Products in Parts & Components: Epoxy & Epoxy Derivatives

4223F-312G – Urethane Coating Spray 4223F-312G is a 1-part, heat curing, UL 746E certified, thermoset urethane (UR) conformal coating spray. It cures to a durable, flexible, scratch resistant and smooth finish. It is easy to apply and can be handled in 15 minutes. It cures in only 2 hours at 100 °C (212 °F). It may be removed with the right conformal coating remover (MG’s 8309 or 8310A) or soldered through for repair or rework. 4223F-312G is considered to be one of the best conformal coatings for protecting circuit boards in chemically challenging environments. It provides strong protection against aggressive chemicals, corrosion, moisture, fungus, dirt, dust, thermal shock, abrasion, short circuit, high-voltage arcing, and static discharge. This product is also available in liquid format. For acrylic conformal coating sprays, see 419D-340G or 419E-340G, and for silicone conformal coating sprays see 422B-340G or 422C-340G.

8331S – Silver Conductive Epoxy Adhesive This electrically conductive paste is a 2-part heat-cured epoxy with a long working time. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This electrically conductive epoxy paste can be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. It provides excellent EMI/RFI shielding and is very effective in filling seams between metal plates. 8331S has been formulated to be economical. For a higher fill version that maximizes conductivity, use 8330S. For a shorter working time or room temperature cure, use 8331 or 8331D. For a 1-part alternative use 9410 or 9400. We also offer a full line of thermally conductive electrically insulating epoxy adhesives.

8329TCS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. 8329TCS has been designed for maximum thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity, use 8329TFS. For a shorter working time, use 8329TCM.

One-part Epoxy Potting Compound 9510 is a black, rigid, one-part epoxy potting compound. It is a heat cure epoxy that provides unlimited working time at room temperature and does not require frozen storage. Our 1-part epoxy resin provides exceptional chemical resistance against a wide variety of mild to harsh chemicals, including toluene, acetone and ethyl acetate. It also provides excellent electrical insulation and protects against static discharge, vibration, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

8329TFS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermally conductive adhesive is used to glue heatsinks to LED’s, CPU’s, and other heat generating components. This product cures slowly. For a faster cure version, use 8329TFF or 8349TFM.

8329TCF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. It is also flame retardant and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 4 hours. This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems. 8329TCF has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFF. For a longer working life, use 8329TCM or 8329TCS.

8329TFM is a thermally conductive two-part epoxy adhesive. It is dark gray, smooth, thixotropic, and bonds well to a wide variety of substrates. This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips, and automatic dispensing systems. For a faster working life, use 8329TFF. For a longer working life, use 8329TFS.

Thermal Adhesive 8349TFM is a 2-part, flame retardant, thermally conductive epoxy adhesives. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is most often used to bond heatsinks to CPUs, LEDs and other electronics components. For a shorter working time, use 8329TFF. For a longer working time, use 8329TFS.

Silver Conductive Epoxy Adhesive 8330 is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, and for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8330 is highly filled to maximize electrical conductivity. For a more economical version, use 8331. For a longer working life, use 8330S.

8331 is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8331 has been formulated to be economical. For a higher fill that maximizes conductivity, use 8330. For a longer working time, use 8331S.

8330D is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8330D is highly filled to maximize electrical conductivity. For a more economical version, use 8331D. For a longer working life, use 8330S.

8329TFF is a 2-part, flame retardant, thermally conductive epoxy adhesive with a 5-minute working time. It is an off white, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal glue is often used to bond heatsinks to CPUs, LEDs and other electronics components. This product has a very short working time. For a longer working time, use 8349TFM or 8329TFS.

8331D is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8331D has been formulated to be economical. For a higher fill that maximizes conductivity, use 8330D. For a longer working time, time, use 8331S.

8330S Silver Conductive Epoxy Adhesive: Slow Cure / Extreme Conductivity

Valtron® AD1339A-AD3905B Epoxy System is a general temporary adhesive system for mounting monocrystalline and multicrystalline ingots for the photovoltaic and semiconductor wafer slicing process. Longer working time than AD1339-A / AD3939-B. Applicable for automatic dispensing systems.

Valtron® AD1339A-AD3939B Epoxy System is a general temporary adhesive system which offers a unique solution for adhering semiconductor and photovoltaic ingots to mounting fixtures and slicing beams.

Valtron® AD1238A-AD3848BR Epoxy System is a temporary adhesive system for monocrystalline and multicrystalline ingots for the wafer slicing, fast-curing and high bond strength. Applicable for automatic dispensing systems.

ADEKA™ EP-4100TX, a distinctive epoxy resin and compound blend, features amorphous materials for exceptional properties. Tailored for heat cure processes, this formulation finds its niche in engineered applications within the realm of plastics and elastomers. Specifically designed for casting methods, ADEKA™ EP-4100TX ensures top-notch performance, setting a new standard for reliability and excellence in industrial applications.

ADEKA™ EP-4000, identified by the polymer name epoxy resins and compounds, finds application in engineered and electrical/electronic applications. Noted for its material features of good adhesion and flexibility, this product is specifically tailored for processing methods such as casting in plastics and elastomers. ADEKA™ EP-4000 stands as a reliable choice in industries where superior adhesion, flexibility, and versatile processing methods are essential.

ADEKA™ EP-4100G, a variant of epoxy resins and compounds, stands out with its general-purpose material features. Specifically designed for plastics and elastomers processed using casting methods, this polymer finds versatile applications. Its end uses span across electrical and electronic applications and general-purpose industrial scenarios, making ADEKA™ EP-4100G a reliable choice for various manufacturing needs.

ADEKA™ EP-7001, an epoxy resin and compound polymer, is a cutting-edge solution in the realm of plastics technology. Tailored for casting methods, it exhibits remarkable features like good adhesion and flexibility. Positioned for excellence, ADEKA™ EP-7001 finds its applications in the automotive and transportation and electrical and electronics markets, meeting the demands of electrical and electronic applications and engineering applications with precision.

ADEKA™ EP-4300E, a premier epoxy resin and compound polymer, stands out for its technological prowess in plastics. Engineered with materials featuring low viscosity, it caters to the intricate demands of electrical and electronic applications. Its excellence extends to processing methods, particularly casting, making it the top choice for industries seeking superior performance and reliability.

ADEKA™ EP-4100, an epoxy resin and compound polymer, is designed for versatile applications, serving both general-purpose and engineered applications. Tailored for plastics and elastomer processing methods, particularly casting, ADEKA™ EP-4100 ensures reliable and efficient performance across a spectrum of industrial processes. With a focus on practicality and adaptability, this polymer proves to be a valuable choice for manufacturers seeking a reliable solution for casting applications in the plastics industry.

ADEKA™ EP-4400, a distinguished epoxy resin and compound polymer, excels at catering to the specialized needs of electrical, electronic, and engineered applications. Engineered for casting, its material features, including its amorphous nature and good adhesion, make it an optimal choice for industries requiring reliability and top-notch performance.

EPOXIBOND™ EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.

EPOXIBOND™ EB-107LP-1 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.

EPOXIBOND™ EB-116 is high strength, structural epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties and is excellent for cryogenic applications. It is recommended for bonding glass, metal, ceramics, and engineering thermoplastics. Due to its low viscosity, it can be also used for potting and encapsulating electrical/electronic coponents

Grade RT130M meets all of the property requirements of NEMA FR-4, with the added feature being flame resistant, UL94 V-0. Typical applications include bushings, spacers and other structural parts. RT130M has excellent machining characteristics. Certification to IEC standard is pending.

118-06-F is a B-staged, electrically conductive, transferable, epoxy adhesive film. The 118-06-F Series was developed with wafer manufacturing in mind. Some other applications for 118-06-F include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembling electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the B-staged form. This product is available in thicknesses from 1 to 5 mils (see product codes below). 118-06-F is designed with the performance criteria of Mil-Std-883 5011.4 in mind and is expected to pass ASTM E-595 outgassing testing when fully and properly cured.Features Excellent Electrical Conductivity. Easy Liner Release. Excellent Chemical Resistance. Low Ionics.

Tack-Free ESP 7455 is an alumina-filled, epoxy film adhesive designed for bonding component and substrate to a mismatched substrate or carrier. The dry, tack-free handling of the film makes it suitable for an automated assembly. The adhesive film has very low ionic impurities of less than 10 ppm and high thermal stability with TGA degradation at 450°C. ESP7455 has good thermal conductivity. The extra low Tg of -60°C helps to minimize thermal stress on the bonded parts during thermal cycling or shock testing from -55 to 150°C.

ME8512 is designed for automated, inline processing. This single component, silver filled paste is solvent free, electrically and thermally conductive. It is highly thixotropic with minimal sag. ME8512 has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes.

ME 8418 is designed for automated, inline processing. This single component, silver filled paste is solvent free, and electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The higher Tg and modulus made it more suitable for bonding smaller devices only. Wire- bonding at temperatures as high as 250°C is permissible. ME 8418 has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes.

ME7635-RC is an thermally conductive insulating epoxy adhesive for die-attach applications. This thixotropic paste is solvent free. It is designed for automated, inline bonding processing ME7635-RC is low in ionic impurities (<60 ppm total) and meets all requirements for MIL-Std 883D 5011.4 specification for dielectric adhesive. Fast curing can be achieved from 80°C and higher temperatures.

ME7863 is a one part, quartz filled cyanate ester die attach adhesive. It was designed for solder-sealed ceramic packages. It can withstand temperatures up to 300°C without thermal degradation. ME7863 has processing characteristics required in high speed automation. Its unique chemistry results in very low moisture absorption, high adhesive strength and low CTE.