Products in Packaging & Assembly: Good Thermal Stability

ELASTOSIL® RT 607 A/B is a pourable, addition-curing RTV-2 silicone rubber with a two-part formulation and a 9:1 mixing ratio. It has low viscosity and offers rapid heat cure. The cured rubber exhibits high hardness and excellent heat stability. Additionally, it is flame retardant, making it suitable for general purpose encapsulation. This product can also be used as a potting material for electrical coils of lifting magnets and for slot exit potting of electrical coils.

ELASTOSIL® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber with a two-part formulation and a 1:1 mixing ratio. It features a very high hardness (Shore A) and excellent heat stability. This silicone rubber is particularly known for its high thermal conductivity, making it ideal for the encapsulation of electronic components.

ELASTOSIL® RT 602 A/B is a pourable, addition-curing RTV-2 silicone rubber with a two-part formulation and a 9:1 mixing ratio. It has low viscosity and offers rapid heat cure. The cured rubber exhibits a medium hardness and excellent heat stability. This product is suitable as a general purpose encapsulant.

ELASTOSIL® E70 is a flowable, one-component, acetoxy-cure silicone rubber that cures at room temperature under the influence of atmospheric moisture. It shows excellent primerless adhesion to many substrates and outstanding heat stability even in long-term exposure. It is a high-temperature-resistant grade for sealing and bonding applications under high thermal stress.

ELASTOSIL® N288 is a low-viscosity, ready-to-use, neutral crosslinking silicone rubber. It cures at room temperature under the influence of atmospheric moisture. It exhibits excellent heat stability, excellent primerless adhesion to many substrates, permanent temperature exposure up to 200 °C, and peak temperatures up to 250°C.

CHT Group SilSo Lite 21025 is a two-part, room-temperature, platinum-cure, self-blowing silicone foam designed for liquid dispensing. This product is ideal for potting in applications where lightweight and thermal protection are required. Its viscosity profile enables excellent flow around components, and it is excellent for potting complex parts. The chemical composition results in a cured product that is hydrolytically stable as well as reversion-resistant. The cured product provides electrical insulation and physical shock resistance for components and enables environmental protection.

CHT Group SilSo Clear 21002 is a transparent and colorless silicone formulation that is ideal for optical injection molding applications. Its viscosity profile enables excellent flow around components, and it is excellent for potting complex parts. The chemical composition results in a cured product that is hydrolytically stable as well as reversion-resistant. The silicone elastomer provides electrical insulation and physical shock resistance for components and enables environmental protection.

CHT Group QSil 58 is a high-temperature, self-leveling, two-component silicone material that is primarily used for potting applications. The two applicable catalysts are 0.5% DBT by weight and 10% deep-section catalyst by weight. The 0.5% catalyst level can be increased or decreased to obtain the desired cure speed. Cure speed can be accelerated by adding DBT catalyst in 0.1% increments. This can be catalyzed with a 10% deep-section catalyst for applications requiring a deeper cure. The material can also be vulcanized at temperatures up to 70°C to increase cure speed.

127-31 is an extremely flexible one-component, syringe dispensable, 100% solids, thermally conductive, electrically insulating soft epoxy adhesive, encapsulant, and potting compound. This system features excellent thermal stability, chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 127-31 features a low durometer and is highly flexible allowing it to absorb stress when bonding mismatched CTE substrates. 127-31 even displays some elastomeric properties. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding.Features Elastomeric Flexible thermally conductive adhesive/potting compound

SC-550-LV-TC-1 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-1 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

SC-550-LV-RT is a 100% silicone solid elastomer designed for electronic potting applications. This two-component, room temperature curing system offers a hard, self-bonding, thermally conductive, low modulus material that is readily re-workable.

SC-550-LV-TC-2 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-2 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

118-06-F is a B-staged, electrically conductive, transferable, epoxy adhesive film. The 118-06-F Series was developed with wafer manufacturing in mind. Some other applications for 118-06-F include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembling electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the B-staged form. This product is available in thicknesses from 1 to 5 mils (see product codes below). 118-06-F is designed with the performance criteria of Mil-Std-883 5011.4 in mind and is expected to pass ASTM E-595 outgassing testing when fully and properly cured.Features Excellent Electrical Conductivity. Easy Liner Release. Excellent Chemical Resistance. Low Ionics.

Tack-Free ESP 7455 is an alumina-filled, epoxy film adhesive designed for bonding component and substrate to a mismatched substrate or carrier. The dry, tack-free handling of the film makes it suitable for an automated assembly. The adhesive film has very low ionic impurities of less than 10 ppm and high thermal stability with TGA degradation at 450°C. ESP7455 has good thermal conductivity. The extra low Tg of -60°C helps to minimize thermal stress on the bonded parts during thermal cycling or shock testing from -55 to 150°C.

ESP7666-FOW is the modified boron nitride filled thermally conductive version of the high flow DAF of ESP7660-FOW. It is a high-bond strength epoxy film adhesive tor high flow when melted to easily flow over Wire-bond in stack chip die attach application. This new generation wafer level die- attach film is flexible before curing. This ESP7660-FOW is mounted onto the back of the wafer at 80-100°C, which is then diced into predetermined sizes using standard dicing tape. Depending on the different dicing tape used and with suitable releasing action such as UV or heat, the diced chip is picked and placed directly onto a lead frame or substrate. It is designed for bonding component and substrate to substrate and carrier with matched thermal coefficients of expansion. ESP7660-FOW has good thermal stability. The dry, tack-free handling of the film makes it suitable for an automated assembly.

EPOXIBOND™ EB-116 is high strength, structural epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties and is excellent for cryogenic applications. It is recommended for bonding glass, metal, ceramics, and engineering thermoplastics. Due to its low viscosity, it can be also used for potting and encapsulating electrical/electronic coponents

CGSTAPE - 8468 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

CGSTAPE - 8458 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

ME7857-SC is a medium viscosity, silicon carbide filled, flexible epoxy for snap curing application. It is a reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility down to -60°C. Ideal for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible adhesive maintains good stable bond strength of 100 psi from 150-250°C and has outstanding thermal stability.

ESP7660-HK-DAF is a high-bond strength epoxy film adhesive laminated onto a UV release or controlled release dicing tape in designed wafer format. This new generation film incorporates wafer dicing tape and adhesive film into one DDAF (Dicing Die Attach Film). This DAF is mounted onto the back of the wafer, which is then diced into predetermined sizes. After a brief exposure to UV light (for UV releasing dicing tape), the diced chip is picked and placed directly onto a lead frame or substrate. It is designed for bonding component and substrate to substrate and carrier with matched thermal coefficients of expansion. ESP7660-HK-DAF has good thermal stability. The dry, tack-free handling of the film makes it suitable for an automated assembly.

CGSTAPE - 8258K is a Kapton® HN backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

124-07-F is a B-staged, one part epoxy coating and laminating adhesive film. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings. This product is available in thicknesses from 1 to 5 mils.

CGSTAPE - 8258 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

124-33-F is an electrically conductive, transferable, thermoplastic adhesive film. Some applications for the 125-33- F series include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembly of electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handleability. This product is available in thicknesses from 1 to 5 mils.

114-26 B is a medical grade, electrically conductive, polymer coated polyester film composition. It is typically used as a component for fabricating electrodes in medical testing applications. This product has been formulated to have improved conductivity and high electrical dissipation properties. Some added applications for 114-26 B include, but are not limited to, emi/rfi shielding, polymer thick film circuitry, membrane switches and electrical static dissipation. 114-26 B is available in rolls ranging in widths up to 20 inches and lengths up to 2000 feet.

SetWORX™ 1510 is a fast setting, toughened epoxy adhesive designed for industrial grade applications. This epoxy system has 1:1 mixing ratio by volume & cure fast at room temperature. When cured it is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator. The cured adhesive exhibits high impact resistance and exceptional bond strength. It can be used for bonding glass, metals, woods and some plastics.

FLASHBOND™ UV-5402 is a low viscosity, flexible, light curing epoxy adhesive that offers excellent strenth and flexibility for reduced cracking. UV-5402 is low viscosity and high elongation. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400-415nm) and can also cure down to 365nm.

125-22-F is a B-staged, electrically conductive, transferable, epoxy adhesive film. Some applications for 125-22-F include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembling electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the Bstaged form. This product is available in thicknesses from 1 to 5 milsFeatures Excellent Electrical Conductivity Easy Liner Release Excellent Chemical Resistance Minimal Flow During Cure Low CTE Excellent High Temperature Performance

CGSTAPE - 8459 is a polyimide backing and acrylic adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat are required.

904-64-4 is a two component, thermally conductive, high performance room temperature addition curing silicone.

TG-45LV is a specially formulated with low viscosity/screen printable consistency to achieve low BLT and high thermal conductivity for optimum thermal performance. Exhibits excellent resistance to pump out, outgassing and phase separation while eliminating concern of silicone deposition on optics and electronics within any package. TG-45LV is high performance thermal grease designed to meet the thermal, reliability and low-price requirements of high-end chipset, graphic processors trend ever-faster clock speeds. RoHS compliant and halogen -free

CGSTAPE - 8959 is a anti-static treated polyimide backing with a non-silicone acrylic adhesive offers outstanding thermal resistance andexcellent electrical insulating properties. This tapeis used where toughness, puncture resistance, extreme resistance to heat.

126-37-F is an anisotropically conductive transferable low CTE adhesive film. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other substrates. 126-37 is designed to exhibit minimal flow during bonding. This product provides superior electrical conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to aluminum, ceramic, and a variety of other substrates. This system features excellent thermal stability and flexibility in the B-Staged form. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. The product can be re-bonded many times by simply adding heat and slight pressure