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Adhesives & Sealants
Products in Adhesives & Sealants: Thermal Shock Resistant
24 Products found in Adhesives & Sealants
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MG Chemicals
MG Chemicals 9510 - One-Part Epoxy Potting Compound
Applications:
Adhesives & Sealants, Appliances & Electronics, Printed Circuit Boards (PCBs)
Product Families:
Encapsulants, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
One-part Epoxy Potting Compound 9510 is a black, rigid, one-part epoxy potting compound. It is a heat cure epoxy that provides unlimited working time at room temperature and does not require frozen storage. Our 1-part epoxy resin provides exceptional chemical resistance against a wide variety of mild to harsh chemicals, including toluene, acetone and ethyl acetate. It also provides excellent electrical insulation and protects against static discharge, vibration, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.
EpoxySet Inc.
EPOXIBOND™ EB-155
Chemical Family:
Epoxy & Epoxy Derivatives
Product Type:
Encapsulant, Adhesive, Epoxy Adhesive, Potting Compound
Cure Method:
Air Dry, Heat Cure
Application Area:
Electronic Components, Fiber Optic Cables, Medical Applications, Optoelectronics Devices
Compatible Substrates & Surfaces:
Plastics, Metal
EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.
AI Technology
AI Technology ME 8456-DA
Applications:
Adhesives & Sealants, Appliances & Electronics, Automotive Electronics
Product Families:
Conductive Adhesives, Adhesives & Sealants
CoolMag Thermo Conductive, S.L.
COOLMAG™ 29
Applications:
Batteries, Sensors & Actuators, Electrical & Electronic Systems
Product Families:
Encapsulants, Adhesives & Sealants
CoolMag™ 29 is a thermally conductive composite PDMS based elastomeric compound of encapsulant two component system, designed for Power Electronics in general and for Automotive, especially in Electrified Vehicles with multiple functionalities: Heat Transfer, reduction of hot spots and minimizing average temperature of systems Electric Isolation Mechanical protection Flame and fire protection (Retardant and Extinction)
CoolMag Thermo Conductive, S.L.
COOLMAG™ 32
Applications:
Sensors & Actuators, Electrical & Electronic Systems, Adhesives & Sealants
Product Families:
Encapsulants, Conductive Adhesives, Adhesives & Sealants
CoolMag™ 32 is a thermally conductive composite PDMS based elastomeric compound of encapsulant two component system, designed for Power Electronics in general and for Automotive, especially in Electrified Vehicles with multiple functionalities: Heat Transfer, reduction of hot spots and minimizing average temperature of systems Electric Isolation Mechanical protection Flame and fire protection (Retardant and Extinction)
CoolMag Thermo Conductive, S.L.
COOLMAG™ 29 LV
Applications:
Power & Utilities, Batteries, Sensors & Actuators
Product Families:
Encapsulants, Conductive Adhesives, Adhesives & Sealants
CoolMag™ 29 LV is a thermally conductive composite PDMS based elastomeric compound of encapsulant two component system, designed for Power Electronics in general and for Automotive, especially in Electrified Vehicles with multiple functionalities:Heat Transfer, reduction of hot spots and minimizing average temperature of systemsElectric IsolationMechanical protectionFlame and fire protection (Retardant and Extinction)
CoolMag Thermo Conductive, S.L.
COOLMAG™ PU 10
Applications:
Sensors & Actuators, Electrical & Electronic Systems, Semiconductor Manufacturing
Product Families:
Encapsulants, Conductive Adhesives, Adhesives & Sealants
CoolMag™ PU 10 is a thermally conductive composite PDMS based elastomeric compound of encapsulant two component system, designed for Power Electronics in general and for Automotive, especially in Electrified Vehicles with multiple functionalities: Heat Transfer, reduction of hot spots and minimizing average temperature of systems Electric Isolation Mechanical protection Flame and fire protection (Retardant and Extinction)
Fielco Adhesives
Odyssey 6835
Applications:
Adhesives & Sealants, Appliances & Electronics, Semiconductor Manufacturing
Product Families:
Encapsulants, Adhesives & Sealants
Chemical Family:
Anhydrides
Fielco Adhesives Odyssey 6835 is a semi-flexible, heat-curing anhydride-based potting compound for Class B electrical applications with excellent thermal shock and moisture resistance.
Fielco Adhesives
Odyssey 14146
Applications:
Adhesives & Sealants, Appliances & Electronics, Semiconductor Manufacturing
Product Families:
Encapsulants, Adhesives & Sealants
Chemical Family:
Anhydrides
Fielco Adhesives Odyssey 14146 is a semi-flexible, heat curing anhydride-based electronic potting compound for Class B electrical applications with excellent thermal shock and impact resistance.
Bondline Electronic Adhesives
Bondline 6570
Product Type:
Potting Compound, Encapsulant
Cure Method:
Air Dry
Chemical Family:
Epoxy & Epoxy Derivatives
Bondline 6570 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.
Bondline Electronic Adhesives
Bondline 6576
Product Type:
Potting Compound, Encapsulant
Cure Method:
Air Dry
Chemical Family:
Epoxy & Epoxy Derivatives
Bondline 6576 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.
Key Polymer
Tough-Seal 42 A
Applications:
Consumer Electronics, Other Parts & Components, Adhesives & Sealants
Product Families:
Encapsulants, Structural Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
Tough-Seal 42 A is a flame retardant version of Tough-Seal 22. The self-extinguishing flame retardant performance meets UL 94V-0 requirements and has been validated by UL for the official rating. KEY Tough-Seal 42A/Bachieves flame retardant properties without antimony or halogenatedcompounds. Like Tough-Seal, it is a tough and durable two component, hybrid epoxy elastomer that features excellent thermal cycling and exceptional flexibility.
Key Polymer
Tough-Seal 32 A
Applications:
Consumer Electronics, Other Parts & Components, Adhesives & Sealants
Product Families:
Encapsulants, Structural Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
Tough-Seal 32 A is a tough and durable two component, hybrid epoxy elastomer that features a lower viscosity than Tough-Seal 22 and a longer gel time than Tough-Seal 31. Tough-Seal is a superior electrical potting compound with excellent thermal cycling performance. Tough-Seal has the flexibility of a urethane and the service temperature of an epoxy.
Jyoti Ceramic
Jyoti Ceramic Jyalucem-20
Applications:
Consumer Electronics, Appliances & Electronics, Ceramics & Refractory
Product Families:
Encapsulants, Structural Adhesives, Adhesives & Sealants
Chemical Family:
Aluminum Compounds
Jyoti Ceramic Jyalucem-20 is an inorganic, low temperature (200°C / 392°F) curing, high temperature resistant Inorganic Ceramic Adhesive Cement. After proper curing, this cement imparts high bond strength, thermal shock resistance and a hard surface.
Jyoti Ceramic
Jyoti Ceramic Zircocem-1
Applications:
Consumer Electronics, Appliances & Electronics, Ceramics & Refractory
Product Families:
Structural Adhesives, Adhesives & Sealants
Chemical Family:
Zirconium Compounds
Jyoti Ceramic Zircocem-1 is a 2 component, Zircon based, inorganic ceramic adhesive chemical setting cement, having low thermal expansion.
Key Polymer
Tough-Seal 23 A
Applications:
Consumer Electronics, Other Parts & Components, Adhesives & Sealants
Product Families:
Encapsulants, Structural Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
Tough-Seal 23 A a tough and durable two component, hybrid epoxy elastomer that features a higher viscosity than KEY Tough-Seal 21 to limit lateral flow in “glob top” encapsulation. KEY PC2023A/Bis a superior electrical potting compound with excellent thermal cycling performance.
Key Polymer
Tough-Seal 21 A
Applications:
Other Parts & Components, Adhesives & Sealants, Appliances & Electronics
Product Families:
Encapsulants, Structural Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
Tough-Seal 21 A is a tough and durable two component, fast gelling, hybrid epoxy elastomer electrical potting compound with excellent thermal cycling performance. KEY Tough-Sealhas the flexibility of a urethane and the service temperature of an epoxy.
Bondline Electronic Adhesives
Bondline 6571
Product Type:
Potting Compound, Encapsulant
Cure Method:
Air Dry
Chemical Family:
Epoxy & Epoxy Derivatives
Bondline 6571 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.
Jyoti Ceramic
Jyoti Ceramic Zircocem-5
Applications:
Consumer Electronics, Appliances & Electronics, Ceramics & Refractory
Product Families:
Structural Adhesives, Adhesives & Sealants
Chemical Family:
Zirconium Compounds
Jyoti Ceramic Zircocem-5 is a zircon based, single component cement which is non-corrosive and is resistant to high temperatures, high thermal shocks and cures by internal chemical setting. Ideal for bonding, joining, sealing of glass to glass, glass to ceramic, glass to metals, ceramic to ceramic, and ceramic to metals (except aluminum). Since, its chemical setting time is indefinite, and final curing occurs anytime between 18 to 24 hours, itis ideal for thin film bonding and coating from 2 to 125 mil thickness.
Key Polymer
Tough-Seal 31 A
Applications:
Consumer Electronics, Other Parts & Components, Adhesives & Sealants
Product Families:
Encapsulants, Structural Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
Tough-Seal 31 A is a tough and durable two component, hybrid epoxy elastomer that features a lower viscosity than Tough-Seal 21. Tough-Seal is a superior electrical potting compound with excellent thermal cycling performance. Tough-Seal has the flexibility of a urethane and the service temperature of an epoxy.
Key Polymer
Tough-Seal 41 A
Applications:
Consumer Electronics, Other Parts & Components, Adhesives & Sealants
Product Families:
Encapsulants, Structural Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
Tough-Seal 41 A is a flame retardant version of Tough-Seal 21. Self-extinguishing flame retardant performance has been validated by UL and KEY Tough-Seal 41A/Bhas achieved a UL94V-0 rating. KEY Tough-Seal 41A/Bachieves flame retardant properties without antimony and brominated compounds.
Key Polymer
Tough-Seal 24 A
Applications:
Consumer Electronics, Other Parts & Components, Adhesives & Sealants
Product Families:
Encapsulants, Structural Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
Tough-Seal 24 A a tough and durable two component, hybrid epoxy elastomer that features a higher viscosity than KEY Tough-Seal 22 to limit lateral flow in “glob top” encapsulation. KEY PC2024A/Bis a superior electrical potting compound with excellent thermal cycling performance.
Key Polymer
Tough-Seal 22 A
Applications:
Consumer Electronics, Other Parts & Components, Adhesives & Sealants
Product Families:
Encapsulants, Structural Adhesives, Adhesives & Sealants
Chemical Family:
Epoxy & Epoxy Derivatives
Tough-Seal 22 A is a tough and durable two component, hybrid epoxy elastomer that features a longer gel time than Tough-Seal 21. Tough-Seal is a superior electrical potting compound with excellent thermal cycling performance.
Bondline Electronic Adhesives
Bondline 6577
Product Type:
Potting Compound, Encapsulant
Cure Method:
Air Dry
Chemical Family:
Epoxy & Epoxy Derivatives
Bondline 6577 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.