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Other Packaging & Assembly Applications
Products in Other Packaging & Assembly Applications: Polyamides
8 Products found in Other Packaging & Assembly Applications
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Ensinger GmbH
TECACOMP PA66 ID blue 4067
Polymer Name:
Polyamide 66 (PA 66)
Processing Methods:
Injection Molding
Fillers Included:
Other Filler
Ensinger GmbH
TECACOMP PA66 ID blue 4087
Polymer Name:
Polyamide 66 (PA 66)
Processing Methods:
Injection Molding
Fillers Included:
Other Filler
Ensinger GmbH
TECACOMP PA66 ID blue 1050909
Polymer Name:
Polyamide 66 (PA 66)
Processing Methods:
Injection Molding
Fillers Included:
Other Filler
CRP Technology
Windform® LX 3.0
Polymer Name:
Polyamide (unspecified)
Processing Methods:
Selective Laser Sintering, 3D Printing
Fillers Included:
Glass Fiber
Flexural Modulus:
5465.2 - 5465.2 MPa
Windform® LX 3.0 has improved the already excellent performance of Windform® LX 2.0. These improvements can be noticed from a sinterability standpoint. Windform® LX 3.0 maintains the Windform® LX 2.0’s technical and thermal properties; it is also not electrically conductive. Windform® LX 3.0 is a composite polyamide based material which is reinforced with a new generation glass fiber system. It is a naturally black material and is characterized by good Tensile Strength and stiffness. Windform® LX 3.0 is also characterized by high level of temperature resistance (HDT, 1.82 Mpa is 175,9°C / 348.62 °F). Windform® LX 3.0 has an excellent surface finish in its sintered state; it is perfect for components with fine details. Windform® LX 3.0 is highly recommended for applications that require a strong visual impact and for aesthetical parts. Windform® LX 3.0’s impact resistance properties at room and low temperature are similar. Windform® LX 3.0 is an entry-level material and is perfect for creating functional prototypes or finished parts that require reliability, resistance and aesthetical properties.
Ensinger GmbH
TECACOMP PA6 ID blue 1053686
Polymer Name:
Polyamide 6 (PA 6)
Processing Methods:
Injection Molding
Fillers Included:
Other Filler
Ensinger GmbH
TECACOMP PA66 ID blue 4066
Polymer Name:
Polyamide 66 (PA 66)
Processing Methods:
Injection Molding
Fillers Included:
Other Filler
Nylene
Nylene® 401
Polymer Name:
Polyamide 6 (PA 6)
Processing Methods:
Injection Molding
Flexural Modulus:
2690.0 - 2690.0 MPa
Nylene General purpose un-reinforced nylon 6 injection molding resin. High flow characteristics at minimal processing temperatures Suitable for applications in both thin and heavy sections that require typical nylon characteristics and easy molding
Nylene
Nylene® 401D
Polymer Name:
Polyamide 6 (PA 6)
Processing Methods:
Injection Molding, Extrusion
Nylene Specially formulated nylon 6 molding resin possessing outstanding flow characteristics Ideally suited for applications requiring high flow properties and resistance to cracking Optimum processing conditions should provide a melt temperature of 450 - 470°F at nozzle