Products in Printed Circuit Boards (PCBs): Laminate

A paper-base laminate with low phenolic resin content for hard, flat surfaces. This material is most commonly used for drill entry material in the PCB industry.

A paper-base laminate with low phenolic resin content for hard, flat surfaces. This material is normally used in the printed circuit board industry as a backup for the drilling operation. However, it is also used in other industries for tooling stock because of its ease of machining and good dimensional stability.

33N is a flame retardant (UL94 V-O) polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance. High Tg (250°C) results in low overall z-axis expansion, and minimizes risk of latent PTH defects in-service.

AD1000 is a high dielectric constant substrate that permits circuit miniaturization, compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.AD1000 is a woven glass reinforced laminate. This allows for Greater Dimensional Stability and Mechanical Robustness than other 10 Dk Products. Its large panel size is also advantageous for “multi-circuits per panel” processing.

The AD Series™ antenna materials from Rogers Co rporation are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of today’s wireless antenna markets. Increased antenna performance requirements are a constant trend in the market today. Rogers has the materials needed to meet the design needs of this market both today and into the future.

Arlon’s TC600 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite for use as a printed circuit board substrate. TC600 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies. Mechanical robustness is also greatly improved for the 6.15 dielectric constant market.

The AD Series™ antenna materials from Rogers Co rporation are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of today’s wireless antenna markets. Increased antenna performance requirements are a constant trend in the market today. Rogers has the materials needed to meet the design needs of this market both today and into the future.

Er=2.33) uses a higher fiberglass/PTFE ratio for a more highly reinforced combination that offers better dimensional stability and increased mechanical strength.

TMM® thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications. TMM laminates are available in a wide range of dielectric constants and claddings. The electrical and mechanical properties of TMM laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials. TMM laminates do not require a sodium napthanate treatment prior to electroless plating.

RO4830™ thermoset laminates are well suited for price-sensitive millimeter wave applications, such as 76-81 GHz automotive radar sensors, and are a reliable, lower cost alternative to conventional PTFE-based laminates. RO4830 laminates have a slightly higher dielectric constant of 3.2 at 77GHz, versus PTFE-woven glass laminates. LoPro® reverse treated copper foil cladding contributes to RO4830 laminates’ excellent insertion loss at 77GHZ of 2.2 db per inch.

RT/duroid® 6006/6010LM microwave laminates are ceramicPTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15 and RT/duroid 6010LM laminate has a dielectric constant of 10.2

RO4500™ Series High Frequency Laminates are cost/performance materials from Rogers Corporation, specifically engineered and manufactured to meet the specific demands of the antenna markets. RO4533™, RO4534™, and RO4535™ laminates extend the capabilities of the successful RO4000® product series into antenna applications. This ceramic-filled, glass-reinforced hydrocarbon based material set provides the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.

RO4000 laminates are designed to offer superior high frequency performance and low-cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. RO4003C™, RO4350B™, RO4360G2™, and RO4835™ laminates are available clad with the Ticer TCR Thin Film resistor foils. Ticer TCR clad RO4000 laminates are available in 0.5oz (18µm) thick foil with resistor values of 25, 50, and 100 Ω/sq(1). 1oz (35µm) thick copper foils are available as special order.

Acculam™ Epoxyglas HT-ESD comprised of an epoxy resin binder and a woven glass substrate. Surface properties are Electro Static Dissipative on 1 or 2 sides.Static dissipative properties are embedded in surface layer(s) making this ideally suited as test fixture material for printed circuit boards. Examples: Solder pallets, Assembly fixtures, Automated test equipment, ATE fixtures, and Electronic assembly workstation surfaces.

ISOVAL® A (EP GC 201) is made With glass filament fabric for test adapters in printed circuit testing equipment. This gives the material a heat resistance up to 120 ° C, a very good chemical resistance. The high permanent temperature resistance of 155 ° C ensures good dimensional accuracy for use as an adapter plate. A layer of fine fabric in conjunction with a special resin results in the smooth surface and thus enables the finest holes.

RO4700™ series antenna grade laminates are a reliable alternative to the conventional PTFEbased laminates.

85N is the ultimate polyimide and laminate prepreg system fo PWB's requiring resistance to high temperature, both in process and in end-use applications. Bromine-free chemistry provides Bestin-Class thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.

RO4000 laminates are designed to offer superior high frequency performance and low-cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. RO4003C™, RO4350B™, RO4360G2™, and RO4835™ laminates are available clad with the Ticer TCR Thin Film resistor foils. Ticer TCR clad RO4000 laminates are available in 0.5oz (18µm) thick foil with resistor values of 25, 50, and 100 Ω/sq(1). 1oz (35µm) thick copper foils are available as special order.

RO4000 laminates are designed to offer superior high frequency performance and low-cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. RO4003C™, RO4350B™, RO4360G2™, and RO4835™ laminates are available clad with the Ticer TCR Thin Film resistor foils. Ticer TCR clad RO4000 laminates are available in 0.5oz (18µm) thick foil with resistor values of 25, 50, and 100 Ω/sq(1). 1oz (35µm) thick copper foils are available as special order.

RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices. RO3000series laminates are ceramic-filled PTFE based circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multi-layer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems.

Rogers RO3000® series bondply is an undensifi ed version of RO3000 laminates that can be used to process highly reliable, homogeneous RO3000 multi-layer boards (MLB’s). The bondply is used in a manner analogous to prepreg in FR-4 constructions and, once bonded, becomes the equivalent of a normal RO3000 core layer.

Astra MT77 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range. Astra MT77 is suitable for many of today’s commercial RF/microwave printed circuit designs. It features a dielectric constant (Dk) that is stable between -40°C and +140°C at up to W-band frequencies. In addition, Astra MT77 offers an ultra-low dissipation factor (Df) of 0.0017, making it a cost-effective alternative to PTFE and other commercial microwave laminate materials. Key applications include long antennas and radar applications for automobiles, such as adaptive cruise control, pre-crash, blind spot detection, lane departure warning and stop and go systems.

RO3210™ high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The RO3200™ series high frequency materials were designed as an extension of the RO3000® series high frequency circuit materials with one distinguishing characteristic - improved mechanical stability

CuClad 217(Er=2.17, 2.20) uses a low fiberglass/PTFE ratio to provide the lo west di electric constant and di ssipation factor available in fiberglass reinforced PTFE based laminates. Together, these prop erties offer fas ter signal propagati on and higher signal/noise ratios.

Rogers RO3000® series bondply is an undensifi ed version of RO3000 laminates that can be used to process highly reliable, homogeneous RO3000 multi-layer boards (MLB’s). The bondply is used in a manner analogous to prepreg in FR-4 constructions and, once bonded, becomes the equivalent of a normal RO3000 core layer.

IS420 laminate and prepreg products are manufactured with a unique high performance multifunctional epoxy resin, reinforced with electrical grade (E-glass) glass fabric. This system provides improved thermal performance and low expansion rates in comparison to traditional FR-4 while retaining FR-4 processability. In addition to this superior thermal performance, the mechanical, chemical and moisture resistance properties all equal or exceed the performance of traditional FR-4 materials. The IS420 system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo imageable solder mask imaging.

TerraGreen® is engineered for such high-performance applications as power amplifier boards for LTE base stations, internet infrastructure and cloud computing. TerraGreen ® features a Dielectric Constant (Dk) that is stable between -55°C and 125°C, up to 20 GHz. TerraGreen® is a lead-free assembly material and is easy to process. This high-performance material utilizes a short-lamination cycle; the product is easy to drill, does not require plasma desmear, and the prepreg shelf life is similar to FR-4 materials. TerraGreen® is suitable for high-layer count, high-speed digital backplanes and is compatible with Isola’s FR-4 materials for hybrid designs. TerraGreen® meets UL 94 V-0 and is halogen free.

The AD Series™ antenna materials from Rogers Co rporation are high performance, specialty materials that are specifically engineered and manufactured to meet the demands of today’s wireless antenna markets. Increased antenna performance requirements are a constant trend in the market today. Rogers has the materials needed to meet the design needs of this market both today and into the future.

RT/duroid® 5870 and 5880 glass microfi ber reinforced PTFE composites are designed for exacting stripline and mi crostrip circuit applications.

I-Tera MT40 is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Tera MT40 features a dielectric constant (Dk) that is stable between - 55°C and +125°C up to W-band frequencies. In addition, I-Tera MT40 offers a lower dissipation factor (Df) of 0.0031 making it a cost effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials. I-Tera MT40 laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when processing PTFE-based laminate materials.

IS400 is intended for multilayer Printed Wiring Board (PWB) applications where demanding thermal performance and high reliability are required. IS400 laminate and prepreg products are manufactured using Isola’s patented technology, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 330°C decomposition temperature and a low Z-axis expansion.

RT/duroid® 6002 microwave material was the first low loss and low dielectric constant laminate to offer superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.

Rogers RO3000® series bondply is an undensifi ed version of RO3000 laminates that can be used to process highly reliable, homogeneous RO3000 multi-layer boards (MLB’s). The bondply is used in a manner analogous to prepreg in FR-4 constructions and, once bonded, becomes the equivalent of a normal RO3000 core layer.

FR408HR laminate and prepreg products are manufactured with Isola’s patented high performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective. The FR408HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo-imageable solder mask imaging.

DiClad 527 (Er=2.40−2.65) use a higher fiberglass/PTFE ratio to provide mechanical properties approaching conventional substrates. Other advantages include better dimensional stability and lower thermal expansion in all directions. The electrical properties of DiClad 527 are tested at 1MHz and 10GHz, respectively.

CuClad 250(Er=2.40–2.60) uses a hi gher fiberglass/PTFE ratio to prov ide mechanical properties approac hing those of conventional subs trates. Better di mensional stabi lity and lower thermal expansi on in all di rections are other si gnificant benefi ts. The el ectrical properti es of CuCl ad 250GT and CuClad 250GXare tested at 1MHz and 10GHz respectively. For cri tical perform ance appli cations, CuCl ad products may be specified with an “LX” testing grade; this designates that each sheet will be tested individually, and a te st report will be issued with the order.