Products in Packaging & Assembly: Conductive

WACKER® Silicone Paste P 12 is a pure white, soft-consistency heat sink paste with marked thermal conductivity. It is electrically insulating. WACKER® PASTE P 12 is used especially in semiconductor technology as a heat sink paste. When there is a need for good heat transfer from a semiconductor to a cooling element, applying a thin coating of WACKER® PASTE P 12 is advisable. In the assembly of semiconductors such as diodes, transistors, and thyristors, microscopic irregularities may exist on the mating surfaces of the semiconductor and the cooling surface. These surface irregularities can hinder firm metal-to-metal contact when assembled.

9460TC is a 1-part, heat cured only, thermally conductive epoxy adhesive with an unlimited working time. It is an off-white, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This 1-part adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. It does not require mixing and is suitable for use with manual, pneumatic, and automatic dispensing systems.

SilCool TIA241GF – Liquid Silicone Thermal Pad TIA241GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling. This thermal gap filler can be used as a liquid alternative for prefabricated solid thermal pads. If lower viscosity is required, use TIA225GF

9400 is an electrically conductive, silver-filled, 1-part epoxy adhesive with a low cure temperature. It is smooth, thixotropic, non-sagging, and bonds well to a wide variety of substances. It has an unlimited working life at room temperature. This product can create electrically conductive bonds where soldering is not an option, such as when bonding to heat-sensitive components, glass, soft metals, or conductive polymers. It also works well in semi-conductor packaging, microelectronic attachment and lid-sealing, and as a die attach for small chips, LEDs and diodes. It does not require mixing and can be readily used in manual, pneumatic and robotic dispensing processes. 9400 has been formulated to have a low Tg, which allows for minimal stress on substrates during temperature changes. For a higher Tg, use 9410.

9410 is a 1-part electrically conductive epoxy adhesive. It has unlimited working time at room temperature. It bonds well to a wide variety of substrates, and offers strong chemical resistance. 9410 is designed for semi-conductor flip chip packaging as well as die attach for small chips, LEDs and diodes. It provides excellent EMI/RFI shielding and is very effective at filling in seams between metal plates. It can be readily used in manual, pneumatic and robotic dispensing processes.

TIA225GF - Silicone Thermal Gap Filler TIA225GF is a two-component, flame retardant, thermally conductive silicone gap filler. It is a smooth, non-sagging paste that easily conforms to the complex shapes of any interface design. The cured product creates a thermal path that efficiently dissipates heat from electronic devices. It retains its softness after cure which maximizes stress relief during thermal cycling. This thermal gap filler can be used as a liquid alternative for prefabricated solid thermal pads. If higher thermal conductivity is desired, use SilCool TIA241GF.

ECP 574/JSF181/4125 Permanently Conductive Clear Flexible Polyurethane Graphene Paint.

ECP 502 JSF023 EMI Shielding Nickel Acrylic Paint single component Nickel/Acrylic conductive coating concentrate provides effective EMI shielding on plastic housings used in the electronics and computer industries. ECP 502/JSF023 EMI Shielding Nickel Acrylic Paint is a single component nickel acrylic conductive coating concentrate that provides effective EMI shielding on plastic housings used in the electronics and computer industries.

SR8850-1 is a room temperature curable, silver coated copper filled, electrically conductive RTV silicone sealant/adhesive. It can be used as a coating if dissolved or diluted with low boiling point solvent, such as naphtha. The material has no corrosive by-products and has good adhesion properties to metals, plastics, silicones, ceramics and glass. It is useful for bonding large area substrates and components of any size. The material is provided as a one-part electrically conductive elastomer/silicone with a compatible primer. The silicone cures when exposed to atmospheric conditions. The typical curing schedule is 24 hours at 25°C and 60% relative humidity. Using a large volume of paste requires a cure schedule of 48 hours at 25°C and 60% relative humidity.

ECP 573/JSF180/4124 Permanently Conductive Transparent Graphene Hybrid Acrylic Paint sprayable acrylic paint. It is a single component permanently conductive clear acrylic coating that provides effective static elimination for electronics safe handling area and explosive atmosphere applications. Fully compliant with BS EN 61340- 5.1:2007 and ATEX. It contains carbon nanotubes, a graphene derivative.

ECP 531 Conductive carbon acrylic paint is a single component, air-drying, carbon/acrylic costing. The paint is formulated to apply to most plastic substrates and is used in applications where anti-static and ESD (electrostatic discharge) protection is required.

Tack-Free ESP8350 is a reworkable, silver-filled, epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. This novel, B-staged electrically conductive adhesive offers excellent reworkability from 80 to 150°C. The dry, tack-free handling of the film makes it suitable for an automated assembly. ESP8350 has excellent thermal conductivity. Its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing. This frilm is reinforced with 1.5 mil fiberglass.

ECP 592 Permanently Conductive Graphene Hybrid Clear Acrylic Coating Aerosol. It is a Single component permanently conductive graphene hybrid clear acrylic coating that provides effective static elimination for electronics safe handling area and explosive atmosphere applications. Fully compliant with BS EN 61340-5-1:2007 and ATEX. Contains carbon nanotubes and graphene derivatives.

ECP 526 Anti Static Conductive Two Pack Epoxy Paint is a high quality waterborne two-pack epoxy system. Environmentally friendly, it offers the advantages of low odor and easy cleaning of equipment with water.

ECP 505 EMI Shielding Silver Plated Copper Paint Is supplied ready for use, it is designed to give low resistance in thin film thickness, and exhibits excellent EMI shielding and grounding properties displaying excellent adhesion to most plastics and is ideal for electronic equipment housing. It exhibits excellent long term shielding and grounding properties while providing an esthetically pleasing appearance.

ECP 575/JSF182/182 Permanently Conductive Clear Two Pack Water-based Epoxy Graphene Paint for use in the electronics industry where ESD (electrostatic discharge) is to be avoided, ECP 575/JSF182/182 is a high quality waterborne two-pack epoxy system. Environmentally friendly it offers the advantage of low odor and easy cleaning of equipment with water. ECP 575/JSF182/182 finds applications in such areas as floor coatings, particularly where the previous coating is unknown as solvent will attack many coatings causing them to lift.

MEB650-DA is a low viscosity silver filled flexible epoxy paste. This low ionic silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It is ideal for automatic dispensing in die- attach application with fine definition. Absolutely solvent-free and diluent free composition with low ionic impurities for high reliability. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This stress free adhesive shows consistent medium bond strength up to 250°C at 200 psi.

ME8452-A is an accelerated version of ME8452 for snap-curing applications.This novel silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE'S (i.e., alumina to aluminum, silicon to copper). It can be readily reworked from 80°C to 100°C and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE.

ME8630-DA is an extra fine silver filled 100% solid low viscosity die-attach for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. ME8630-DA has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes. It maintains more than 300 psi bond strength at 250°C for high temperature wire-bonding.