Products in Electronics Coatings: Low Viscosity

SHIKOH™ UV-3700B is UV curable urethane acrylate oligomer with high elongation and soft rubbery elasticity. It is relatively low viscosity despite its high molecular weight. EB and Thermal cure systems are also applicable. Features Soft elastic type, High elongation High molecular weight but relatively low viscosity Non-solvent (100% hardening ingredient) For UV adhesion with monomers Non-yellowing Applications Adhesive: UV/ EB/ Thermal-curable adhesive for electronics device, optical use and automotive use. 3D printer *SHIKOH™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

DIACRON™ FC-1588 is a polyester resin with excellent solvent solubility. It is a low molecular weight (Mw)-grade of ER-535 and is optimal as a binder for paints and inks. Especially, the use of organic solvents can be reduced because low viscosity high-solid solutions are possible. It improves hardness, heat resistance, toughness, and solvent resistance by using curing agents such as isocyanates and epoxy resins.   Features: Low temperature fusion Excellent metal adhesion Excellent pigment dispersion. Can be used with cross-linking agents   Benefits: Solvent solubility High solid differentiation Use of biomass raw materials   Applications: Solventborne Coating For various types of inks Solventless & High Solids Coating   *DIACRON™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

DIACRON™ FC-3352 is a polyester resin with excellent environmental friendliness using 5wt% of biomass material. It is a high Tg and a low molecular weight (Mw)-grade and is optimal as a binder for paints and inks. Especially, the use of organic solvents can be reduced because low viscosity high-solid solutions are possible. It improves hardness, heat resistance, toughness, and solvent resistance by using curing agents such as isocyanates and epoxy resins.   Features: Excellent chemical resistance Heat-resistant Excellent pigment dispersion. Can be used with cross-linking agents   Benefits: Solvent solubility High solid differentiation Use of biomass raw materials   Applications: PCM coatings For various types of inks Solventless & High Solids Coating   *DIACRON™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

BR-146, a high molecular weight, trifunctional, aliphatic polyether urethane methacrylate, provides low formulation viscosity and moderate elongation with nonyellowing properties appropriate to soft touch glass coatings and impact resistant coatings. BR-146 shows adhesion to a variety of substrates, making it a candidate for consideration in mixed surface adhesion applications.

Bomar®BR-970H is a low viscosity, difunctional, aliphatic urethane acrylate. BR-970H has high modulus and doesn’t necessarily need to be blended with other oligomers to achieve a balance of toughness and flexibility. BR-970H offers rapid cure and non-yellowing properties where premium performance is required. This oligomer is perfect for 2D and 3D inkjet applications as well for use in Graphic Arts application. This oligomer canalsobe used in electronics, and automotive applications

Astrocure® 88 Oligomer is a low viscosity, low reactivity, flexibilizing oligomer that is designed to be used as a flexibilizing agent. It is light in color and should be used with Astrocure® 78 in the 10-15% by weight levels.

BONDiT™ B-755 is a unique low viscosity, two-part, high strength, 100% solids, room-temperature curing semi-rigid cyclo-aliphatic epoxy resin system with good scratch and impact resistance. Suitable for clear coat, conformal coating and electrical potting applications. The B-755 handles harsh environments easily and is effective against moisture, salt water, acids, alkalies, oils, fuels, solvents and detergents. B-755 produces very low extract products in soak tests and provides corrosion resistance.