Products in Potting Compounds: Good Thermal Conductivity

ELASTOSIL® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber with a two-part formulation and a 1:1 mixing ratio. It features a very high hardness (Shore A) and excellent heat stability. This silicone rubber is particularly known for its high thermal conductivity, making it ideal for the encapsulation of electronic components.

EC-1012MFR-HT is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.

EC-1850FT with EH-10E Hardener is a very low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.

EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.

EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.

EC-1012M/EH-20M is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.

SC-550-LV-TC-2 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-2 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

EC-1850FT is a pourable filled epoxy resin system offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. It is a lower viscosity version of EC-1850FT. It rapidly transfers heat, eliminates hot spot, and increases the operating efficiency of most encapsulated devices. Its low shrinkage minimizes risk of damage to fragile components.

EP-207 is two parts, ambient temperature-cure, epoxy potting and encapsulating system. This semi-rigid system has excellent shock & vibration resistance and good thermal conductivity.

APPLI-TEC 5336 Epoxy is a black, electrically isolating, thermally conductive epoxy designed specifically for staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies, transformers, and coils. This material is ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals. 5336 is supplied in frozen syringes.

APPLI-TEC 5308 Epoxy is an electrically isolating material, 5308 was designed specifically for underfilling, staking and encapsulating electronics on circuit boards, as well as potting and encapsulating power supplies, transformers, and coils. Featuring a 3-hour pot life, 5308 has good flowability, making it ideal for applications requiring a self-leveling material. The material meets NASA’s outgassing requirements, is resistant to solvents and chemicals, and is considered non-hazardous per D.O.T. regulations.

5302 Epoxy was designed specifically for potting circuit board connectors. With its 4-hour pot life, the material is ideal for automated dispensing and features controlled flow – making it easy to deposit. 5302 meets NASA’s outgassing requirements and has a wide range of curing options. The material bonds well with most substrates.

ALFA GR-104 is an opaque white heat sink grease compound, which is applied to the base and mounting studs of transistor and diodes to provide a positive heat sink seal, this facilitates heat transfer away from electrical/electronic components and into heat sinks, thereby increasing the overall efficiency and performance of the device. GR104 is grease like silicone material, heavily filled with efficient heat conductive zinc oxide and a binding agent, this combination promotes high thermal conductivity, high temperature stability, and the lowest amount of bleed and evaporation.

Alfa TG-106 is a silicone base gray heat sink grease compound, which is applied to the base and mounting studs of transistor and diodes to provide a positive heat sink seal, this facilitates heat transfer away from electrical/electronic components and into heat sinks, thereby increasing the overall efficiency and performance of the device. TG-106 is grease like silicone material, heavily filled with efficient heat conductive Aluminum oxide and a binding agent, this combination promotes high thermal conductivity, high temperature stability, and the lowest amount of bleed and evaporation.

Cast-Coat Inc. CC3-300 is a high viscosity, alumina filled casting resin offering high thermal conductivity, high heat distortion, excellent electrical insulation, low coefficient of thermal expansion and extremely low shrinkage during cure. It will withstand the most rugged tests of temperature, chemical attack and voltage shock, and is easier to fabricate than metals or ceramics at a lower cost. Supplied as a pourable resin, it cures to a rigid, opaque plastic at room temperature or with heat. The thermal coefficient of expansion is closely matched to aluminum. CC3-300 has excellent adhesion to a wide variety of materials, i.e., metal, plastic, glass, ceramic. To reduce viscosity, warm the resin between 100°F to 150°F prior to adding the hardener.

ALFA GR-194 FDA is an opaque white heat sink, food grade grease compound. ALFA GR-194 FDA is grease like silicone material, heavily filled with efficient heat conductive zinc oxide and a binding agent, this combination promotes high thermal conductivity, high temperature stability, and the lowest amount of bleed and evaporation. ALFA GR-194 FDA is applied in many industrial applications.

Alfa TG-106HV is a silicone base opaque gray heat sink grease compound, which is applied to the base and mounting studs of transistor and diodes to provide a positive heat sink seal. This facilitates heat transfer away from electrical/electronic components and into heat sinks, thereby increasing the overall efficiency and performance of the device. TG-106HV is grease like silicone material, heavily filled with efficient heat conductive aluminum oxide and a binding agent, this combination promotes high thermal conductivity, high temperature stability, and the lowest amount of bleed and evaporation.

ALFA ULTRATHERM 500 is grease like silicone compound, filled with synthetic diamond and binding agent, this formulation promotes high thermal conductivity, low bleed, low thermal resistance, and function as heat transfer media. ALFA ULTRATHERM 500 is resistant to ozone and ultraviolet degradation and has good chemical stability, has low surface tension that enables it to wet most surfaces, which can lower the thermal contact resistance between the substrate and the material.

Alfa TG-65NS is a non-silicone thermal grease heat sink compound, formulated from synthetic fluids with metal oxide fillers. It has grease like consistency and an opaque white color special binding agent has been used to control oil bleed, creep, and migration over a wide temperature range and to keep oil and fillers together. TG-65NS was developed by ALFA in response to the growing demand in microelectronics for increased thermal transfer efficiency. TG-65NS is a direct replacement for the most popular brands of non-silicone thermal grease on the market today.

APPLI-TEC 7300 Urethane is ideal for aerospace applications as it meets NASA’s outgassing requirements. The cured material’s ability to not crack or harm bonded rigid components during thermal cycling is a major plus. Appli-Thane® 7300 is also used in manufacturing and automated dispensing applications due to its 4-hour pot life. Provides best-in-class thermal conductivity for applications requiring aggressive heat dissipation of components.