Products in Adhesives & Sealants: Good Thermal Stability

SC-550-LV-TC-2 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-2 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

SC-550-LV-TC-1 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-1 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

SC-550-LV-RT is a 100% silicone solid elastomer designed for electronic potting applications. This two-component, room temperature curing system offers a hard, self-bonding, thermally conductive, low modulus material that is readily re-workable.

122-07-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 122- 07-F include, but are not limited to, die attach bonding, circuit board fabrication, advanced material composites, sealing, and high performance coatings. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the B-staged form. This product is available in thicknesses from 1 to 5 mils.Features Excellent Thermal Conductivity Easy Liner Release Excellent Chemical Resistance Low Ionics

CGSTAPE - 8958 is a anti-static treated polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat.

FLASHBOND™ UV-5402 is a low viscosity, flexible, light curing epoxy adhesive that offers excellent strenth and flexibility for reduced cracking. UV-5402 is low viscosity and high elongation. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400-415nm) and can also cure down to 365nm.

118-06-F is a B-staged, electrically conductive, transferable, epoxy adhesive film. The 118-06-F Series was developed with wafer manufacturing in mind. Some other applications for 118-06-F include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembling electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the B-staged form. This product is available in thicknesses from 1 to 5 mils (see product codes below). 118-06-F is designed with the performance criteria of Mil-Std-883 5011.4 in mind and is expected to pass ASTM E-595 outgassing testing when fully and properly cured.Features Excellent Electrical Conductivity. Easy Liner Release. Excellent Chemical Resistance. Low Ionics.

Tack-Free ESP 7455 is an alumina-filled, epoxy film adhesive designed for bonding component and substrate to a mismatched substrate or carrier. The dry, tack-free handling of the film makes it suitable for an automated assembly. The adhesive film has very low ionic impurities of less than 10 ppm and high thermal stability with TGA degradation at 450°C. ESP7455 has good thermal conductivity. The extra low Tg of -60°C helps to minimize thermal stress on the bonded parts during thermal cycling or shock testing from -55 to 150°C.

CGSTAPE - 8458 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

ESP7666-FOW is the modified boron nitride filled thermally conductive version of the high flow DAF of ESP7660-FOW. It is a high-bond strength epoxy film adhesive tor high flow when melted to easily flow over Wire-bond in stack chip die attach application. This new generation wafer level die- attach film is flexible before curing. This ESP7660-FOW is mounted onto the back of the wafer at 80-100°C, which is then diced into predetermined sizes using standard dicing tape. Depending on the different dicing tape used and with suitable releasing action such as UV or heat, the diced chip is picked and placed directly onto a lead frame or substrate. It is designed for bonding component and substrate to substrate and carrier with matched thermal coefficients of expansion. ESP7660-FOW has good thermal stability. The dry, tack-free handling of the film makes it suitable for an automated assembly.

124-07-F is a B-staged, one part epoxy coating and laminating adhesive film. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings. This product is available in thicknesses from 1 to 5 mils.

CGSTAPE - 8258K is a Kapton® HN backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

CGSTAPE - 8258 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

114-26 B is a medical grade, electrically conductive, polymer coated polyester film composition. It is typically used as a component for fabricating electrodes in medical testing applications. This product has been formulated to have improved conductivity and high electrical dissipation properties. Some added applications for 114-26 B include, but are not limited to, emi/rfi shielding, polymer thick film circuitry, membrane switches and electrical static dissipation. 114-26 B is available in rolls ranging in widths up to 20 inches and lengths up to 2000 feet.

124-33-F is an electrically conductive, transferable, thermoplastic adhesive film. Some applications for the 125-33- F series include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembly of electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handleability. This product is available in thicknesses from 1 to 5 mils.

ME7857-SC is a medium viscosity, silicon carbide filled, flexible epoxy for snap curing application. It is a reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility down to -60°C. Ideal for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible adhesive maintains good stable bond strength of 100 psi from 150-250°C and has outstanding thermal stability.

EPOXIBOND™ EB-116 is high strength, structural epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties and is excellent for cryogenic applications. It is recommended for bonding glass, metal, ceramics, and engineering thermoplastics. Due to its low viscosity, it can be also used for potting and encapsulating electrical/electronic coponents

CGSTAPE - 8468 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

CGSTAPE - 8459 is a polyimide backing and acrylic adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat are required.

125-22-F is a B-staged, electrically conductive, transferable, epoxy adhesive film. Some applications for 125-22-F include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembling electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the Bstaged form. This product is available in thicknesses from 1 to 5 milsFeatures Excellent Electrical Conductivity Easy Liner Release Excellent Chemical Resistance Minimal Flow During Cure Low CTE Excellent High Temperature Performance

CGSTAPE - 8258BL is a black polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required. Light shielding.

CGSTAPE - 8358K is a Kapton® HN backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

CGSTAPE - 8458K is a Kapton® HN backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

CGSTAPE - 8358HT is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

CGSTAPE - 8257S is a polyimide backing and silicone adhesive offers ex- cellent chemical and thermal resistance with excellent electrical insulating properties.

TG-45LV is a specially formulated with low viscosity/screen printable consistency to achieve low BLT and high thermal conductivity for optimum thermal performance. Exhibits excellent resistance to pump out, outgassing and phase separation while eliminating concern of silicone deposition on optics and electronics within any package. TG-45LV is high performance thermal grease designed to meet the thermal, reliability and low-price requirements of high-end chipset, graphic processors trend ever-faster clock speeds. RoHS compliant and halogen -free

STG-51TC Heat Sink Compound is silicone thermal grease material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. STG-51TC specially developed to solve the problems of contamination and migration associated with silicone-based products. The compound is a unique synthetic-based thermal grease use to insure quick, efficient heat transfer and dissipation

CGSTAPE - 8558 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.