Products in Sensors & Actuators: Electrically Conductive

LNP STAT-KON DX04490R compound is based on Polycarbonate (PC) resin containing proprietary fillers. Added features of this grade include: Electrically Conductive, Radar Absorbing.

SABIC's Specialties Business LNP LUBRICOMP UCL36ASP compound is based on Polyphthalamide (PPA) resin containing 30% carbon fiber and 15% PTFE. Added features of this grade include: Internally Lubricated, Electrically Conductive, Heat Stabilized, Wear Resistant.

SABIC's Specialties Business LNP™ STAT-KON™ ZJK20I is a static dissipative CNT compound based on polyphenylene ether (PPE) + polystyrene (PS) resin with low particulate count and good high heat properties. This material is an excellent candidate for IC tray, Wafer cassette and Slider tray parts in the semiconductor industry.

MOCOM Compounds ALFATER® XL A80 2EC0000 is a black, electrically conductive, thermoplastic vulcanisate (PP+EPDM) with reduced surface resistivity, good weathering resistance, good chemical resistance, good ozone resistance, and good hot air and hydrolysis resistance. It is used in the automotive, machinery, electrical and electronic, and building and construction sectors for applications such as injection molded parts, extruded parts, coextrusion, and functional components with electrical conductivity, seals, sealing lips, and profiles.

MOCOM Compounds ALCOM® TCE PC 5040 16090 is a polycarbonate-based polymer with a special filler/additive system that has thermal, electrical and heat stability properties. It is suitable for the Lighting, Electrical and Electronic market segment and its application areas include lighting, energy management, electrical and electronic (E&E), and electrical components.

MOCOM Compounds ALCOM® PA66 910/32.1 TCE5 is a polyamide 66 base polymer with a special filler and additive system that provides thermal and electrical conductivity, as well as heat stabilization. It is mainly used for automotive, machinery, electrical and electronic, and lighting applications like electrical components, radiator systems, and cooling systems such as housings and functional components. To ensure optimal performance, it should be pre-dried at 80°C in a dry air (dessiccant) dryer for 2-12 hours, with a maximum moisture content of 0.12%. For injection molding, the melt temperature should be between 300-320°C and the mold temperature should be between 100-130°C.

MOCOM Compounds ALCOM® PA66 910/32.1 GF8 TCE8 is a polyamide 66 base polymer with a special filler/additive system, including 8% glass fibers, thermal conductive, electrically conductive, and heat stabilized. It is commonly used in the automotive, machinery, electrical and electronic, and lighting industries, and typical applications include housings and functional components. Processing injection molding requires a melt temperature of 300-320°C and a mold temperature of 100-130°C.

MOCOM Compounds ALCOM® PA66 910/32.1 TCE2 is a special filler-based polyamide 66 with thermal and electrical conductivity, as well as heat stabilization, making it suitable for applications such as electrical components, radiator systems, cooling systems, housings, and functional components. For injection molding, the melt temperature should be 300-320°C and the mold temperature should be 100-130°C. This product is suitable for the automotive, machinery, electrical, electronic, and lighting markets.

MOCOM Compounds ALCOM® PA66 910/1.2 CF30 is a polyamide 66 base polymer with 30% carbon fibers as a filler/additive system, which is electrically conductive, has reduced surface resistivity, is heat stabilized, and has high stiffness. It is suitable for use in the automotive and machinery market segments, with typical applications including bearings and functional components. For optimal performance, it should be pre-dried at 80°C in a dry air (dessiccant) dryer for 2-12 hours with a maximum moisture content of <0.15%. Processing injection molding should be done at a melt temperature of 280-300°C and mold temperature of 80-120°C.

TPE-S, Shore A80, filled, suitable for EMC-appropriate shielding of electromagnetic fields