Products in Terminal Blocks, Plugs & Sockets: Phenols & Phenolics

Room temperature punching and shearing paper phenolic grade up to .125" thick. NP612 is more flexible with lower mechanical properties than NP611, and is intended for applications where electrical and moisture requirements are of secondary importance. NP612 meets the requirements of MIL-I-24768/20.

A paper-base laminate with low phenolic resin content for hard, flat surfaces. It is typically hot punched for numerous low voltage electrical applications of less than 250 volts where the material is not subjected to high humidity.

Hot punching general-purpose phenolic grade. Mechanical properties approach those of NP610 with improved electrical properties and moisture resistance. NP611 meets the requirements of IEC60893-3-4-PF CP 201.

Grade MC320LE is a fine weave bleached cotton phenolic composite that has excellent machining characteristics and low moisture absorption. Applications include marine applications, terminal boards and parts requiring medium strength and excellent electrical characteristics. MC320LE meets or exceeds the requirements of MIL-I-24768/13 and ASMT F2953-12 Type FB. Certification to IEC standard is pending.

Paper phenolic grade with better electrical properties than NP612. NP625 requires slightly more heat to shear and punch than NP612. Certification to IEC standard is pending.

Room temperature punching and shearing grade up to 0.125″ thick. NP615 is more flexible with lower mechanical properties than NP611. NP615 is produced with high resin content melamine impregnated surfaces to give the resulting laminate better arc resistance. Intended for applications where electrical and moisture requirements are secondary.

Hot punching grade with excellent electrical properties and low moisture absorption. Major application is for punched parts for switches and other insulation applications requiring high electrical strength in applications where either moisture is present or in areas of high humidity.

Hot punching general-purpose phenolic grade. Mechanical properties approach those of NP610 with improved electrical properties and moisture resistance. Certification to IEC standard is pending.

Phenolic paper based grade for mechanical applications. Good tensile, compressive and flexural strength. Primarily a machining material, but may be hot punched up to .093" thick. NP610 meets MIL-I24768/12 Type PBM, ASTM D709 Type X and IEC 60893-3-4 PFCP 201.

NP630 is a fine machining grade with excellent electrical properties and moisture resistance. It has low cold flow with good dimensional stability.

Lower cost paper phenolic NEMA Grade XP. NP660 uses natural kraft paper without pigmented cover sheet. It is a warm to hot punching material. It is available in natural and black only, without a pigmented cover, only. Certification to IEC standard is pending.

Low cost room temperature punching grade with mechanical and electrical properties similar to NP612. This version is made with pigment cover plies on the surface.

Manufactured with a cotton fabric and phenolic resin, NP310E is easy to machine and possesses lower moisture absorption and enhanced electrical properties. NP310E meets or exceeds the requirements of MIL-I-24768/14.

NP629 is a paper-phenolic high-pressure laminate and intended primarily for mechanical applications, but is suitable for electrical applications as well. The electrical properties are not quite as good as those of NP630. Certification to IEC standard is pending.

Plenco® 06500 is a glass-reinforced phenolic molding compound offering improved strength, dimensional stability, and excellent electrical properties. UL recognized under component file E40654. 06500 is available in black.

Plenco® 07552 is a glass fiber reinforced novolac phenolic molding compound, exhibiting superior dimensional stability, good impact strength, and good electrical properties. Type ASTM 5948 MFH. UL recognized under component file E40654. 07552 is available in black.

Plenco® 02535 is a general purpose, organic filled phenolic molding compound offering optimized cure characteristics and excellent electrical properties. UL recognized under component file E40654. 02535 is available in black. 02535 was qualified under military specification MIL-M-14 (superseded by ASTM D-5948) TYPE CFG and batches can, if requested and paid for, be tested for certification to the standard.

Plenco® 04466 is a heat resistant, mineral and flock filled phenolic molding compound, offering excellent mechanical strength and cosmetic properties. UL recognized under component file E40654. 04466 is available in black.

Plenco® 04414 is a flock and mineral filled phenolic molding compound. It is formulated for use in electrical applications that require improved heat resistance, mechanical strength, and dimensional stability. UL recognized under component file E40654. 04414 is available in black. 04414 was qualified under military specification MIL-M-14 (superseded by ASTM D-5948) TYPE CFG and batches can, if requested and paid for, be tested for certification to the standard.

Plenco® 06343 is a mica reinforced phenolic molding compound, offering for a low power factor, low electrical losses, and good electrical properties after long exposures to high humidity. UL recognized under component file E40654. 06343 is available in natural color.

Plenco® 02000 is a versatile general purpose, organic filled phenolic molding compound, offering optimum cure characteristics and an excellent balance of molding properties. UL recognized under component file E40654. 02000 is available in black.

Plenco® 04527 is a heat resistant, mineral and flock filled phenolic molding compound, offering excellent mechanical strength, and resistance to cracking in a wet-dry environment. UL recognized under component file E40654. 04527 is available in black.

Plenco® 04548 is a heat resistant mineral filled phenolic molding compound, offering fast cure rates and hot rigidity. UL recognized under component file E40654. 04548 is available in black and brown. 04548 was qualified under military specification MIL-M-14 (superseded by ASTM D-5948) TYPE CFG and batches can, if requested and paid for, be tested for certification to the standard.

Plenco® 04309 is a heat resistant, glass-reinforced phenolic molding compound offering improved mechanical strength and electrical strength properties. UL recognized under component file E40654. 04309 is available in black.

Plenco® 02369 is a general purpose, organic filled phenolic molding compound, formulated to minimize the generation of free ammonia for applications that are sensitive to such formation. Plenco® 02369 offers excellent physical and electrical strength properties. UL recognized under component file E40654. 02369 is available in black.

Plenco® 03509 is a mineral and flock filled phenolic molding compound offering excellent electrical properties, dimensional stability, and improved heat resistance. UL recognized under component file E40654. 03509 is available in black or brown.

Plenco® 04002 is a heat resistant, mineral filled phenolic molding compound offering excellent mechanical strength and dimensional stability at elevated temperatures. UL recognized under component file E40654. 04002 is available in black.

Plenco® 07200 is an organic fiber reinforced phenolic molding compound, offering improved mechanical strength, good powder properties and excellent cosmetic properties. UL recognized under component file E40654. 07200 is available in black.

Plenco® 02482 is a general purpose, organic filled phenolic molding compound offering excellent mechanical strength while maintaining dielectric properties at elevated humidity levels. UL recognized under component file E40654. 02482 is available in black.

Plenco® 07307 is an organic fiber reinforced phenolic molding compound, offering improved mechanical strength properties. UL recognized under component file E40654. 07307 is available in black. 07307 was qualified under military specification MIL-M-14 (superseded by ASTM D-5948) TYPE CFG and batches can, if requested and paid for, be tested for certification to the standard.

Plenco® 07070 is a cotton flock and mineral filled resole phenolic molding compound, offering improved impact strength properties. 07070 is available in black.

Plenco® 04485 is a mineral filled phenolic molding compound offering excellent heat resistance, electrical resistance, and dimensional stability. UL recognized under component file E40654. 04485 is available in black.

Plenco® 07579 is a fast curing, woodflour filled, novolac phenolic molding compound, formulated for industrial applications that do not require a smooth finish. UL recognized under component file E40654. 07579 is available in black.

Plenco® 03303 is a mineral and flock-filled phenolic molding compound offering excellent electrical insulating properties. UL recognized under file E40654. 03303 is available in black.

Plenco® 02311 is a versatile general purpose organic filled phenolic molding compound offering excellent mold processability and optimized cure cycles. Plenco® 02311 is also granulated to provide improved pourability characteristics for cold powder compression molding. UL recognized under component file E40654. 02311 is available in black color.

Plenco® 03554 is an organic reinforced phenolic molding compound modified with PTFE to offer improved coefficient of friction values. 03554 is available in black. It is UL listed. 03554 is a re-number of 06554 formulation.