Products in Packaging & Assembly: Resin

Cosmic Epoxy EH61 is an iron-filled epoxy molding compound provided in a black granular form. It is designed for EMI/RFI shielding applications and can be utilized in compression or transfer molding processes to manufacture core rods or encapsulate surface mount and axial leaded inductors. This single molded compound streamlines the manufacturing process, eliminating the labor-intensive over/under molding steps.

Farboset® 1708 is a specialized epoxy molding compound that combines mineral and short glass fillers, making it well-suited for the encapsulation of coils and other electrical and electronic components. It offers excellent moldability, which is important for achieving precise shapes during the encapsulation process. One of its standout features is its extreme resistance to thermal shock, meaning it can withstand rapid changes in temperature without cracking or degrading.

Cosmic Epoxy E4920FC is a mineral-filled epoxy molding compound available either in granular form or preformed in a variety of sizes and weights. It offers excellent moisture resistance, thermal cycling stability, and outstanding moldability. Parts molded from this material also resist fungus growth and are designed for the encapsulation of passive devices such as capacitors, inductors, diodes, and rectifiers.

DAP 306 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon and supplied in flake form. It is suitable for a variety of applications, including switches, terminals, insulators, cups, cases, and other components that require strength as well as chemical and moisture resistance. It can also be used for the encapsulation of electrical and electronic components.

DAP D33/6120 is a versatile general purpose diallyl ortho-phthalate molding compound that incorporates short glass fibers for added strength. Supplied in a free-flowing granular form, it is designed for ease of use in molding applications. This compound can be easily molded using compression, transfer, or injection equipment, and it can also be readily preformed to suit the specific requirements of the application. Its blend of properties makes it suitable for a range of molding applications where strength and versatility are essential.

Cosmic Epoxy E4920AC is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it suitable for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.

Cosmic Epoxy EH71 is an iron-filled epoxy molding compound available in a black granular form. It is well-suited for EMI/RFI shielding applications and can be used in either compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to streamline the manufacturing process by eliminating the labor-intensive over/under molding steps.

Farboset® 1707-2 is a mineral and glass-filled, anhydride epoxy molding compound that is engineered for the encapsulation of various electrical and electronic components. It is specifically formulated to provide high thermal shock resistance, making it ideal for protecting components that may be subjected to rapid temperature changes or other harsh environmental conditions. This compound helps ensure the reliability and durability of encapsulated components.

Cosmic Epoxy EH31 is an iron-filled epoxy molding compound available in a granular form with a black color. This material is designed for EMI/RFI shielding applications. It can be used for compression or transfer molding to create core rods and encapsulate surface mount and axial leaded inductors. Using this single molded compound can streamline the manufacturing process and eliminate the need for labor-intensive over/under molding.

DAP D72/6120F is a versatile diiallyl ortho-phthalate molding compound, filled with short glass fibers and featuring flame retardant properties. Supplied in a free-flowing granular form, this compound is well-suited for a variety of molding applications. It can be easily molded using compression, transfer, or injection equipment and can be preformed with ease. An important distinction is that it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.

Farboset® 1180 is a granular, glass-filled, general-purpose anhydride epoxy molding compound. It is formulated for encapsulation applications where excellent thermal shock resistance and physical strength are required. This compound helps protect electronic and electrical components by providing thermal shock resistance and maintaining their integrity under challenging conditions.

Cosmic Epoxy EH40 is an iron-filled epoxy molding compound available in a black granular form. It is suitable for EMI/RFI shielding applications and can be used for compression or transfer molding to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the need for labor-intensive over/under molding.

Farboset® 2460 is a novolac epoxy molding compound filled with minerals. It is designed for encapsulating a variety of electrical and electronic components, including tantalum and ceramic capacitors, resistors, resistor networks, and high-performance coils. This compound is formulated to provide fast cure rates, excellent moldability, and superior resistance to thermal shock and moisture. It has been specifically designed to offer improved resistance to moisture ingress, making it a reliable choice for applications where moisture resistance is crucial.

Farboset® 1160 is a granular, mineral-filled, anhydride epoxy molding compound designed for the encapsulation of various electrical and electronic components. It offers fast cure rates, long flow, and excellent thermal shock resistance. This compound is suitable for applications involving the encapsulation of coils, transformers, capacitors, diodes, relays, and other components that require good hot rigidity during the molding process.

Cosmic Epoxy EH51 is an iron-filled epoxy molding compound available in a black granular form. It is designed for EMI/RFI shielding applications and can be used in compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the labor-intensive over/under molding.

Farboset® 1115 is a granular, mineral-filled, anhydride epoxy molding compound with fast cure rates and excellent hot strength. It is specially designed for encapsulating various electrical and electronic components, including coils, transformers, bushings, switches, and more. The material offers good hot rigidity during the molding process and is commonly used in injection and transfer molding applications.

Farboset® 2720 is a mineral-filled epoxy molding compound known for its rapid curing, exceptional moldability, and remarkable resistance to thermal shock and moisture. This compound is tailored to offer enhanced protection against moisture ingress and boasts a high glass transition temperature, making it an ideal choice for ensuring reliability in performance. Its primary purpose is to encapsulate a wide variety of electronic devices, including tantalum and ceramic capacitors, resistors, and resistor networks, providing them with a robust shield against environmental factors and mechanical stress.

Cosmic Epoxy E4920D is a mineral-filled epoxy molding compound that is available in either granular form or as preformed shapes in various sizes and weights. This compound is commonly used for molding applications and offers good versatility in manufacturing processes.

Farboset® 5000 is a novolac epoxy molding compound that contains mineral and glass fillers. It is specifically designed for applications where fast curing, high hot strength, and low abrasion resistance are essential. This compound is well-suited for the encapsulation of solenoid coils and similar applications where electrical and thermal performance are critical.

Cosmic Epoxy E4920VS is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.

Cosmic Epoxy E4940S is a mineral-filled epoxy molding compound supplied in granular form. It offers excellent dimensional stability, improved thermal cycling properties, and exceptional moisture resistance. This product is specifically designed for high-volume encapsulation of resistor networks and fiber-optic connectors that demand high quality, reliability, and excellent moldability.

DAP K43/6260 is a versatile diallyl iso-phthalate molding compound that is filled with minerals and supplied in granular form. This compound is designed for ease of use and versatility. It pours easily, can be preformed, and molds readily using standard compression, transfer, or injection equipment. What sets K43/6260 apart is its exceptional heat resistance, high arc resistance, and ease of molding around inserts. These features make it an ideal choice for applications that demand high-temperature performance and electrical insulation properties, while still allowing for straightforward processing and customization.

Farboset® 1190 is a fast-curing epoxy molding compound that is mineral and glass-filled, and it contains improved strength properties. It is specially designed for encapsulating a variety of electrical and electronic components, such as coils, transformers, switches, and more. Farboset® 1190 is known for its excellent thermal shock resistance and superior resistance to cracking, making it a reliable choice for these applications.

Cosmic Epoxy E4920H is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.

Andisil® Vinyl Polymers are vinyl-terminated dimethylpolysiloxanes that are available in a variety of viscosities. They can be used as base polymers or as blend polymers in order to create the desired hardness. These polymers can be cured with silicon-hydride crosslinkers and a platinum catalyst.

Andisil® Vinyl Polymers are vinyl-terminated dimethylpolysiloxanes that are available in a variety of viscosities. They can be used as base polymers or as blend polymers in order to create the desired hardness. These polymers can be cured with silicon-hydride crosslinkers and a platinum catalyst.

Andisil® Vinyl Polymers are vinyl-terminated dimethylpolysiloxanes that are available in a variety of viscosities. They can be used as base polymers or as blend polymers in order to create the desired hardness. These polymers can be cured with silicon-hydride crosslinkers and a platinum catalyst.

Andisil® Vinyl Polymers are vinyl-terminated dimethylpolysiloxanes that are available in a variety of viscosities. They can be used as base polymers or as blend polymers in order to create the desired hardness. These polymers can be cured with silicon-hydride crosslinkers and a platinum catalyst.

Andisil® Vinyl Polymers are vinyl-terminated dimethylpolysiloxanes that are available in a variety of viscosities. They can be used as base polymers or as blend polymers in order to create the desired hardness. These polymers can be cured with silicon-hydride crosslinkers and a platinum catalyst.

Andisil® Vinyl Polymers are vinyl-terminated dimethylpolysiloxanes that are available in a variety of viscosities. They can be used as base polymers or as blend polymers in order to create the desired hardness. These polymers can be cured with silicon-hydride crosslinkers and a platinum catalyst.

Andisil® Vinyl Polymers are vinyl-terminated dimethylpolysiloxanes that are available in a variety of viscosities. They can be used as base polymers or as blend polymers in order to create the desired hardness. These polymers can be cured with silicon-hydride crosslinkers and a platinum catalyst.

Andisil® Vinyl Polymers are vinyl-terminated dimethylpolysiloxanes that are available in a variety of viscosities. They can be used as base polymers or as blend polymers in order to create the desired hardness. These polymers can be cured with silicon-hydride crosslinkers and a platinum catalyst.

Andisil® Vinyl Polymers are vinyl-terminated dimethylpolysiloxanes that are available in a variety of viscosities. They can be used as base polymers or as blend polymers in order to create the desired hardness. These polymers can be cured with silicon-hydride crosslinkers and a platinum catalyst.

Andisil® Vinyl Polymers are vinyl-terminated dimethylpolysiloxanes that are available in a variety of viscosities. They can be used as base polymers or as blend polymers in order to create the desired hardness. These polymers can be cured with silicon-hydride crosslinkers and a platinum catalyst.

Andisil® Vinyl Polymers are vinyl-terminated dimethylpolysiloxanes that are available in a variety of viscosities. They can be used as base polymers or as blend polymers in order to create the desired hardness. These polymers can be cured with silicon-hydride crosslinkers and a platinum catalyst.

Andisil® Vinyl Polymers are vinyl-terminated dimethylpolysiloxanes that are available in a variety of viscosities. They can be used as base polymers or as blend polymers in order to create the desired hardness. These polymers can be cured with silicon-hydride crosslinkers and a platinum catalyst.