Products in Semiconductor Manufacturing: High Stiffness

Semitron® ESd 490HR Polyetheretherketone PEEK electro static dissipative shapes offer similar physical properties as Semitron® ESd 480 PEEK, but exhibit a higher resistivity value in the 10E8 to 10E10 ohms per square range. Semitron® ESd 490HR PEEK components are thermally stable to temperatures of 490° F / 270° C without degradation, and also possess high structural strength and stiffness combined with excellent dimensional stability. Furthermore, this particular grade is non-sloughing, which is why it is an ideal solution for socket, nest, and contactor manufacturing for test equipment, and other electronic device handling applications.Features:High resistivity value in the 10E8 to 10E10 ohms per square rangeThermally stable to temperatures of 490° F / 270° C without degradationHigh structural strength and stiffnessExcellent dimensional stabilityNon-sloughingBenefits:Ideal for socket, nest, and contactor manufacturing for test equipmentSuitable for electronic device handling applicationsNon-sloughing feature makes it a good option for applications where debris generation is a concernHigh thermal stability and dimensional stability make it suitable for high-temperature and critical applicationsApplications:Socket, nest, and contactor manufacturing for test equipmentElectronic device handling applicationsOther high-temperature and critical applications requiring high resistivity, thermal stability, and dimensional stability.

Semitron® CMP XL20 Polyamideimide PAI shapes were specifically developed for CMP ring applications in the semiconductor and electronics industry, due to their excellent long wear life in CMP slurries. In addition to these characteristics, Semitron® CMP XL20 PAI components display high strength and stiffness, and outstanding wear resistance over a broad range of temperatures, making this grade the ideal solution for dynamic applications in process environments.Features:Specifically developed for CMP ring applications in the semiconductor and electronics industryExcellent long wear life in CMP slurriesHigh strength and stiffnessOutstanding wear resistance over a broad range of temperaturesBenefits:Ideal solution for dynamic applications in process environmentsSignificantly lower cost per waferOutperforms PPS up to 20x in most processesPromotes fewer edge defects and better uniformityApplications:CMP ring applications in the semiconductor and electronics industryCan be used in clamp rings, trench rings, screws, pins, and shower headsSuitable for use in centering pins, focus rings, insulators, vacuum pads, and wafer guides.

Semitron® ESd 420V PEI Polyetherimide electro static dissipative shapes, a high-performance material designed for use in the semiconductor and electronics industries. With its unique combination of properties, this grade offers a range of benefits for device handling and test applications.Features:High strength and stiffness, making it suitable for extreme structural applicationsExcellent resistivity in the 10E5 to 10E8 ohms per square range, ensuring reliable electrostatic dissipationHeat deflection temperature of 419° F / 215° C, making it suitable for high temperature environmentsNot subject to dimensional change as a result of exposure to moistureBenefits:Suitable for use in a range of applications within the semiconductor and electronics industriesOffers reliable performance in extreme conditionsCost-effective alternative for applications that do not require the thermal performance of ultra-high performance materialsApplications:Device handling and test applications within the semiconductor and electronics industriesSuitable for use in high temperature environments, including extreme structural applications.

Semitron® MDS 100 modified Polyetheretherketone PEEK shapes offer a remarkable combination of strength, stiffness, and stability. This grade in particular was developed for use in uncontrolled application environments where a high level of precision is required. Due to this, Semitron® MDS 100 components are often used as test sockets, nests, and fixtures in test and package equipment throughout the semiconductor and electronics industry.Features:Remarkable combination of strength, stiffness, and stabilityDeveloped for use in uncontrolled application environments where a high level of precision is requiredMoisture absorption of 0.10% at 24 hrs. (per ASTM D570)Thermal performance to 210 °C (410 °F)Flexural modulus > 1,400,000 psiBenefits:Ideal for test sockets, nests and fixtures in test and package equipmentSuitable for use in semiconductor and electronics industryCan withstand harsh, uncontrolled environmentsLow moisture absorption ensures dimensional stabilityHigh thermal performance and flexural modulus ensures durability and precisionApplications:Test sockets, nests and fixtures in test and package equipmentOther applications in the semiconductor and electronics industry that require a high level of precision and stability in uncontrolled environments.

Semitron® ESd 420 PEI Polyetherimide electro static dissipative shapes exhibit high strength and stiffness, and excellent resistivity in the 10E5 to 10E8 ohms per square range. This grade in particular excels in high temperature environments, making it ideal for extreme structural applications in semiconductor and electronics markets.Features:High strength and stiffnessExcellent resistivity in the 10E5 to 10E8 ohms per square rangeSuitable for high temperature environmentsSurface resistivity: 106 - 109 ohms/sqBenefits:Ideal for extreme structural applications in semiconductor and electronics marketsOnly truly dissipative plastic product for use in high temperature applicationsCan withstand harsh conditions while maintaining its electrostatic propertiesApplications:Semiconductor and electronics industryHigh temperature structural applications such as in electronic components and equipment, where electrostatic discharge (ESD) protection is necessary.Can be used in electronic packaging, automotive, aerospace, and other industries where static control is critical.

SABIC's Specialties Business LNP™ THERMOCOMP™ LX08411 compound is based on Polyetheretherketone (PEEK) resin containing 45% carbon fiber. Added features of this grade include: Electrically Conductive, High Modulus, Easy Molding.

SABIC's Specialties Business LNP THERMOCOMP UF0067W compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Hot Water Moldable, Non-Brominated & Non-Chlorinated Flame Retardant. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business 10% Glass fiber filled, enhanced flow Polyetherimide (Tg 217C) with internal mold release. ECO Conforming, UL94 V0 and 5VA listing. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP LF004E compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business Transparent, Enhanced flow Polyetherimide copolymer (Tg 225C) with enhanced chemical resistance to strong acids, bases, aromatics, and ketones. ECO conforming, UL94 V0 listing. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business ULTEM™ Resin 2310R is an improved flow 30% glass fiber reinforced polyetherimide resin with an added internal mold release. The material is RoHS compliant and is intrinsically flame retardant without the use of FR modifiers and offers UL94 V0 and 5VA ratings. The material may offer excellent dimension stability, strength, stiffness and creep resistance up to high temperature due to its high glass transition temperature of 217°C. The material is opaque and can be custom colored.This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP LC004XXP compound is based on Polyetheretherketone (PEEK) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP UF006AS compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Heat Stabilized. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP 2X95787 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 15% glass fiber.

LNP THERMOCOMP 2C003 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP LX03447 compound is based on Polyetheretherketone (PEEK) resin containing 35% carbon fiber. Added features of this grade include: Electrically Conductive.

High flow ULTEM for thin wall application

SABIC's Specialties Business LNP™ THERMOCOMP™ LC00AEX1 compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Electrically Conductive, Ultra High Modulus and Strength, Easy Molding, Excellent Wear Resistance and Low CTE.

SABIC's Specialties Business LNP™ THERMOCOMP™ LC006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: High Modulus, High impact, Easy Molding, Electrical Conductive.

LNP THERMOCOMP LF002XXP-WT02005 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. Added features of this grade include: Custom Color.

SABIC's Specialties Business ULTEM 1000E Resin is an unreinforced amorphous polyetherimide (PEI) resin that may offer a high glass transition temperature (Tg) of 217°C. The material has internal mold release. Features are excellent mechanical, electrical and dimensional properties up to high temperatures. The material may offer very good chemical resistance for an amorphous material and is inherently flame retardant offering UL94 V0 and 5V ratings. The material is RoHS compliant and the natural, uncolored, material is halogen free according to standards IEC 61249-2-21 , IPC 4101E and JEDEC JS709B. For colored variants compliance needs to be checked case by case. The base material is transparent amber colored but is also available in custom colors - transparent and opaque. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business EXTEM™ Resin XH1015UCL is an unreinforced amorphous thermoplastic polyimide (TPI) resin that offers a high glass transition temperature (Tg) of 267°C. It features excellent mechanical, electrical, and dimensional properties at high temperatures. The material also has good near-IR transparency and a high refractive index, making it an excellent candidate for SMT applications that require injection moldable optical lenses and connectors. The material is RoHS compliant, and the natural, uncolored material is halogen-free according to IEC 61249-2-21, IPC 4101E, and JEDEC JS709B standards. Compliance for colored variants needs to be checked on a case-by-case basis. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP SF006 compound is based on Nylon 12 resin containing 30% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business ULTEM™ Resin CRS5001 Transparent is a standard flow polyetherimide copolymer (Tg 225C) with enhanced chemical resistance to strong acids, bases, aromatics, and ketones. It is ECO-compliant and has a UL94 V0 listing. An ideal alternative to polysulfone, ULTEM™ Resin CRS5001 Transparent meets the flame, smoke, and OEM toxicity requirements beneficial for aerospace interior applications such as connectors in hidden spaces. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business ULTEM™ Resin 2100 is a polyetherimide (PEI), 10% Glass fiber filled, standard flow Polyetherimide (Tg 217°C) . ECO Conforming, UL94 V0 and 5VA listing. NSF 51 listing, WRAS certification in recognized colors.This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP UF0069S compound is based on Polyphthalamide (PPA) resin containing 30% glass fiber. Added features of this grade include: Flame Retardant, Heat Stabilized.

SABIC's Specialties Business LNP THERMOCOMP UF007SXC compound is based on Polyphthalamide (PPA) resin containing 35% glass fiber. Added features of this grade include: Heat Stabilized. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

LNP THERMOCOMP 2C004 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

SABIC's Specialties Business ULTEM™ Resin 2210R is a 20% Glass fiber filled, enhanced flow Polyetherimide (Tg 217°C) with internal mold release. ECO Conforming, UL94 V0 and 5VA listing. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business ULTEM™ Resin 1010UCL is an amorphous, transparent polyetherimide (PEI) thermoplastic offering enhanced flow and a glass transition temperature (Tg) of 217°C. 1010UCL offers the same performance as ULTEM 1010 resin and offers further enhanced cleanliness control for (optical) applications. The natural (uncolored) version of this grade is compliant with RoHS and also with Halogen Free standards as IEC 61249-2-21 and e.g. IPC 4101E. For colored versions, compliance needs to be checked case by case.

SABIC's Specialties Business LNP THERMOCOMP LF006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber. Added features of this grade include: Low warpage, Easy Molding. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business 40% Glass fiber filled, enhanced flow Polyetherimide (Tg 217C). ECO Conforming, UL94 V0 and 5VA listing. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP THERMOCOMP LC008E compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business 10% Glass fiber filled, standard flow Polyetherimide (Tg 217C) with internal mold release. ECO Conforming, UL94 V0 and 5VA listing. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

High flow Polyetherimide blend. ECO Conforming, UL94 V0 Listing.

SABIC's Specialties Business ULTEM 2300 resin is a standard flow 30% glass fiber reinforced polyetherimide resin.ULTEM 2300 resin is RoHS compliant and is intrinsically flame retardant without the use of FR modifiers and offers UL94 V0 and 5VA ratings and FAR25.853 performance.ULTEM 2300 resin may offer excellent dimension stability, strength, stiffness and creep resistance up to high temperature due to its high glass transition temperature of 217°C.ULTEM 2300 resin is opaque and can be custom colored.FeaturesAmorphousChemical ResistantDimensional StabilityFlame RetardantGeneral PurposeGood AdhesionGood FlowGood Mechanical PropertiesHeat ResistanceHigh Hydrolytic StabilityHigh StiffnessHigh StrengthLow CreepLow Smoke EmissionLow ToxicityVery Good Heat ResistanceWide Temperature Operating RangeApplicationsConsumer Appliances & ElectronicsAutomotive LightingAutomotive Electrical & Electronic SystemsAutomotive Interior, Exterior & BodyPowertrain & UTHGlazing & Window ElementsInterior FixturesArtificial TurfAutomotive ElectronicsDisplaysIndustrial AutomationFurnitureHousewaresLawn & GardenMedical Devices & AssembliesNon-Food Consumer PackagingConnectorsPrinted Circuit Boards (PCBs)Semiconductor ManufacturingSwitches & RelaysPower & UtilitiesRenewable EnergyConsumer Goods for Sports & RecreationTextile ManufacturingAerospace & AviationOff Road & Recreational Vehicle (RV)Rail & Mass TransitOptical Fiber & Telecom This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.