Products in Potting Compounds: Excellent Substrate Adhesion

ELASTOSIL® RT 707 W is a flowable, one-part, heat-curing silicone used for potting and coating applications. The cured material demonstrates very good adhesion to many substrates and long-term stability against weathering, moisture, and UV light. The cured silicone rubber can continuously withstand constantly changing climatic conditions, UV radiation, and temperatures as high as 230°C (446°F) without sustaining damage.

ELASTOSIL® E92 N Transparent is a transparent, self-leveling silicone rubber with very good mechanical properties that cures at room temperature under the influence of atmospheric moisture. This product provides excellent primer-less adhesion to many substrates and is used as a multipurpose glue and for textile coatings, e.g. antislip coatings.

ELASTOSIL® E91 Transparent is a self-leveling silicone rubber with very good mechanical properties that cures at room temperature under the influence of atmospheric moisture. Curing can be accelerated in a steam oven. It is a multipurpose glue for textile coatings, e.g. antislip coatings.

ELASTOSIL® E11 Transparent is a flowable silicone rubber with very good mechanical properties that cures at room temperature under the influence of atmospheric moisture. Perfectly suited for lamination, coating, and thin-film potting, the material reliably fills small gaps and voids thanks to its self-leveling properties.

ELASTOSIL® N10 Transparent is a solvent-free, neutral-cure, low-viscous, and non-thixotropic silicone sealant that cures at room temperature under the influence of atmospheric moisture. It exhibits excellent primerless adhesion to many substrates. It is a multipurpose grade for bonding, sealing, and potting, e.g. in electronic applications.

ELASTOSIL® RT 708 is a self-leveling, slightly thixotropic, one-part silicone that cures with heat. It is designed for potting and coating applications and can also be used as a surface adhesive when applied in a thin layer, such as through silk-screen printing. Once cured, ELASTOSIL® RT 708 exhibits excellent adhesion to various substrates and offers long-term stability against weathering, moisture, and UV light. The cured silicone rubber can withstand continuously changing climatic conditions, UV radiation, and temperatures as high as 230 °C (446 °F) without sustaining any damage.

ELASTOSIL® N288 is a low-viscosity, ready-to-use, neutral crosslinking silicone rubber. It cures at room temperature under the influence of atmospheric moisture. It exhibits excellent heat stability, excellent primerless adhesion to many substrates, permanent temperature exposure up to 200 °C, and peak temperatures up to 250°C.

ELASTOSIL® RT 705 is a self-leveling, slightly thixotropic, one-part silicone that cures with heat. It is primarily used for potting and coating applications but can also be used as a surface adhesive when applied in a thin layer, such as by silk-screen printing. Once cured, ELASTOSIL® RT 705 exhibits excellent adhesion to various substrates and demonstrates long-term stability against weathering, moisture, and UV light. The cured silicone rubber can withstand continuously changing climatic conditions, UV radiation, and temperatures as high as 230 °C (446 °F) without sustaining any damage.

ELASTOSIL® RT 706 is a self-leveling, slightly thixotropic, one-part heat-curing silicone used for potting and coating applications. The cured material demonstrates very good adhesion to many substrates and long-term stability against weathering, moisture, and UV light. The cured silicone rubber can continuously withstand constantly changing climatic conditions, UV radiation, and temperatures as high as 230°C (446°F) without sustaining damage.

ELASTOSIL® E70 is a flowable, one-component, acetoxy-cure silicone rubber that cures at room temperature under the influence of atmospheric moisture. It shows excellent primerless adhesion to many substrates and outstanding heat stability even in long-term exposure. It is a high-temperature-resistant grade for sealing and bonding applications under high thermal stress.

CHT Group TufGel 336 is one of a family of soft, adherent, silicone elastomeric gels designed for the encapsulation and protection of electronic components. It is a low-viscosity, two-component system that is readily mixed in a 1:1 ratio. It is used to provide protection from vibration, thermal or mechanical shock, water, and many other environmental contaminants. This product has excellent dielectric properties.

CHT Group SilSo Lite 21025 is a two-part, room-temperature, platinum-cure, self-blowing silicone foam designed for liquid dispensing. This product is ideal for potting in applications where lightweight and thermal protection are required. Its viscosity profile enables excellent flow around components, and it is excellent for potting complex parts. The chemical composition results in a cured product that is hydrolytically stable as well as reversion-resistant. The cured product provides electrical insulation and physical shock resistance for components and enables environmental protection.

Crestabond® M1-04SL Structural Adhesive is a toughened, two-component 10:1 acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts.

High Temperature Epoxy, Encapsulating & Potting Compound 832HT is a general purpose, rigid, black, 2-part high temperature epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is useful when extreme physical strength and chemical resistance are required. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

High Thermal Conductivity Epoxy, Encapsulating & Potting Compound 834HTC is a 2-part, black, rigid, flameretardant thermal epoxy that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This epoxy resin is designed for applications where thermal management and selfextinguishing are critical. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

834B potting and encapsulating compound is a black, flame retardant, thermally conductive two-part epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where thermal management and self-extinguishing are critical. It also provides excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals. This epoxy has a convenient 2:1 volume mix ratio, making it compatible with most dispensing equipment. 834B can be cured at room temperature or higher.

Black Flexible Epoxy, Encapsulating & Potting Compound 834FX is a 2-part, flame-retardant, thermally conductive, fexible epoxy resin that provides extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where minimizing the physical stress on components is critical. It is good in low temperature and arctic environments, and in applications that involve temperature cycling or rapid temperature changes. It provides the functionality of silicone, but with the durability and cost-effectiveness of epoxy.

Black Flexible Epoxy, Encapsulating & Potting Compound 832FX is a black, 2-part, flexible epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where minimizing the physical stress on components is critical. It performs well in low temperature and arctic environments, as well as applications that involve temperature cycling or rapid temperature changes. It provides the functionality of silicone, but with the durability and cost-effectiveness of epoxy.

832WC is a rigid, 2-part, clear epoxy resin that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is designed for applications where high clarity is required. It does not yellow when exposed to UV light; it maintains clarity in applications with service temperatures of up to 65 °C and intermittent exposures of up to 100 °C. It can be used for underwater applications such as potting swimming pool lights. It is also a good choice for casting resin.

Translucent Epoxy, Encapsulating & Potting Compound 832C is a rigid, amber clear epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, it can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Thermally Conductive Epoxy, Encapsulating & Potting Compound 832TC is a 2-part, black epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. It is designed for applications where thermal management is a concern. Its high thermal conductivity helps protect circuits by reducing the risk of heat buildup. It also provides excellent electrical insulation and protects components from static discharge, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

One-part Epoxy Potting Compound 9510 is a black, rigid, one-part epoxy potting compound. It is a heat cure epoxy that provides unlimited working time at room temperature and does not require frozen storage. Our 1-part epoxy resin provides exceptional chemical resistance against a wide variety of mild to harsh chemicals, including toluene, acetone and ethyl acetate. It also provides excellent electrical insulation and protects against static discharge, vibration, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

Black Flexible Urethane 8800 is a black, 2-part, flexible polyurethane resin. It has a low mixed viscosity and maintains excellent flexibility at low temperatures. In addition, this flexible urethane adheres strongly to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics. It is a cost-effective flexible potting option that provides exceptional physical protection and creates minimum stress on circuit boards and surface-mounted devices. It offers superior moisture resistance and is an ideal choice for harsh environments, especially saltwater exposure and marine applications.

8810 urethane resin is a black, tough, 2-part potting compound. It features a low mixed viscosity and excellent moisture resistance. In addition, this rigid urethane potting compound adheres strongly to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics. This 2-part polyurethane resin offers exceptional physical protection and is designed for potting and encapsulating intricate electronic components and cable jointing boxes.

High Temperature Rigid Urethane 8820 is a black, tough, high temperature, two-part polyurethane potting compound. It has a low mixed viscosity and properties similar to epoxy compounds, but with exceptional low temperature stability. As well, it adheres strongly to a wide variety of substrates, including metals, composites, glass, ceramics, and many plastics. 8820 offers exceptional physical protection, a high continuous operating temperature, and superior protection from acids, bases, and many organic solvents.

LEECAST 38-191 is a proprietary two-part epoxy adhesive and encapsulating compound. It has been used extensively for potting lead wires in UL-listed commercial gasoline pumps. LEECAST 38-191 has exceptional chemical resistance, especially in respect to gasoline, various gasoline alcohol additives, and other aggressive organic solvents. It also features fast room temperature cure and excellent adhesion to a variety of wire coatings and other substrates. It is formulated with enough thixotropy to inhibit sag on vertical surfaces and self-leveling when applied in a bead on horizontal surfaces.

5302 Epoxy was designed specifically for potting circuit board connectors. With its 4-hour pot life, the material is ideal for automated dispensing and features controlled flow – making it easy to deposit. 5302 meets NASA’s outgassing requirements and has a wide range of curing options. The material bonds well with most substrates.

Sil-Flex SL RTV-7525 (Neutral) is a self-leveling one component, low modulus, neutral cure silicone sealant and adhesive. When fully cured, this unique VOC compliant formula offers UV stability and tenacious adhesion. It is frequently used for coating electronic components and terminals or sealing pitch pockets and window seams. This product is specifically formulated to offer all weather performance to meet today's Green Building Standards.

NGAC G907-52 is a room temperature curable epoxy adhesive with a low viscosity. This two-part system has a strong adhesion to glass, ceramics, most metals, and plastics.

Silicone&Epoxy Techn. Silicone Solutions 3147= DC 3145 Offset is a high strength, neutral curing silicone RTV adhesive rubber. This product was developed for applications requiring fast development of physical properties and fast unprimed adhesion. SS-3147 is a 1-Part silicone that allows handling of the bonded assembly within one hour of application to the substrate. When cured, the elastomer resists weathering, ozone, moisture, UV and high temperatures. SS-3147 works well in manual and automatic dispensing equipment.

Bondline 7784 is a medium viscosity, one component, thermally conductive epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrate attach, heat sink attach, lid sealing and component staking adhesive. It exhibits strong adhesion to difficult-to-bond metals, such as gold, silver, and copper.

Silicone&Epoxy Techn. Silicone Solutions 69 High Strength, High Temperature Adhesive Sealant is a high strength, high temperature silicone RTV engineered for applications requiring fast development of physical properties and excellent adhesion. SS-69 offers the highest temperature resistance of any acetoxy cure silicone currently available. When cured, the elastomer resists weathering, ozone, moisture, UV and high temperatures. SS-69 works well in manual and automatic dispensing equipment.