Products in Packaging & Assembly: Fast Curing

Turbo Fuse Series 160 advanced formula is designed to polymerize instantly by absorbing surface moisture. The product's performance has been tested with a variety of materials, and is recommended for a multitude of applications. The fast curing qualities make it especially desirable in high speed industrial production. Turbo Fuse Series 160 is ideal for use in applications that require an easily handled high viscosity adhesive. This formula is widely used in the Aerospace, Automotive and Electronic industries.

ME7857-SC is a medium viscosity, silicon carbide filled, flexible epoxy for snap curing application. It is a reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility down to -60°C. Ideal for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible adhesive maintains good stable bond strength of 100 psi from 150-250°C and has outstanding thermal stability.

MEB650-DA is a low viscosity silver filled flexible epoxy paste. This low ionic silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It is ideal for automatic dispensing in die- attach application with fine definition. Absolutely solvent-free and diluent free composition with low ionic impurities for high reliability. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This stress free adhesive shows consistent medium bond strength up to 250°C at 200 psi.

ME7635-RC is an thermally conductive insulating epoxy adhesive for die-attach applications. This thixotropic paste is solvent free. It is designed for automated, inline bonding processing ME7635-RC is low in ionic impurities (<60 ppm total) and meets all requirements for MIL-Std 883D 5011.4 specification for dielectric adhesive. Fast curing can be achieved from 80°C and higher temperatures.

ME7863 is a one part, quartz filled cyanate ester die attach adhesive. It was designed for solder-sealed ceramic packages. It can withstand temperatures up to 300°C without thermal degradation. ME7863 has processing characteristics required in high speed automation. Its unique chemistry results in very low moisture absorption, high adhesive strength and low CTE.

Turbo Fuse Series 160 SI advanced formula is designed to polymerize instantly by absorbing surface moisture. The product's performance has been tested with a variety of materials, and is recommended for a multitude of applications. The fast curing qualities make it especially desirable in high speed industrial production. Turbo Fuse Series 160 SI is ideal for use in applications that require an easily handled high viscosity adhesive. This formula is widely used in the Aerospace, Automotive and Electronic industries.

Turbo Fuse Series 170 advanced formula is designed to polymerize instantly by absorbing surface moisture. The product's performance has been tested with a variety of materials, and is recommended for a multitude of applications. The fast curing qualities make it especially desirable in high speed industrial production. Turbo Fuse Series 170 is ideal for use in applications that require an easily handled high viscosity adhesive. This formula is widely used in the Aerospace, Automotive and Electronic industries.

UV-8509R is a non-sag, fast curing, urethane acrylate that bonds well to engineered plastics and metal based substrates. This product requires direct UV exposure during cure. Because of the variability of different UV light sources it is suggested that the user test and specify UV intensity and exposure time. This material is specially formulated to have reduced surface tack due to oxygen inhibition.

Turbo Fuse Series 110 - Low Odor/Low Bloom advanced formula is designed to polymerize instantly by absorbing surface moisture. The product's performance has been tested with a variety of materials, and is recommended for a multitude of applications. The fast curing qualities make it especially desirable in high speed industrial production. Turbo Fuse is ideal for use in applications that require good "wicking" characteristics and/or in close fitting applications. The Low Odor/Low Bloom formula is widely used in the Aerospace, Automotive and Electronic industries.

Turbo Fuse Series 130 - Low Odor/Low Bloom advanced formula is designed to polymerize instantly by absorbing surface moisture. The product's performance has been tested with a variety of materials, and is recommended for a multitude of applications. The fast curing qualities make it especially desirable in high speed industrial production. Turbo Fuse is ideal for use in applications that require good "wicking" characteristics and/or in close fitting applications. The Low Odor/Low Bloom formula is widely used in the Aerospace, Automotive and Electronic industries.

Turbo Fuse Series 160 - Low Odor/Low Bloom advanced formula is designed to polymerize instantly by absorbing surface moisture. The product's performance has been tested with a variety of materials, and is recommended for a multitude of applications. The fast curing qualities make it especially desirable in high speed industrial production. Turbo Fuse Series 160 is ideal for use in applications that require an easily handled high viscosity adhesive. The Low Odor / Low Bloom formula is widely used in the Aerospace, Automotive and Electronic industries.

Turbo Fuse 170 SI is a cyanoacrylate adhesive is designed to bond difficult materials substrates. Gives you extra bonding capabilities with plastic, Viton rubber and EPDM rubber.

Turbo Fuse Series 120 - Low Odor/Low Bloom advanced formula is designed to polymerize instantly by absorbing surface moisture. The product's performance has been tested with a variety of materials, and is recommended for a multitude of applications. The fast curing qualities make it especially desirable in high speed industrial production. Turbo Fuse is ideal for use in applications that require good "wicking" characteristics and/or in close fitting applications. The Low Odor/Low Bloom formula is widely used in the Aerospace, Automotive and Electronic industries.

ME8630-DA is an extra fine silver filled 100% solid low viscosity die-attach for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. ME8630-DA has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes. It maintains more than 300 psi bond strength at 250°C for high temperature wire-bonding.

SETWORX™ 60 is a toughened, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties.

ME7665-DA is a rapid curing dielectric die-attach thermal adhesive. It contains alumina crystallite of less than 3 micron in particle size. It is a fast curing insulating epoxy adhesive for snap-curing applications. This thixotropic (TI is approx. 4.0) paste is solvent free. It is designed for automated, online bonding processing. ME7665-DA-LV is thermally conductive with less than 20 ppm ionic impurities. It can be dispensed with traditionally pressure-time or more accurately with positive volumetric dispenser. It has medium viscosity and high thixotropic index.

UVX‐070219 is a low viscosity, fast curing urethane acrylate that bonds well to engineered plastics and metal substrates. This product requires direct UV exposure during cure. Because of the variability of different UV light sources it is suggested that the user test and specify UV intensity and exposure time. This material is specially formulated to have reduces surface tack due to oxygen inhibition.

ME7655-RC is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding high-powered, large area die and components. ME7655-RC can be cured at 150°C for 30 minutes without creating voids. It can be readily reworked at 80-100°C.

ME8650-RC is designed for needle dispensing and screen-printing processing. This silver filled conductive die-attach adhesive can be rapidly cured at low temperatures. This single component, silver filled paste is ambient storable electrically and thermally conductive. It is highly thixotropic with minimal sag. ME8650-RC has been designed to minimize bleeding on both silver plated copper and alloy 42 lead frames. Maintains more than 100 psi bond strength at 250°C for wire-bonding.

SetWORX™ 05 is a fast cure, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties. The high performance epoxy provides excellent bond strengths to a wide variety of plastics and metals.

ME7656 is a reworkable, boron-nitride crystallite filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The very high thermal conductivity of this material makes it useful for bonding high- powered, large area die and components.

Chem-Mat Technologies Inc. EC200LV is the conductive adhesive and thermally conductive adhesive which is widely used in optoelectronics, general electronic motors, and the electrical and thermal conductivity products required by the industry. Such as integrated circuit bonding, LED chip bonding, fixing of automotive motor diodes, etc. EC200LV is also suitable for conductive and thermally conductive coating and bonding of metals, ceramics, glass and other materials.

ABchimie™ 746E UV is a single transparent component designed to protect printed circuit boards in harsh environments. It uses dual cure technology (UV/humidity) to crosslink in the shadows. ABchimie746E UV can be applied with a brush, pad printing, spray machine, and, of course, a selective coating machine, which is the best method. Because of our system's low viscosity, we can limit the thickness to around 80 microns.

Anchor Seal SY6011F2 Clear is anchor-seal epoxy for potting compounds and encapsulants coils and transformers. It is fast curing, clear, adhesive coating.

Anchor Seal SY5822P* Straw Clear is anchor-seal epoxy for potting compounds and encapsulants coils and transformers. It is fast cure, general purpose and slight mercaptan (sulfur) odor.

ABchimie™ 746E UV LED is a single transparent component designed to protect printed circuit boards in harsh environments. It has dual cure technology (UV/LED - humidity) for shadow crosslinking. ABchimie746E UV LED can be applied using a brush, pad printing, spray machine, and, of course, a selective coating machine, which is the best method. Because of our system's low viscosity, we can limit the thickness to around 80 microns.