Products in Semiconductor Manufacturing: Polyether Ether Ketone (PEEK)

Semitron® HPV ESd PEEK shapes are specially formulated with specific additives that make them an excellent performer in wear and friction applications where antistatic properties are essential. These shapes are specifically designed for electronic fixture applications that require a high degree of dimensional stability over an extended thermal range, as well as precise machinability.Features:Contains specific additives that provide excellent performance in wear and friction applicationsAntistatic properties for electronic fixture applicationsHigh dimensional stability over an extended thermal rangePrecise machinabilityBenefits:Improved performance in wear and friction applicationsReduced risk of static discharge damage to electronic componentsLong-lasting dimensional stability in high-temperature environmentsEasy to machine for precise applicationsApplications:Electronic fixture applications such as test sockets, contactors, and nestsWear and friction applications where antistatic properties are essentialHigh-temperature applications that require dimensional stability and precise machiningVacuum chamber components and other semiconductor equipment.

Semitron® ESd 490HR Polyetheretherketone PEEK electro static dissipative shapes offer similar physical properties as Semitron® ESd 480 PEEK, but exhibit a higher resistivity value in the 10E8 to 10E10 ohms per square range. Semitron® ESd 490HR PEEK components are thermally stable to temperatures of 490° F / 270° C without degradation, and also possess high structural strength and stiffness combined with excellent dimensional stability. Furthermore, this particular grade is non-sloughing, which is why it is an ideal solution for socket, nest, and contactor manufacturing for test equipment, and other electronic device handling applications.Features:High resistivity value in the 10E8 to 10E10 ohms per square rangeThermally stable to temperatures of 490° F / 270° C without degradationHigh structural strength and stiffnessExcellent dimensional stabilityNon-sloughingBenefits:Ideal for socket, nest, and contactor manufacturing for test equipmentSuitable for electronic device handling applicationsNon-sloughing feature makes it a good option for applications where debris generation is a concernHigh thermal stability and dimensional stability make it suitable for high-temperature and critical applicationsApplications:Socket, nest, and contactor manufacturing for test equipmentElectronic device handling applicationsOther high-temperature and critical applications requiring high resistivity, thermal stability, and dimensional stability.

Semitron® MP 370 shapes exhibit excellent moisture absorption and thermal resistance, while also maintaining outstanding strength and dimensional stability. As a result, this grade is often selected for test socket applications where precision machining is critical, and complex geometries are prevalent.Features:Excellent moisture absorptionHigh thermal resistanceOutstanding strength and dimensional stabilityExcellent machinabilityBenefits:Allows for precision machining and complex geometries in test socket applicationsProvides greater strength and dimensional stability compared to unfilled PEEK materialsLow internal stresses and no "soft center" issues associated with injection molded blanksApplications:Test sockets for the semiconductor manufacturing industryPrecision machining and complex geometries in various industries where high thermal resistance and moisture absorption are required.

Semitron® ESd 480 Polyetheretherketone PEEK electro static dissipative shapes are a top choice for critical test fixture and wafer handling applications in wet process tools, where static dissipation is critical. These shapes are specifically designed to provide excellent chemical resistance properties and high dimensional stability under varying environmental conditions.Features:Excellent chemical resistance propertiesHigh dimensional stability under varying environmental conditionsSurface resistivity: 106 - 109 ohms/sqBenefits:Ideal for critical test fixture and wafer handling applications in wet process toolsProvides a dissipative range of 106 - 109 ohms/sq, ensuring static dissipation is criticalDimensionally stable, making it ideal for critical test fixture applicationsApplications:Test fixture and wafer handling applications in wet process toolsStructural applications in wet process tools where static dissipation is importantWell-suited for use in wafer handling and other structural applications in wet process tools where static dissipation is important.

Semitron® MDS 100 modified Polyetheretherketone PEEK shapes offer a remarkable combination of strength, stiffness, and stability. This grade in particular was developed for use in uncontrolled application environments where a high level of precision is required. Due to this, Semitron® MDS 100 components are often used as test sockets, nests, and fixtures in test and package equipment throughout the semiconductor and electronics industry.Features:Remarkable combination of strength, stiffness, and stabilityDeveloped for use in uncontrolled application environments where a high level of precision is requiredMoisture absorption of 0.10% at 24 hrs. (per ASTM D570)Thermal performance to 210 °C (410 °F)Flexural modulus > 1,400,000 psiBenefits:Ideal for test sockets, nests and fixtures in test and package equipmentSuitable for use in semiconductor and electronics industryCan withstand harsh, uncontrolled environmentsLow moisture absorption ensures dimensional stabilityHigh thermal performance and flexural modulus ensures durability and precisionApplications:Test sockets, nests and fixtures in test and package equipmentOther applications in the semiconductor and electronics industry that require a high level of precision and stability in uncontrolled environments.

Ketron® 1000 PEEK is a high-performance polymer that offers excellent mechanical properties and chemical resistance. It is widely used in a variety of applications where high strength and stiffness, low friction, and excellent dimensional stability are required. This material is ideal for instrument and seal components, where its high elongation and toughness make it an excellent choice. Its non-toxic and biocompatible properties make it suitable for use in medical and food processing applications.   Key features: High strength and stiffness Low friction Excellent dimensional stability High elongation and toughness EU 10/2011 and FDA compliant   Benefits: Improved performance and durability of components Increased resistance to chemicals and high temperatures Enhanced biocompatibility and safety in medical and food processing applications Greater design flexibility and compatibility with a wide range of applications and industries   Application: Structural parts: Ketron® PEEK is often used for structural components that are subject to high temperatures and chemical exposure. For example, it is commonly used for vacuum wand handles in semiconductor manufacturing. Bushings, bearings, seals, and back-up rings: Ketron® PEEK is an excellent choice for components that are subject to wear and tear. Its low coefficient of friction and high strength make it suitable for use in a wide range of applications, from aircraft to oil field drilling.   Ketron® 1000 PEEK is available in a range of shapes and sizes, making it easy to incorporate into your designs. It is a versatile and reliable material that can help improve the performance and longevity of your products.

SABIC's Specialties Business LNP™ THERMOCOMP™ LX08411 compound is based on Polyetheretherketone (PEEK) resin containing 45% carbon fiber. Added features of this grade include: Electrically Conductive, High Modulus, Easy Molding.

SABIC's Specialties Business LNP THERMOCOMP LF004E compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP LC004XXP compound is based on Polyetheretherketone (PEEK) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP LX03447 compound is based on Polyetheretherketone (PEEK) resin containing 35% carbon fiber. Added features of this grade include: Electrically Conductive.

SABIC's Specialties Business LNP™ THERMOCOMP™ LC00AEX1 compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Electrically Conductive, Ultra High Modulus and Strength, Easy Molding, Excellent Wear Resistance and Low CTE.

SABIC's Specialties Business LNP™ THERMOCOMP™ LC006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: High Modulus, High impact, Easy Molding, Electrical Conductive.

LNP THERMOCOMP LF002XXP-WT02005 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. Added features of this grade include: Custom Color.

SABIC's Specialties Business LNP THERMOCOMP LF006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. Added features of this grade include: Low warpage, Easy Molding. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP LC008E compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP LC00APXQ compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Exceptional Processing, Electrically Conductive.

SABIC's Specialties Business LNP THERMOCOMP LC006 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP™ THERMOCOMP™ LF008EX1 compound is based on Polyetheretherketone (PEEK) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength, Easy Molding and Low Warpage.

SABIC's Specialties Business LNP THERMOCOMP LX09404 compound is based on Polyetheretherketone (PEEK) resin containing 45% carbon fiber. Added features of this grade include: Electrically Conductive, High Modulus This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP LF006 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP LC008EXP compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.

SABIC's Specialties Business LNP THERMOCOMP LF008 compound is based on Polyetheretherketone (PEEK) resin containing 40% glass fiber. Added features of this grade include: High Modulus and Strength. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP LF002 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP LF006E compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. Added features of this grade include: Easy Molding. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP LF003 compound is based on Polyetheretherketone (PEEK) resin containing 15% glass fiber.

LNP THERMOCOMP LX04015 compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.

LNP THERMOCOMP LC003E compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive

LNP THERMOCOMP LF002EXD compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. Added features of this grade include: Custom Color, Easy Molding.

SABIC's Specialties Business LNP™ THERMOCOMP™ LX97024 compound is based on Polyetheretherketone (PEEK) resin containing 15% glass fiber, 5% PTFE. Added features of this grade include: Internally Lubricated, Easy Molding.

LNP THERMOCOMP LC006EXQ compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.

SABIC's Specialties Business LNP™ THERMOCOMP™ LCF62E compound is based on Polyetheretherketone (PEEK) resin containing 10% carbon fiber and 30% glass fiber. Added features of this grade include: Easy Molding, Electrically Conductive.

SABIC's Specialties Business LNP™ THERMOCOMP™ LF004E1 compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding and Low Warpage

SABIC's Specialties Business LNP LUBRICOMP LL004C compound is based on Polyetheretherketone (PEEK) resin containing 20% PTFE. Added features of this grade include: Wear Resistant, LNP Clean Compounding Technology.

SABIC's Specialties Business LNP STAT-KON LX04420C compound is based on Polyetheretherketone (PEEK) resin containing carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP™ STAT-KON™ LX00797C compound is based on Polyetheretherketone (PEEK) resin containing carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability.

SABIC's Specialties Business LNP STAT-KON LX00486C compound is based on Polyetheretherketone (PEEK) resin containing carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.