Products in Adhesives & Sealants: Thixotropic

8331 is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8331 has been formulated to be economical. For a higher fill that maximizes conductivity, use 8330. For a longer working time, use 8331S.

8329TCF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. It is also flame retardant and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 4 hours. This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems. 8329TCF has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFF. For a longer working life, use 8329TCM or 8329TCS.

9200FR is a toughened, flame retardant, 2-part epoxy adhesive, designed to create long-lasting load-bearing joints. It creates tough vibration resistant bonds and is especially useful for joining dissimilar materials that will experience thermal cycling stresses or harsh environmental conditions. This smooth, non-sagging, thixotropic adhesive is excellent for use on vertical surfaces, for gap filling, and for potting electronics enclosures with gaps where a non-thixotropic encapsulant would flow through.

8329TFS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermally conductive adhesive is used to glue heatsinks to LED’s, CPU’s, and other heat generating components. This product cures slowly. For a faster cure version, use 8329TFF or 8349TFM.

8331S – Silver Conductive Epoxy Adhesive This electrically conductive paste is a 2-part heat-cured epoxy with a long working time. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This electrically conductive epoxy paste can be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. It provides excellent EMI/RFI shielding and is very effective in filling seams between metal plates. 8331S has been formulated to be economical. For a higher fill version that maximizes conductivity, use 8330S. For a shorter working time or room temperature cure, use 8331 or 8331D. For a 1-part alternative use 9410 or 9400. We also offer a full line of thermally conductive electrically insulating epoxy adhesives.

8329TCS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. 8329TCS has been designed for maximum thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity, use 8329TFS. For a shorter working time, use 8329TCM.

8329TFM is a thermally conductive two-part epoxy adhesive. It is dark gray, smooth, thixotropic, and bonds well to a wide variety of substrates. This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips, and automatic dispensing systems. For a faster working life, use 8329TFF. For a longer working life, use 8329TFS.

9310 is a 1-part, fast curing, electrically insulative epoxy adhesive. It is a smooth, thixotropic paste that stays in place without tailing when dispensed. This surface mount adhesive is specially designed for die attach applications in electronics assembly operations. It can be readily used in manual, pneumatic and robotic dispensing processes. It can also be used as a general-purpose adhesive for household, industrial and manufacturing applications. It has an unlimited working life at room temperature and does not require mixing or frozen storage.

Silver Conductive Epoxy Adhesive 8330 is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, and for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8330 is highly filled to maximize electrical conductivity. For a more economical version, use 8331. For a longer working life, use 8330S.

9200 is a toughened, 2-part epoxy adhesive, designed to create long-lasting load-bearing joints. It creates tough vibration-resistant bonds and is especially useful for joining dissimilar materials that will experience thermal cycling stresses or harsh environmental conditions. This smooth, non-sagging, thixotropic adhesive is excellent for use on vertical surfaces, for gap filling, and for potting electronics enclosures with gaps where a non-thixotropic encapsulant would flow through. For a flame retardant version, use 9200FR.

8329TCM is a 2-part thermally conductive epoxy adhesive. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This adhesive is most often used as heatsink glue, attaching heatsinks to CPUs, LEDs, or other heat generating electronics components. This compound has been formulated for high thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity use 8349TFM. For a shorter working time, use 8349TFM. For a longer working time, use 8329TCS.

Thermal Adhesive 8349TFM is a 2-part, flame retardant, thermally conductive epoxy adhesives. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is most often used to bond heatsinks to CPUs, LEDs and other electronics components. For a shorter working time, use 8329TFF. For a longer working time, use 8329TFS.

9410 is a 1-part electrically conductive epoxy adhesive. It has unlimited working time at room temperature. It bonds well to a wide variety of substrates, and offers strong chemical resistance. 9410 is designed for semi-conductor flip chip packaging as well as die attach for small chips, LEDs and diodes. It provides excellent EMI/RFI shielding and is very effective at filling in seams between metal plates. It can be readily used in manual, pneumatic and robotic dispensing processes.

9400 is an electrically conductive, silver-filled, 1-part epoxy adhesive with a low cure temperature. It is smooth, thixotropic, non-sagging, and bonds well to a wide variety of substances. It has an unlimited working life at room temperature. This product can create electrically conductive bonds where soldering is not an option, such as when bonding to heat-sensitive components, glass, soft metals, or conductive polymers. It also works well in semi-conductor packaging, microelectronic attachment and lid-sealing, and as a die attach for small chips, LEDs and diodes. It does not require mixing and can be readily used in manual, pneumatic and robotic dispensing processes. 9400 has been formulated to have a low Tg, which allows for minimal stress on substrates during temperature changes. For a higher Tg, use 9410.

9460TC is a 1-part, heat cured only, thermally conductive epoxy adhesive with an unlimited working time. It is an off-white, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This 1-part adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. It does not require mixing and is suitable for use with manual, pneumatic, and automatic dispensing systems.

8330D is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8330D is highly filled to maximize electrical conductivity. For a more economical version, use 8331D. For a longer working life, use 8330S.

8330S Silver Conductive Epoxy Adhesive: Slow Cure / Extreme Conductivity

8331D is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8331D has been formulated to be economical. For a higher fill that maximizes conductivity, use 8330D. For a longer working time, time, use 8331S.

ME8412 is a silver filled, solvent free, electrically and thermally conductive paste. It is designed for automated, online, die attach processing. It is thixotropic and will not sag on vertical surfaces. Designed to meet the hybrid adhesive specification, Mil Std 883; Method 5011.4 in terms of ionic impurities, ME8412 exhibits low outgassing at 125C and passes NASA outgassing requirements.

ME7863 is a one part, quartz filled cyanate ester die attach adhesive. It was designed for solder-sealed ceramic packages. It can withstand temperatures up to 300°C without thermal degradation. ME7863 has processing characteristics required in high speed automation. Its unique chemistry results in very low moisture absorption, high adhesive strength and low CTE.

ME7857-SC is a medium viscosity, silicon carbide filled, flexible epoxy for snap curing application. It is a reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility down to -60°C. Ideal for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible adhesive maintains good stable bond strength of 100 psi from 150-250°C and has outstanding thermal stability.

UV-8509R is a non-sag, fast curing, urethane acrylate that bonds well to engineered plastics and metal based substrates. This product requires direct UV exposure during cure. Because of the variability of different UV light sources it is suggested that the user test and specify UV intensity and exposure time. This material is specially formulated to have reduced surface tack due to oxygen inhibition.

MEB650-DA is a low viscosity silver filled flexible epoxy paste. This low ionic silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It is ideal for automatic dispensing in die- attach application with fine definition. Absolutely solvent-free and diluent free composition with low ionic impurities for high reliability. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This stress free adhesive shows consistent medium bond strength up to 250°C at 200 psi.

SetWORX 90 is a toughened, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties. It is recommended for bonding engineering thermoplastics, SMC (sheet molding compounds) in aerospace and automotive applications. SetWORX 90 is BPA-Free and non-hazardous for shipping.

ME8630-DA is an extra fine silver filled 100% solid low viscosity die-attach for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. ME8630-DA has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes. It maintains more than 300 psi bond strength at 250°C for high temperature wire-bonding.

ME7655-RC is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. ME7655-RC can be cured at 150°C for 30 minutes without creating voids. It can be readily reworked at 80-100°C.

TG-45LV is a specially formulated with low viscosity/screen printable consistency to achieve low BLT and high thermal conductivity for optimum thermal performance. Exhibits excellent resistance to pump out, outgassing and phase separation while eliminating concern of silicone deposition on optics and electronics within any package. TG-45LV is high performance thermal grease designed to meet the thermal, reliability and low-price requirements of high-end chipset, graphic processors trend ever-faster clock speeds. RoHS compliant and halogen -free

ME7665-DA is a rapid curing dielectric die-attach thermal adhesive. It contains alumina crystallite of less than 3 micron in particle size. It is a fast curing insulating epoxy adhesive for snap-curing applications. This thixotropic (TI is approx. 4.0) paste is solvent free. It is designed for automated, online bonding processing. ME7665-DA-LV is thermally conductive with less than 20 ppm ionic impurities. It can be dispensed with traditionally pressure-time or more accurately with positive volumetric dispenser. It has medium viscosity and high thixotropic index.

Palm Labs Adhesives Turbo Bond 300 is a two-component, 100% reactive, toughened structural methacrylate adhesive specifically formulated for bonding wide variety of metals, thermoplastics, thermosets, and composite assemblies.

ME8650-RC is designed for needle dispensing and screen-printing processing. This silver filled conductive die-attach adhesive can be rapidly cured at low temperatures. This single component, silver filled paste is ambient storable electrically and thermally conductive. It is highly thixotropic with minimal sag. ME8650-RC has been designed to minimize bleeding on both silver plated copper and alloy 42 lead frames. Maintains more than 100 psi bond strength at 250°C for wire-bonding.

Atom Adhesives Wood-Bond (Rigid Staking Compound Epoxy Adhesive) is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength. Wood-Bond contains a thixotropic agent which impedes thinning out of the material during heat cure when properly mixed and cured.

ThreeBond Europe SAS TB1530B is a highly thixotropic, single-component, solvent free elastic adhesive on the basis of a silyl-ended polymer which reacts rapidly upon exposure to moisture in the air and cures to form a toughened elastomer with time. Since there are no solvents or plastisizers contained in the adhesive it shows excellent non-staining characteristics against adherends when used as a sealant and is overpaintable. It provides excellent weather resistance, high adhesion strength to most substrates without the need for primer pre-treatment, and is environmentally friendly due to its low odor and non-isocyanate. In addition TB1530B can be used for sealing and potting applications for which conventional RTV rubbers have been used. However, as no low-molecular siloxanes are produced during curing it will not corrode metals or impair electrical contacts.

Ultra Low Outgassing SCV2-2599 is a controlled volatility (CV) silicone materials silicone's ability to remain elastic at low temperatures and resistant to breakdown at high temperatures offer excellent utility in extraterrestrial environments where materials are repeatedly exposed to extreme temperatures. NuSil's Controlled Volatility (CV) and Ultra Low Outgassing TM (SCV) silicone products are used by leading space programs to provide the much-needed resilient protection they require against contamination and material degradation.Benefits of Silicone Materials for Space Broad Operating Temperature Compensation for CTE Mismatch Protection Against Atomic Oxygen Optically Clear Formulations Flight Legacy Comments: 0.64 W/m-K.

Aptek® 6500-Pmf is a one component, pre-mixed frozen, 100% solids, silver-filled epoxy adhesive specifically designed for microelectronic die attach applications.APTEK 6500-PMF High purity, low outgassing, electrically conductive adhesive.

Resinlab® SEC1222 Part A is a silver filled, two component epoxy adhesive designed to cure completely at room temperature. It has excellent electrical conductivity useful in many electronic applications. It is a soft 100% solids thixotropic paste provided in a 1:1 ratio. It is recommended to mix by weight but extrusion of equal length beads from syringes is commonly used as a method of measurement as small quantities are commonly used. SEC1222 provides exceptionally high electrical conductivity starting immediately after mixing that improves as the curing process proceeds. It also has the additional benefit of very high thermal conductivity due to its high silver loading. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials.

ThreeBond Europe SAS TB3081N is a UV-curing resin which excels in environmental and thixotropic properties and has been specially developed for Cured-in-Place CIP gasketting.