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Potting Compounds
Products in Potting Compounds: Coupling Agent
9 Products found in Potting Compounds
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Wacker Chemie AG
GENIOSIL® GF 82
Chemical Family:
Silanes
Functions:
Adhesion Promoter, Coupling Agent
Product Type:
Primer
Application Method:
Air Knife Coating, Spray
Synonyms:
[[3-(Triethoxysilyl)propoxy]methyl]oxirane, [3-(Glycidoxy)propyl]triethoxysilane, [3-(Glycidyoxy)propyl]triethoxysilane, 2-[[3-(Triethoxysilyl)propoxy]methyl]oxirane, 3-(2,3-Epoxypropoxy)propyltriethoxysilane, 3-(2,3-Epoxypropyloxy) propyl triethoxy silane, 3-(Glycidyloxypropyl)triethoxysilane, 3-(Triethoxysilyl)propyl glycidyl ether, 3-Glycydoxylpropyltriethoxysilane, Epoxypropoxypropyltriethoxysilane, Glycidyl 3-(triethoxysilyl)propyl ether, Triethoxy(3-glycidoxypropyl)silane, Triethoxy[3-(2-oxiranylmethoxy)propyl]silane, γ-(2,3-Epoxypropoxy)propyltriethoxysilane, γ-(Glycidyloxypropyl)triethoxysilane, γ-Glycidoxypropyltriethoxysilane, γ-Glycydoxypropyltriethoxysilane
GENIOSIL® GF 82 is an epoxy-functional alkoxysilane. It is a clear, colorless liquid with a characteristic odor similar to gasoline. It hydrolyzes slowly in the presence of water, releasing ethanol, and forms silanols that can react with themselves to produce siloxanes or bind to inorganic substrates. The epoxy group on GENIOSIL® GF 82 can undergo a ring-opening reaction with nucleophiles such as alcohols and amines.
Mitsubishi Chemical Group Corporation
jER™ YX8040
Polymer Name:
Epoxy Resins & Compounds
Functions:
Binder & Resin, Resins, Binders & Matrix Materials, Resin, Adhesion Promoter, Coupling Agent
Chemical Family:
Epoxy & Epoxy Derivatives
Labeling Claims:
High Purity
jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX8000D
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Adhesion Promoter, Coupling Agent, Binder & Resin, Resin
Chemical Family:
Bisphenol A Type Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
End Uses:
Radiation Curable Coating, Semiconductor Applications
Compatible Substrates & Surfaces:
Glass, Fibers & Fabrics, Concrete, Metal, Ceramic, Aluminum, Plastics, Steel
Features:
Transparency, Low Chlorine Content, Faster Cure Time, LED-curable, Radiation Curable, Fast Cure, UV Curable, Excellent Adhesion
jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX7105
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Impact Modifier, Adhesion Promoter, Coupling Agent, Binder & Resin, Resin
Chemical Family:
Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Aluminum, Steel, Fibers & Fabrics, Glass, Plastics, Metal, Concrete, Ceramic
jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL980
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Resins, Binders & Matrix Materials, Adhesion Promoter, Binder & Resin, Resin
Chemical Family:
Bisphenol A Type Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Concrete, Aluminum, Fibers & Fabrics, Metal, Ceramic, Plastics, Steel, Glass
Features:
Low Chlorine Content, Excellent Electrical Insulation, Good Mechanical Properties, Water Resistant, Chemical Resistant, Electrically Insulating, Abrasion Resistance, Water Resistance, Improved Dimensional Stability, Reduced Wear, Good Electrical Properties, Chemical Resistance, Heat Resistance, Improved Flexibility, Flame Retardant
jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX7400N
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Impact Modifier, Adhesion Promoter, Coupling Agent, Binder & Resin, Resin
Chemical Family:
Epoxy & Epoxy Derivatives
End Uses:
Semiconductor Applications, Conformal Coating
Features:
Excellent Elasticity, Reduced Wear, Good Mechanical Properties, Abrasion Resistance, Impact Resistance, Good Elasticity, Improved Flexibility, High Impact Resistance, Excellent Resilience, Improved Dimensional Stability
jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL983U
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Resins, Binders & Matrix Materials, Adhesion Promoter, Binder & Resin, Resin
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Concrete, Aluminum, Fibers & Fabrics, Metal, Ceramic, Plastics, Steel, Glass
Features:
Low Chlorine Content, Excellent Electrical Insulation, Good Mechanical Properties, Water Resistant, Chemical Resistant, Low Viscosity, Electrically Insulating, Abrasion Resistance, Water Resistance, Improved Dimensional Stability, Reduced Wear, Good Electrical Properties, Good Elastic Recovery, Chemical Resistance, Heat Resistance, Improved Flexibility
jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Gelest Inc.
Gelest SIG5840.0
Chemical Family:
Silanes, Organosilane
Functions:
Coupling Agent, Adhesion Promoter
Compatible Polymers & Resins:
Polysulfide Rubber, Epoxies (EP), Phenol Formaldehyde (PF)
Features:
Hydrophilic, Abrasion Resistance
Synonyms:
(3-Glycidoxypropyl)trimethoxysilane, (γ-Glycidoxypropyl)trimethoxysilane, [[3-(Trimethoxysilyl)propoxy]methyl]oxirane, [3-(2,3-Epoxypropoxy)propyl]trimethoxysilane, [3-(Glycidyloxy)propyl]trimethoxysilane, [γ-(Glycidyloxy)propyl]trimethoxysilane, 1-(Glycidyloxy)-3-(trimethoxysilyl)propane, 2-((3-(Trimethoxysilyl)propyloxy)methyl)oxirane, 2-[[3-(Trimethoxysilyl)propoxy]methyl]oxirane, 3-(Glycidyloxy)propyltrimethoxylsilane, 3-(Trimethoxysilyl)propyl glycidyl ether, Epoxypropoxypropyltrimethoxysilane, Glycidoxypropyltrimethoxysilane, Glycidyl 3-(trimethoxysilyl)propyl ether, Glycidyl γ-(trimethoxysilyl)propyl ether, Glycidyloxypropyltrimethoxysilane, NSC 93590, Trimethoxy-γ-glycidoxypropylsilane, Trimethoxy(3-(oxiran-2-ylmethoxy)propyl)silane, Trimethoxy(3-glycidoxypropyl)silane, Trimethoxy(3-glycidyloxypropyl)silane, γ-(2,3-Epoxypropoxy)propyltrimethoxysilane, γ-Glycidyl ether propyltrimethoxysilane, γ-Triglycidoxypropyltrimethoxysilane
Gelest (3- GLYCIDOXYPROPYL)TRIMETHOXYSILANE (SIG5840.0) is an epoxy-functional trialkoxy silane used as a component in aluminum metal bonding adhesives. This product functions as an adhesion promoter and coupling agent.
AB Specialty Silicones
Andisil® 78 Silane
Chemical Family:
Silanes, Silicones, Epoxy & Epoxy Derivatives
Functions:
Adhesion Promoter, Coupling Agent
Compatible Polymers & Resins:
Polycarbonates (PC), Polyamides, Epoxies (EP), Phenolic Resins, Polyesters, Acrylics, Nitrile Butadiene Rubber (NBR), Polyurethanes (PU), Polysulfide Rubber
Synonyms:
(3-Glycidyloxy)propyldiethoxymethylsilane, [3-(Glycidyloxy)propyl]methyldiethoxysilane, 2-[[3-(Diethoxymethylsilyl)propoxy]methyl]oxirane, 3-(Glycidoxy)propyldiethoxymethylsilane, 3-(Glycidoxypropyl)methyldiethoxysilane, 3-(Methyldiethoxysilyl)propyl glycidyl ether, 3-GPMDES, Diethoxy-3-glycidoxypropylmethylsilane, Diethoxy[3-(glycidyloxy)propyl]methylsilane, NSC 252159, γ-Glycidoxypropylmethyldiethoxsilane, γ-Glycidoxypropylmethyldiethoxysilane, γ-Glycidyloxypropylmethyldiethoxysilane
Epoxy functional silane used used to improve dry and wet strength in cured composites reinforced with glass fiber rovings. Silanes are used in a variety of industrial applications. Organofunctional Silanes have an organic functional end group and an alkoxy functional end group which allow the silane to act as a bridge between organic materials and inorganic substrates. The organic functional group is matched to the resin system while the alkoxy group provides the reactive site for crosslinking. These materials are useful as adhesion promoters, crosslinking agents, surface modifiers and hydrophobizing agents.