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Potting Compounds
Products in Potting Compounds: Bisphenol Epoxy Resins
14 Products found in Potting Compounds
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Evonik
ALBIFLEX® 297
Polymer Name:
Bisphenol-A Epoxy-Silicone Block Copolymer
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins
Processing Methods:
Casting
ALBIFLEX® 297 is a bisphenol-A-epoxy-silicone block copolymer resin that excels in crafting high-performance elastomers. This versatile liquid, responsive to epoxy, seamlessly cures when combined with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 297 accommodates various conventional casting and molding techniques for your manufacturing needs.
Mitsubishi Chemical Group Corporation
jER™ YX8000D
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Adhesion Promoter, Coupling Agent, Binder & Resin, Resin
Chemical Family:
Bisphenol A Type Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
End Uses:
Radiation Curable Coating, Semiconductor Applications
Compatible Substrates & Surfaces:
Glass, Fibers & Fabrics, Concrete, Metal, Ceramic, Aluminum, Plastics, Steel
Features:
Transparency, Low Chlorine Content, Faster Cure Time, LED-curable, Radiation Curable, Fast Cure, UV Curable, Excellent Adhesion
jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL980
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Resins, Binders & Matrix Materials, Adhesion Promoter, Binder & Resin, Resin
Chemical Family:
Bisphenol A Type Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Concrete, Aluminum, Fibers & Fabrics, Metal, Ceramic, Plastics, Steel, Glass
Features:
Low Chlorine Content, Excellent Electrical Insulation, Good Mechanical Properties, Water Resistant, Chemical Resistant, Electrically Insulating, Abrasion Resistance, Water Resistance, Improved Dimensional Stability, Reduced Wear, Good Electrical Properties, Chemical Resistance, Heat Resistance, Improved Flexibility, Flame Retardant
jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL983U
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Resins, Binders & Matrix Materials, Adhesion Promoter, Binder & Resin, Resin
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Concrete, Aluminum, Fibers & Fabrics, Metal, Ceramic, Plastics, Steel, Glass
Features:
Low Chlorine Content, Excellent Electrical Insulation, Good Mechanical Properties, Water Resistant, Chemical Resistant, Low Viscosity, Electrically Insulating, Abrasion Resistance, Water Resistance, Improved Dimensional Stability, Reduced Wear, Good Electrical Properties, Good Elastic Recovery, Chemical Resistance, Heat Resistance, Improved Flexibility
jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Leuna-Harze GmbH
Epilox® AF 18-30
Functions:
Binder & Resin
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins
Compatible Substrates & Surfaces:
Concrete
Epilox AF 18-30 is a liquid and solventless blend of standard bisphenol A and bisphenol F epoxy resins with good resistance to crystallization.
Leuna-Harze GmbH
Epilox® A 17-01
Applications:
Electronics Adhesives, Appliances & Electronics, Potting Compounds
Product Families:
Epoxies, Resins & Binders
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
End Uses:
Epoxy Adhesive
Epilox A 17-01 is a colorless, low-molecular-weight bisphenol A epoxy resin.
Reichhold
EPOTUF® 37-127
Functions:
Binder & Resin
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins
Compatible Substrates & Surfaces:
Grout
Physical Form:
Liquid
Features:
Low Viscosity
EPOTUF® 37-127 is a low viscosity 100% reactive diluted liquid epoxy resin based on Bisphenol A and which contains EPOTUF® 37-058 (C12 - C14 glycidyl ether).
Leuna-Harze GmbH
Epilox® T 19-27
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins
End Uses:
Primer, Epoxy Adhesive
Compatible Substrates & Surfaces:
Concrete
Epilox T 19-27 is a liquid and solventless blend of standard bisphenol A and bisphenol F epoxy resins with good resistance to crystallization.
Leuna-Harze GmbH
Epilox® AF 18-50
Functions:
Binder & Resin
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins
Compatible Substrates & Surfaces:
Concrete
Epilox AF 18-50 is a liquid and solventless blend of standard bisphenol A and bisphenol F epoxy resins with good resistance to crystallization.
Leuna-Harze GmbH
Epilox® A 19-03
Applications:
Electronics Adhesives, Appliances & Electronics, Housings & Enclosures
Product Families:
Epoxies, Resins & Binders
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
End Uses:
Epoxy Adhesive
Epilox A 19-03 is a medium viscosity bisphenol A epoxy resin which may crystallize on storage.
Leuna-Harze GmbH
Epilox® A 19-04
Applications:
Electronics Adhesives, Appliances & Electronics, Potting Compounds
Product Families:
Epoxies, Resins & Binders
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
End Uses:
Epoxy Adhesive
Epilox A 19-04 is a low molecular weight bisphenol A epoxy resin with medium viscosity.
Leuna-Harze GmbH
Epilox® F 16-01
Applications:
Electronics Adhesives, Appliances & Electronics, Potting Compounds
Product Families:
Epoxies, Resins & Binders
Chemical Family:
Phenols & Phenolics, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
End Uses:
Epoxy Adhesive
Epilox F 16-01 is a colorless, low-molecular-weight bisphenol F epoxy resin.
Reichhold
EPOTUF® 37-140
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins
End Uses:
Primer
Compatible Substrates & Surfaces:
Concrete
Features:
Broad Range of Viscosity
EPOTUF® 37-140 is the standard, undiluted, general purpose, diglycidyl ether of Bisphenol-A epoxy resin.
NUCEQ, S.A.P.I De C.V.
NUCEQ, S.A.P.I De C.V. PZ A/HD-3404
Ready to Use Product Type:
Encapsulant, Solvent free (100% Solids) Sealant
Compatible Substrates & Surfaces:
Fiberglass
Chemical Family:
Bisphenol A Type Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
Nuceq PZ A/HD-3404 system has been formulated for the technique of fiberglass laminating, potting and casting, this is a solvent-free system based on epichlorohydrin-bisphenol A epoxy resin.