigid epoxy paste adhesive. While bonding at ambient temperature can be achieved overnight, elevated temperatures will accelerate curing, exponentially. EG7635 high thermal conductivity and high strength makes it excellent for bonding substrates, components and heat sinks where thermal management is critical. It has more than 15 years of proven records of providing bonding to difficult substrates. EG7635 exibits reduced bond strength at 80-100°C for easier rework.

EPOXIBOND™ EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.

EG7658 is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (ie., alumina to aluminum, silicon to copper). The high thermal conductivity and flexibility make it excellent for bonding high-powered, large area die and components. EG7658 can be reworked using temperatures higher than the cure temperature from 80-150°C to soften the bond line. Use a tool adequate to break the bond and remove. Clean any residue with a solvent which will not damage the parts.

RTK7659 is a tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier. This B-Staged, dielectric adhesive offers excellent reworkability at 80-150°C. RTK7659 has excellent thermal conductivity and the low Tg of the adhesiveimposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

ME7655-RC is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. ME7655-RC can be cured at 150°C for 30 minutes without creating voids. It can be readily reworked at 80-100°C.

126-22-F is an anisotropic conductive, solvent-resistant, transferable adhesive film. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. This product features a hydrophobic resin that has proven well in humid aging studies and is also very resistant to scratching and creasing. Applications for 126-22 include, but are not limited to, conductive splicing of ribbon cables, PTF circuits attachments, and LED surface bonding demands. This product is useful in application where ensuring good electrical contact for all connections is a concern. This product is available in thicknesses from 1 to 5 mils

Polytec PU 1000 is a one-component, room- temperature curing, highly flexible with excellent polyurethane-adhesive electrical conductivity. Polytec PU 1000 has been specifically developed for contacting chip modules on dual interface smart cards. It is used in micro electronics, hybrid and electronic applications. Polytec PU 1000 cures at room temperature or accelerated with heat. Polytec PU 1000 stands out due to its high flexibility combined with mechanical strength. It is also suitable for electrical contacting of copper surfaces The material can be applied by dispensing, jet-dispensing or manually.

C.L. Smith Industrial Company CLS-4000 is a toughened epoxy film which either yellow or green in color.

Bondline 6959 is a dielectric semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive. It is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.

Humiseal Epoxy Adhesives Family perform in the most challenging environments due to their robust curing mechanism and resulting strength. Epoxies are used in industries including electronics, automotive, and health care devices among others. Humiseal epoxy adhesives are supplied as 2 components, chemical cure systems.

APPLI-TEC 0720 Polysulfide is a one‐component, gray, thermally conductive, precision mixed, degassed, and frozen polysulfide adhesive. It is fuel resistant material that is flexible when cured and is compliant with HMS 16‐1985, Compound V, Class 3 and HP 16‐103, Type VII, Class 3 specifications. 0720 can be cured at either room or elevated temperatures followed by a room temperature cure. This material is thixotropic when applied and features a very low glass transition temperature as well as having a thermal conductivity of 0.8 (W/mK). It has a long pot life of 2 hours and is an ideal filet material. Along with fuels, 0720 is resistant to lubricants, oils, water, and weather and bonds well to most substrates including aluminum, magnesium, titanium, and steel.

Jyoti Ceramic Zircocem-1 is a 2 component, Zircon based, inorganic ceramic adhesive chemical setting cement, having low thermal expansion.

American Standard Adhesives ASA-3904 is a pressure sensitive adhesive used for general packaging and assembly. When sprayed or coated on tough substrate materials, it has a high tack on the surface.

Eclectic E6100 Industrial Adhesive (Clear) is a unique NON-SAG, non-flammable industrial adhesive formulated to meet highperformance requirements. It permanently adheres to more surfaces than virtually any other adhesive, providing exceptional adhesion to wood, metal, glass, fiberglass, ceramics, masonry, concrete, asphalt, leather, rubber, PVC, neoprene, vinyl and many plastics. This NON-SAG formula will not drip or run and is highly recommended for use in applications requiring vertical hold. E6100 maintains its flexible bond in extreme cold temperatures, will not crack or become brittle and is excellent for bonding items subject to vibration. For applications exposed to direct sunlight, paint over E6100 after curing.

ThreeBond Europe SAS TB1530B is a highly thixotropic, single-component, solvent free elastic adhesive on the basis of a silyl-ended polymer which reacts rapidly upon exposure to moisture in the air and cures to form a toughened elastomer with time. Since there are no solvents or plastisizers contained in the adhesive it shows excellent non-staining characteristics against adherends when used as a sealant and is overpaintable. It provides excellent weather resistance, high adhesion strength to most substrates without the need for primer pre-treatment, and is environmentally friendly due to its low odor and non-isocyanate. In addition TB1530B can be used for sealing and potting applications for which conventional RTV rubbers have been used. However, as no low-molecular siloxanes are produced during curing it will not corrode metals or impair electrical contacts.

Sil-Flex SL RTV-7525 (Neutral) is a self-leveling one component, low modulus, neutral cure silicone sealant and adhesive. When fully cured, this unique VOC compliant formula offers UV stability and tenacious adhesion. It is frequently used for coating electronic components and terminals or sealing pitch pockets and window seams. This product is specifically formulated to offer all weather performance to meet today's Green Building Standards.

Polytec TC 411 is a pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering. Polytec TC 411 has a great thermal conductivity and an excellent adhesion to ceramic, glass, semiconductor materials, metals and most plastics. The application can be performed directly from the side-by-side cartridge with a static mixing nozzle, using a dispensing gun.