Products in Packaging & Assembly: Good Thermal Stability

904-64-4 is a two component, thermally conductive, high performance room temperature addition curing silicone.

126-28 is a carbon filled, screen-printable, electrically conductive ink suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. 126-28 can be useful in biomedical applications, biosensors, printed heaters, resistive elements and coatings, and for electronic component manufacturing. 126-28 is designed to be age and chemically resistant.Features Very flexible resistive ink

125-50 is an opaque white, screen printable, one component, epoxy, solder mask. This product features excellent adhesion to Kapton, Mylar, aluminum, FR-4 boards, glass and a variety of other substrates. Unlike conventional dielectric materials, this product is very resistant to abrasion, scratching, and thermal aging. Applications for 125-50 include, but are not limited to, solder resistant coatings for electrical and electronic devices.Features Opaque White epoxy dielectric, adheres to ITO.

CGSTAPE - 8358K is a Kapton® HN backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

CGSTAPE - 8958 is a anti-static treated polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat.

CGSTAPE - 8158 is a polyimide backing and acrylic adhesive offers excellent chemical and thermal resistance with excellent electrical insulating properties. This tape is used where toughness and puncture resistance are required.

TG-45LV is a specially formulated with low viscosity/screen printable consistency to achieve low BLT and high thermal conductivity for optimum thermal performance. Exhibits excellent resistance to pump out, outgassing and phase separation while eliminating concern of silicone deposition on optics and electronics within any package. TG-45LV is high performance thermal grease designed to meet the thermal, reliability and low-price requirements of high-end chipset, graphic processors trend ever-faster clock speeds. RoHS compliant and halogen -free

102-32G1 is a flexible electrically conductive silicone adhesive. 102-32G1 features the highest degree of thermal and mechanical reliability over any other conductive adhesive technology and provides no failures during thermal cycling, heat aging, shocking or vibration due to the reliability from the elasticity of theproduct. Some applications for 102-32G1 include, but are not limited to, elastomeric conductive bridging and bonding, conductive bonding of low surface energy materials, conductive via filling and electrical attachments for stress sensitive devices. 102-32G1 is one of the few conductive adhesives that can bond to silicone substrates and surfaces. In addition, it can be bonded to some types of Teflon® surfaces. 102-32G1 features better conductivity than 102-32 when cured at lower temperatures

CGSTAPE - 8358 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

127-03-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 127-03-F include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and high temperature properties and is able to absorb stress when bonding mismatched CTE substrates. This product has been formulated to have improved handling in the B-staged form and is available in thicknesses from 1 to 5 milsFeatures Excellent Thermal Conductivity. Easy Liner Release. Excellent Chemical Resistance. Minimal Flow During Cure. Low CTE. Excellent High Temperature Performance.

CGSTAPE - 8558 is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

STG-51TC Heat Sink Compound is silicone thermal grease material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. STG-51TC specially developed to solve the problems of contamination and migration associated with silicone-based products. The compound is a unique synthetic-based thermal grease use to insure quick, efficient heat transfer and dissipation

CGSTAPE - 8358HT is a polyimide backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

CGSTAPE - 8257S is a polyimide backing and silicone adhesive offers ex- cellent chemical and thermal resistance with excellent electrical insulating properties.

CGSTAPE - 8458K is a Kapton® HN backing and silicone adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat, and flame retardance are required.

WESCOAT® AX03P6 is a coating product that will guarantee performance and longer lifespans. WESCOAT® AX03P6 addresses the electrical, thermal, wear and erosion issues.

BONDiT™ B-521 is a two-part, state-of-the-art 100% solids, elevated-temperature, fast curing, semi-flexible epoxy resin system. Especially designed for adhesive applications in bonding engineering plastics and elastomers to various substrates–particularly rigid substrates such as glass, metals and ceramic, without stress build up and joint or substrate fracture.

NuSil™ R21-2615 is a optically clear, high durometer silicone elastomer.

WESCOAT® AX04P6 is a coating product that will guarantee performance and longer lifespans. WESCOAT® AX04P6 addresses the chemical, thermal, wear and erosion issues.

NuSil™ R-2615-3 is a red potting and encapsulating silicone elastomer.

NuSil™ EPM-2422 is used as a low stress alternative for electronic packaging, NuSil Technology's silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications.Benefits of Silicone for Electronics: Wide Operating Temperature Range of -115 °C to 250 °C Low moisture absorption, < 0.4% Typical Corrosion Resistance High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm Fillers can be added to provide thermal and electrical conductive properties Low Modulus (Typically less than 5.5 MPa/800 psi) Stable chEMIcal and mechanical properties when exposed to high temperatures Low Shrinkage Available as gels, elastomers, film adhesives sheeting, and greases General Purpose: Potting and Encapsulating MaterialsComments: 1.43 Refractive Index.

LightSpan® LS-3140 is from LEDs to fiber optics, NuSil Technology's LightSpan™ brand product line delivers the most comprehensive line of refractive index matching adhesives, encapsulants and thermosets available.The benefits of silicone include the following: Thermal Stability Low Ionic Species Maintain Optical Clarity (90% minimum @ 400nm) Low Moisture Absorption (<0.4%) Optimization for UV Resistance Adjustable Cure Low Outgassing Low Shrinkage, <1% Low Modulus: Stress reduction for bonding materials with different coefficients of thermal expansion Gernal Purpose: Optical GelsComments: Low Volatility, Penetration 0.4 mm, non-phenyl containing.

LightSpan® LS-3354 is from LEDs to fiber optics, NuSil Technology's LightSpan™ brand product line delivers the most comprehensive line of refractive index matching adhesives, encapsulants and thermosets available.The benefits of silicone include the following: Thermal Stability Low Ionic Species Maintain Optical Clarity (90% minimum @ 400nm) Low Moisture Absorption (<0.4%) Optimization for UV Resistance Adjustable Cure Low Outgassing Low Shrinkage, <1% Low Modulus: Stress reduction for bonding materials with different coefficients of thermal expansion Gernal Purpose: Optical GelsComments: Use with Phosphor.

NuSil™ EPM-2480 is used as a low stress alternative for electronic packaging, NuSil Technology's silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications.Benefits of Silicone for Electronics: Wide Operating Temperature Range of -115 °C to 250 °C Low moisture absorption, < 0.4% Typical Corrosion Resistance High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm Fillers can be added to provide thermal and electrical conductive properties Low Modulus (Typically less than 5.5 MPa/800 psi) Stable chEMIcal and mechanical properties when exposed to high temperatures Low Shrinkage Available as gels, elastomers, film adhesives sheeting, and greases General Purpose: GelsComments: Useful for Potting Intricate Assemblies Due to Low Viscosity.

LightSpan® LS-3441 is from LEDs to fiber optics, NuSil Technology's LightSpan™ brand product line delivers the most comprehensive line of refractive index matching adhesives, encapsulants and thermosets available.The benefits of silicone include the following: Thermal Stability Low Ionic Species Maintain Optical Clarity (90% minimum @ 400nm) Low Moisture Absorption (<0.4%) Optimization for UV Resistance Adjustable Cure Low Outgassing Low Shrinkage, <1% Low Modulus: Stress reduction for bonding materials with different coefficients of thermal expansion Gernal Purpose: Optical GelsComments: Firm and Tacky Gel, Penetration 0.4 mm, non-phenyl containing.

WESCOAT® AX02P6 is a coating product that will guarantee performance and longer lifespans. WESCOAT® AX02P6 addresses the electrical, thermal, wear and erosion issues.

LightSpan® LS2-6140 is a optically clear primerless silicone encapsulant.

LightSpan® LS-3238 is from LEDs to fiber optics, NuSil Technology's LightSpan™ brand product line delivers the most comprehensive line of refractive index matching adhesives, encapsulants and thermosets available.The benefits of silicone include the following: Thermal Stability Low Ionic Species Maintain Optical Clarity (90% minimum @ 400nm) Low Moisture Absorption (<0.4%) Optimization for UV Resistance Adjustable Cure Low Outgassing Low Shrinkage, <1% Low Modulus: Stress reduction for bonding materials with different coefficients of thermal expansion Gernal Purpose: Optical GelsComments: Resistant to Hydrocarbon Solvents.