Products in Packaging & Assembly: Epoxy & Epoxy Derivatives

DELO KATIOBOND® 4670 is a modified epoxy resin , 1C , UV-curing free of solvents , filled, high ion purity , electrically insulating, humidity-resis a tant, flowable, selfleveling, tension-equalizing.

Anchor Seal SY5822P* Straw Clear is anchor-seal epoxy for potting compounds and encapsulants coils and transformers. It is fast cure, general purpose and slight mercaptan (sulfur) odor.

Addison Clear Wave Coatings TCR-1002 is a thermal conductive dual curable epoxy adhesive obtained by cataionic polymerization. It is a one component boron nitride filled non- electrically conductive adhesive ready for use, solvent free, heat curing and thixotropic.

Polytec TC 301 is a standard single component metal filled, heat curing epoxy adhesive with excellent thermal conductivity. Polytec TC 301 was designed for all applications where heat transfer is essential (heat sinking, aluminum or ceramic packaging etc. It has a conveniently long pot and shelf life and is ideal for all dispensing and screen printing applications. TC 301 has an excellent adhesion on metals, ceramic, glass and most plastics. The material can be applied by dispensing or screen and stencil printing.

CLH5185 is a heat cure, low stress, extremely tough, epoxy casting compound. It was specifically designed for casting large bushings, insulators, instrument and power transformers. The cured material exhibits excellent thermal stability and thermal cycling characteristics. This product meets ul94-hb flammability requirements.

Fielco Adhesives Odyssey 1220 is a general purpose, ambient curing, two-part epoxy potting compound for various electrical applications.

Atom Adhesives AA-DUCT 916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good electrical and mechanical properties.

Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.

Atom Adhesives Iron-Bond (Rigid Staking Compound Epoxy Adhesive) is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength. Iron-Bond contains a thixotropic agent which impedes thinning out of the material during heat cure when properly mixed and cured.

Polytec EC 101 is a standard two-component, solvent free, heat curing epoxy resin with a long pot life and excellent electrical conductivity. It is used for high volume chip and substrate bonding, in micro-electronic, medical, hybrids and optoelectronic application. Polytec EC 101 is certified to USP Class VI Biocompatibility Standards. Polytec EC 101 can be cured at 95°C or in rapid cure cycles at higher temperatures. The material can be applied by dispensing, jet-dispensing or manually.

Tough-Seal 41 A is a flame retardant version of Tough-Seal 21. Self-extinguishing flame retardant performance has been validated by UL and KEY Tough-Seal 41A/Bhas achieved a UL94V-0 rating. KEY Tough-Seal 41A/Bachieves flame retardant properties without antimony and brominated compounds.

Super SAP® CCR/CCS is a clear, UV-stabilized epoxy system designed specifically for casting, potting, and embedding applications. Low color and low viscosity allow for bubble-free, crystal-clear castings ideal for art and hobby applications. This Super Sap® Formulation features two hardener speeds: slow (CCS) for high-build casting epoxy applications and fast (CCF) for quick, small project fast casting epoxy applications such as resin jewelry and more.

Bondline 7780 is a medium viscosity epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrate attach, or lid sealing adhesive

The NGAC EC907-34 is a two-part, electrically conductive silver-filled epoxy adhesive that cures at room temperature. It was created for applications that require superior mechanical and electrical properties.

Click Bond CB394-43 - CB394 43ml High-Temperature Epoxy Adhesive Cartridge is a two-part structural paste adhesive capable of room temperature cure. It also exhibits excellent strength at 350°F / 177°C and higher, although at the expense of toughness and peel strength. CB394 is capable of bonding metals, many thermoplastics, and thermoset composites. CB394 is recommended for installation of Click Bond adhesive-bonded fasteners where high-temperature environments are present. CB394 adhesive meets the specifications of MMM-A-132 Rev. A, Type I, Class 3.

XRD1018 is a two component, room temperature cure semi-flexible, flame retardant, epoxy system. The system was developed for potting/casting of electrical and electronic components. its use of non-abrasive fillers and convenient 1 to 1 ratio by volume, make it ideal for use in machine dispensing equipment. This product meets ul94-v0 in house flammability testing.

Tough-Seal 22 A is a tough and durable two component, hybrid epoxy elastomer that features a longer gel time than Tough-Seal 21. Tough-Seal is a superior electrical potting compound with excellent thermal cycling performance.

Anchor Seal SY3002 Amber Clear is anchor-seal epoxy for potting compounds and encapsulants coils and transformers. It is good / stable shelf life, low viscosity, unfilled, heat and chemical resistant.

Polytec TC 417 2 is a two component, thermally conductive, electrically insulating epoxy It is used in various thermal management applications, especially for potting of large volumes. Polytec TC 417 2 has an excellent chemical and moisture resistance It has an excellent adhesion to glass, metal, ceramic, FR 4 and most plastics. The room temperature cure allows to bond temperature sensitive substrates very conveniently The material can be applied via dispensing or manual application.

Tough-Seal 24 A a tough and durable two component, hybrid epoxy elastomer that features a higher viscosity than KEY Tough-Seal 22 to limit lateral flow in “glob top” encapsulation. KEY PC2024A/Bis a superior electrical potting compound with excellent thermal cycling performance.

ThreeBond Europe SAS TB3380B has been developed for bonding electrical and electronic parts, which require low outgas. A 2-component epoxy type electroconductive adhesive, it may be cured at room temperature, although curing at an elevated temperature reduces the amount of outgas further.

Atom Adhesives Metal-Bond (Rigid Staking Compound Epoxy Adhesive) is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength. Metal-Bond contains a thixotropic agent which impedes thinning out of the material during heat cure when properly mixed and cured.

Lindoxy 290 is a non-crystallizing, low viscosity epoxidized phenol novolac resin with an average functionality of 3. Lindoxy 290 is designed for composites that require a high glass transition temperature along with great chemical resistance.

Bondline 6577 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.

Nuceq R9-2039/HD-3404 system is a 100% solids epoxy compound.

CLH6230 is a semi-flexible epoxy casting system. This product was specifically developed for potting/casting of electrical and electronic components. The long pot life of the material makes it suitable for large mass castings or heat induced curing with minimal stress. Product passes Ul 94-Hb In-house flammability testing. for a softer system, Clr 350 is recommended. using the same cure schedule, Clr 3516, a black version of Clr 3517, passed class B, 130C. when tested to Ul 1446.

PERMABOND® ES569 is a single-part heat cured epoxy adhesive with excellent adhesion to metal surfaces as well as composite materials. The high bond strength of this adhesive allows it to replace mechanical fastening, soldering, brazing or welding. ES569 has been designed to be non-sagging, allowing the product to be used in large gaps and on vertical surfaces. It is also ideal for bonding electronic components as it has high wet strength and is non-stringing and produces an excellent drop profile as well as withstanding solder reflow processes.

Nuceq R9-2039/HD-1095 M1 system is a 100% solid epoxy system that cures at room temperature.

Polytec TC 406 is a pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering. Polytec TC 406 has a good thermal resistance as well an excellent thermal conductivity. The application can be performed directly from the side by side cartridge with a static mixing nozzle, using a dispensing gun.

Addison Clear Wave Coatings AC A1430-B is a UV curable adhesive fo rigid OLED applications, obtained by cataionic polymerization. It is a one component adhesive ready for use, solvent free and it is stable at room temperature.

HYBRID POWDER SYSTEM is a mixture of epoxy and polyester resins, this coating combines chemical resistance, toughness, flexibility, and greater weathering capabilities. The resin combination also leads to good flow and electrostatic spray characteristics. Recommended for interior purposes.

Epilox AF 18-30 is a liquid and solventless blend of standard bisphenol A and bisphenol F epoxy resins with good resistance to crystallization.

Bondline 6570 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.

Anchor Seal SY5380FT* Gray is anchor-seal epoxy for potting compounds and encapsulants coils and transformers. It is used antenna, coil coating, exterior use, outdoor and marine.

Addison Clear Wave Coatings AC A1450-TX is a UV curable epoxy adhesive obtained by cataionic polymerization. It is a one component adhesive ready for use, solvent free and it is stable at room temperature.

Humiseal Epoxy Adhesives Family perform in the most challenging environments due to their robust curing mechanism and resulting strength. Epoxies are used in industries including electronics, automotive, and health care devices among others. Humiseal epoxy adhesives are supplied as 2 components, chemical cure systems.