Products in Printed Circuit Boards (PCBs): Prepreg

33N is a flame retardant (UL94 V-O) polyimide laminate and prepreg system where the excellent high performance properties of polyimide need to be combined with flame retardance. High Tg (250°C) results in low overall z-axis expansion, and minimizes risk of latent PTH defects in-service.

APCM DA 409U/S2-glass is a tough, versatile, modified epoxy resin prepreg that cures at 250ºF. The S-2 glass is a Zentron High Strength fiber. Standard weight is 260g/m2 with a 38% resin content. Other weights and resin contents available upon request.

APCM DA 4518U is a tough, versatile, modified epoxy resin system that cures at 250°F to 350°F. DA4518U can be supplied as a prepreg tape coated on unidirectional graphite.

APCM DA 4092 is modified epoxy pre-impregnated system which can cure at 250°F (121°C) for one hour. DA 4090 | DA 4092 can be supplied on any commercially available glass, Kevlar, or graphite fabric. DA 4090 is a one sided pre-impregnated fabric yielding a single sided tack material. DA 4092 is the same system where both sides of the fabric are pre-impregnated yielding a double sided tack material. Both prepreg systems can be used for laminating and honeycomb sandwich construction.

APCM DA 4082 is 200°F cure modified epoxy prepreg system which can be prepreged on fiberglass fabric, woven Kevlar, or other woven fabrics. In addition to their low temperature cure capabilities, DA 4080 prepregs have excellent flow to allow for vacuum bag cure conditions. DA 4080 is a one sided pre-impregnated system yielding a single sided tack material. DA 4082 is the same system except that both sides of the fabric are coated yielding a double sided tack material. Both prepregs can be used for laminating and honeycomb sandwich construction.

85N is the ultimate polyimide and laminate prepreg system fo PWB's requiring resistance to high temperature, both in process and in end-use applications. Bromine-free chemistry provides Bestin-Class thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.

IS420 laminate and prepreg products are manufactured with a unique high performance multifunctional epoxy resin, reinforced with electrical grade (E-glass) glass fabric. This system provides improved thermal performance and low expansion rates in comparison to traditional FR-4 while retaining FR-4 processability. In addition to this superior thermal performance, the mechanical, chemical and moisture resistance properties all equal or exceed the performance of traditional FR-4 materials. The IS420 system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo imageable solder mask imaging.

TerraGreen® is engineered for such high-performance applications as power amplifier boards for LTE base stations, internet infrastructure and cloud computing. TerraGreen ® features a Dielectric Constant (Dk) that is stable between -55°C and 125°C, up to 20 GHz. TerraGreen® is a lead-free assembly material and is easy to process. This high-performance material utilizes a short-lamination cycle; the product is easy to drill, does not require plasma desmear, and the prepreg shelf life is similar to FR-4 materials. TerraGreen® is suitable for high-layer count, high-speed digital backplanes and is compatible with Isola’s FR-4 materials for hybrid designs. TerraGreen® meets UL 94 V-0 and is halogen free.

APCM DA 4518 E-Glass is a modified epoxy system coated on heavy weight unidirectional E-Glass fibers. This product is designed to build excellent unidirectional strength using a minimum number of plies. DA 4518/E-Glass Uni also features extended room temperature out time and service temperatures to 300°F.

APCM DA 4517 is an epoxy prepreg designed for a temperature range of -67°F (-55°C) to 350°F (177°C), with a cure of 180°F (82°C) for three hour. Shorter cures times are available at higher temperatures. The system is designed to be post cured if the higher temperature service range is required.

I-Tera MT40 is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Tera MT40 features a dielectric constant (Dk) that is stable between - 55°C and +125°C up to W-band frequencies. In addition, I-Tera MT40 offers a lower dissipation factor (Df) of 0.0031 making it a cost effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials. I-Tera MT40 laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when processing PTFE-based laminate materials.

APCM DA 4090 is modified epoxy pre-impregnated system which can cure at 250°F (121°C) for one hour. DA 4090 | DA 4092 can be supplied on any commercially available glass, Kevlar, or graphite fabric. DA 4090 is a one sided pre-impregnated fabric yielding a single sided tack material. DA 4092 is the same system where both sides of the fabric are pre-impregnated yielding a double sided tack material. Both prepreg systems can be used for laminating and honeycomb sandwich construction.

APCM DA 409U/G35-150 is a tough, versatile, modified epoxy resin prepreg that cures at 250°F, a standard modulus 150 g/m2 carbon prepreg tape which can also be supplied as a 200g/m2 or a 300 g/m2 prepreg.

FR408HR laminate and prepreg products are manufactured with Isola’s patented high performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective. The FR408HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo-imageable solder mask imaging.

I-Speed® laminate and prepreg products are manufactured with Isolas' patentable high performance multi-functional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 15% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective. The I-Speed® resin system is laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo imageable solder mask imaging.

APCM DA 4080 is 200°F cure modified epoxy prepreg system which can be prepreged on fiberglass fabric, woven Kevlar, or other woven fabrics. In addition to their low temperature cure capabilities, DA 4080 prepregs have excellent flow to allow for vacuum bag cure conditions. DA 4080 is a one sided pre-impregnated system yielding a single sided tack material. DA 4082 is the same system except that both sides of the fabric are coated yielding a double sided tack material. Both prepregs can be used for laminating and honeycomb sandwich construction.

38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.

35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to cure offers improved throughput compared to traditional polyimide cycles.

APCM DA 4518 is an epoxy prepreg designed for a temperature range of -67°F (-55°C) to 350°F (177°C), with a cure of 250°F (121°C) for one hour and or a cure of 350º F (177ºC) for 1 hour. This material needs to be post cure or cured to 350ºF to get the 350º properties.

G200 has Blending Bismaleimide/Triazine (BT) and epoxy resin which provides G200 with enhanced thermal, mechanical and electrical performance over most epoxy materials. G200 possesses performance characteristics that make it an excellent selection for large panel size, high layer count Printed Wiring Boards (PWB).

370HR laminates and prepregs, deigned by Polyclad, are made using a patented high performance 180°C Tg FR-4 multifunctional epoxy resin system that is designed for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required. We manufacture 370HR laminates and prepregs with high quality E-glass glass fabric for superior Conductive Anodic Filament (CAF) resistance. 370HR provides superior thermal performance with low Coefficient of Thermal Expansion (CTE) and the mechanical, chemical and moisture resistance properties that equal or exceed the performance of traditional FR-4 materials. 370HR is used in thousands of PWB designs and has proven to be best in class for thermal reliability, CAF performance, ease of processing and proven performance on sequential lamination designs.

Isola’s IS410 has a glass transition temperature (Tg) of 180°C and is specially formulated for superior performance through multiple thermal excursions, passing 6X solder tests at 288°C. IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of ≤10 mils. Its unique resin chemistry provides CAF resistance with the benefit of long-term reliability of boards built with small feature designs.

185HR laminate and prepreg materials are manufactured using Isola’s patented technology, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 340°C decomposition temperature, a lower Z-axis expansion and offers lower loss compared to competitive products in this space. The 185HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and phot imageable solder mask imaging.