Products in Packaging & Assembly: Thixotropic

Atom Adhesives Steel-Bond is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength. Steel-Bond contains a thixotropic agent which impedes thinning out of the material during heat cure when properly mixed and cured.

Resinlab® SEC1244 Part A is a silver filled, two component, elevated temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications. It is a smooth 100% solids thixotropic solvent free paste provided in a 1:1 weight ratio. This product will cure very quickly at high temperatures. SEC1244 provides the additional benefit of very high thermal conductivity due to its high loading of pure silver. Alloys are not used as they have been proven to be less reliable. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials.

DELO KATIOBOND® 4578 is a modified epoxy resin , 1C , preactivated free of solvents , unfilled, thixotropic , preactivated, electrically insulating.

DELO KATIOBOND® 45952 is a modified epoxy resin , 1C , preactivated free of solvents , unfilled, thixotropic , preactivated, electrically insulating, tension-equalizing.

Aptek® 6512-Pmf is a one component, 100% solids, silver-filled, electrically conductive epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards. Aptek® 6512-Pmf displays excellent adhesion to various metal, ceramic, and PC board substrates. Aptek® 6512-Pmf Electronic-grade, conductive adhesive.

DELO DUALBOND® FB4780 is a modified acrylate , 1C , UV- / Vis a - / heat-curing free of solvents , thixotropic , dual-curing, peel-resis a tant.

DELO KATIOBOND® 4594 is a modified epoxy resin , 1C , preactivated free of solvents , unfilled, thixotropic , preactivated, electrically insulating.

BONDiT™ B-755 is a unique low viscosity, two-part, high strength, 100% solids, room-temperature curing semi-rigid cyclo-aliphatic epoxy resin system with good scratch and impact resistance. Suitable for clear coat, conformal coating and electrical potting applications. The B-755 handles harsh environments easily and is effective against moisture, salt water, acids, alkalies, oils, fuels, solvents and detergents. B-755 produces very low extract products in soak tests and provides corrosion resistance.