Products in Potting Compounds: Good Thermal Stability

ELASTOSIL® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber with a two-part formulation and a 1:1 mixing ratio. It features a very high hardness (Shore A) and excellent heat stability. This silicone rubber is particularly known for its high thermal conductivity, making it ideal for the encapsulation of electronic components.

ELASTOSIL® RT 607 A/B is a pourable, addition-curing RTV-2 silicone rubber with a two-part formulation and a 9:1 mixing ratio. It has low viscosity and offers rapid heat cure. The cured rubber exhibits high hardness and excellent heat stability. Additionally, it is flame retardant, making it suitable for general purpose encapsulation. This product can also be used as a potting material for electrical coils of lifting magnets and for slot exit potting of electrical coils.

ELASTOSIL® N288 is a low-viscosity, ready-to-use, neutral crosslinking silicone rubber. It cures at room temperature under the influence of atmospheric moisture. It exhibits excellent heat stability, excellent primerless adhesion to many substrates, permanent temperature exposure up to 200 °C, and peak temperatures up to 250°C.

ELASTOSIL® RT 602 A/B is a pourable, addition-curing RTV-2 silicone rubber with a two-part formulation and a 9:1 mixing ratio. It has low viscosity and offers rapid heat cure. The cured rubber exhibits a medium hardness and excellent heat stability. This product is suitable as a general purpose encapsulant.

ELASTOSIL® E70 is a flowable, one-component, acetoxy-cure silicone rubber that cures at room temperature under the influence of atmospheric moisture. It shows excellent primerless adhesion to many substrates and outstanding heat stability even in long-term exposure. It is a high-temperature-resistant grade for sealing and bonding applications under high thermal stress.

CHT Group SilSo Clear 21002 is a transparent and colorless silicone formulation that is ideal for optical injection molding applications. Its viscosity profile enables excellent flow around components, and it is excellent for potting complex parts. The chemical composition results in a cured product that is hydrolytically stable as well as reversion-resistant. The silicone elastomer provides electrical insulation and physical shock resistance for components and enables environmental protection.

CHT Group SilSo Lite 21025 is a two-part, room-temperature, platinum-cure, self-blowing silicone foam designed for liquid dispensing. This product is ideal for potting in applications where lightweight and thermal protection are required. Its viscosity profile enables excellent flow around components, and it is excellent for potting complex parts. The chemical composition results in a cured product that is hydrolytically stable as well as reversion-resistant. The cured product provides electrical insulation and physical shock resistance for components and enables environmental protection.

CHT Group QSil 58 is a high-temperature, self-leveling, two-component silicone material that is primarily used for potting applications. The two applicable catalysts are 0.5% DBT by weight and 10% deep-section catalyst by weight. The 0.5% catalyst level can be increased or decreased to obtain the desired cure speed. Cure speed can be accelerated by adding DBT catalyst in 0.1% increments. This can be catalyzed with a 10% deep-section catalyst for applications requiring a deeper cure. The material can also be vulcanized at temperatures up to 70°C to increase cure speed.

127-31 is an extremely flexible one-component, syringe dispensable, 100% solids, thermally conductive, electrically insulating soft epoxy adhesive, encapsulant, and potting compound. This system features excellent thermal stability, chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 127-31 features a low durometer and is highly flexible allowing it to absorb stress when bonding mismatched CTE substrates. 127-31 even displays some elastomeric properties. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding.Features Elastomeric Flexible thermally conductive adhesive/potting compound

SC-550-LV-RT is a 100% silicone solid elastomer designed for electronic potting applications. This two-component, room temperature curing system offers a hard, self-bonding, thermally conductive, low modulus material that is readily re-workable.

SC-550-LV-TC-1 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-1 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

SC-550-LV-TC-2 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-2 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

Bondline 7784 is a medium viscosity, one component, thermally conductive epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrate attach, heat sink attach, lid sealing and component staking adhesive. It exhibits strong adhesion to difficult-to-bond metals, such as gold, silver, and copper.

Bondline 7780 is a medium viscosity epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrate attach, or lid sealing adhesive