Products in Wire & Cable: Epoxy & Epoxy Derivatives

FLASHBOND™ UV-5402 is a low viscosity, flexible, light curing epoxy adhesive that offers excellent strenth and flexibility for reduced cracking. UV-5402 is low viscosity and high elongation. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400-415nm) and can also cure down to 365nm.

EPOXIBOND™ EB-107LP-2 is a two component - optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.

EPOXIBOND™ EB-177 is a low viscosity, high Tg, two part epoxy that can be used for potting, encapsulating, or bonding. It is used highly in the medical, optical, and semiconductor industries.EB-177 has excellent high temperature resistance at 300°C and excellent solvent, chemical, and moisture resistance including gamma rays, autoclave, and ETO. It is an excellent choice for semiconductor applications including capillary under fill or flipchip die attach.

RS-2272 is a patented, castable, lead free insulating grade filled epoxy resin specifically designed for high voltage insulator applications requiring X-Ray shielding. This material provides good electrical grade insulation properties, high mechanical properties, and superior arc resistance to any lead oxide filled epoxy. This material is non-flammable and meets UL94V-0.

RS-2297 is a patented, very high density, filled, castable, lead free insulating grade epoxy resin specifically designed for high voltage insulator applications requiring x-ray shielding. This material provides greater than 28% of the x-ray shielding of lead metal, and has superior x-ray shielding to the industry standard 30% lead oxide filled “orange” epoxy. This high density material is non-hazardous and meets UL94V-0 requirements.

RS2240 is a castable, filled epoxy resin specifically designed for high voltage insulator applications. This material provides excellent electrical grade insulation properties, high mechanical properties, and superior resistance to chemicals including concentrated acids, and mild alkalines. This material also offers superior arc resistance as compared to standard electrical grade epoxy materials. In addition, this material is non-flammable and meets UL94V-0 requirements.

FLASHBOND™ UV-3700F is a filled, low shrinkage, light curing epoxy adhesive that offers low CTE and high bonds strength. UV-3700F cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass. This filled system is excellent for when low viscosity systems are not ideal. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400- 415nm).

EPOXIBOND™ EB-107LY is a two-part, low viscosity, clear epoxy adhesive and encapsulating material. EB-107LY is a low yellowing version of EB-107LP-2. It is recommended for bonding and encapsulating where reduced yellowing is preferred. It is recommended for joining transparent materials, such as glass, and where a thin bond line is desired. EB-107LY can be used for bonding most metals, ceramics, and some plastics.

FLASHBOND™ UV-3607HTis a 1-component, UV/Thermal cure adhesive & sealant. This material can cure under moderate intensity UV light as well as elevated temperatures for shadowed areas. Its low viscosity is ideal for coating, capillary action, and doming applications. Unlike traditional dual cure epoxy systems which need light + heat, UV-3607HT can cure either with UV/LED light or with heat.

RS-2299 is a patented, high density filled, castable, lead free insulating grade epoxy resin specifically designed for high voltage insulator applications requiring x-ray shielding. This material provides greater than 20% of the x-ray shielding of lead metal, and is equivalent or better than industry standard 30% lead oxide filled “orange” epoxy. This material is non-hazardous, and meets UL94V-0 flammability requirements.

RS-2279 is a castable, filled epoxy resin specifically designed to operate under high voltage conditions in outdoor applications, as well as SF6 environments. This material provides excellent electrical grade insulation properties, high mechanical properties, and superior resistance to chemicals including concentrated acids and mild alkalines.

LEEBOND 37-75 is a proprietary two-part epoxy adhesive used in both electrical-grade potting and structural adhesive applications. Cured systems demonstrate excellent toughness, impact resistance and exceptional bond strength for hard to bond to substrates. This system can be cured at both room temperature or accelerated with modest heating.

RS-2243 is a castable, filled epoxy resin specifically designed for high temperature, high voltage insulator applications. This material provides excellent electrical grade insulation properties, high mechanical properties, and superior resistance to chemicals including concentrated acids and mild alkalines. This material has superior arc resistance as compared to standard electrical grade epoxy materials. In addition, this material is non-flammable and meets UL94V-0 requirements.

EC-1850FT is a pourable filled epoxy resin system offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. It is a lower viscosity version of EC-1850FT. It rapidly transfers heat, eliminates hot spot, and increases the operating efficiency of most encapsulated devices. Its low shrinkage minimizes risk of damage to fragile components.

FLASHBOND™ UV-5608DC is an innovative light cure epoxy adhesive. It has unique features that allow for fast processing and fixturing of parts. Once the adhesive has been activated with UV light, it has set open time that allows for assembly of parts. The product continues to cure at room temperature or rapidly cures when exposed to low temperature heat. The cured product exhibits low shrinkage and excellent thermal, water and chemical resistance. Typical applications include bonding of optics, connectors, fibers, lenses, prisms and other electronic components where low shrinkage and low outgassing are required.

RS-2277 is a patented, castable, lead free insulating grade filled epoxy resin specifically designed for high voltage insulator applications requiring X-Ray shielding. This material provides good electrical grade insulation properties, high mechanical properties, and superior arc resistance to any lead oxide filled epoxy. This material has equal x-ray shielding to a 25% lead oxide filled epoxy. This material is non-flammable and meets UL94V-0 requirements.

Resin Technology Group CT-988 Cationic UV Cure Epoxy Adhesive is an epoxy-based, paste-viscosity, cationic-curable adhesive/sealant. This product is activated by exposure to medium intensity UV radiation resulting in a high strength, chemical resistant, low out-gassing polymer system capable of surviving exposure up to 150°C.

Araldite® GY 6010 is a general purpose unmodified epoxy resin based on Bisphenol A with medium viscosity.

United Adhesives SE 1262 is a flexible epoxy coating & encapsulant.

AX-5110 is a flame retardant laminates, honeycomb and foam panels.

FR408 low dielectric constant (Dk) and low dissipation factor (Df) make it an ideal candidate for broadband circuit designs requiring faster signal speeds or improved signal integrity. FR408 is compatible with most FR-4 processes. This feature allows the use of FR408 without adding complexity to current fabrication techniques.

CHS-EPOXY 575 Is a Bisphenol A/F resin modified by difunctional reactive diluent

CLR1821 is a filled, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive filler and convenient mix ratio makes it suitable for processing in automatic dispense equipment. This product is certified with ul and passes ul94-v1 flammability testing.

Lamitex® G-10CR/G-10 EP GC 21 laminated sheet is a woven glass fabric composite impregnated with an epoxy resin. It is primarily used for mechanical, electrical and electronic applications where extremely high mechanical strengths are required at room and moderate temperatures. It is frequently specified for its excellent resistance to chemicals and retention of good electrical properties in dry and high humidity environments. G-10 is non-brominated and is not flame retardant and should not be confused with a similar glass epoxy grade FR-4, which is flame retardant.

Lectromat Glass Cloth and Mats WG-601-1 is applied in coil armor tape.

Lamitex® FR-4 EP GC 23 epoxy laminated sheet is reinforced with a woven glass fabric. It is primarily used for mechanical, electrical and electronic applications where extremely high mechanical strengths are required at room and moderate temperatures. Lamitex FR-4 meets or exceeds NEMA FR-4 and Mil-I-24768/27 specifications, has excellent resistance to chemicals and retains its' electrical properties in dry and high humidity environments.

CLH6441 is a filled, room temperature cure, two component epoxy system. The system is suitable for potting and encapsulating electrical and electronic components. The products use of non-abrasive filler and convenient mix ratio makes it suitable for processing in automatic dispense equipment. This product is certified with ul and passes ul94-v1 flammability testing.

Hairma Chemical (GZ) Adipate Di(Monoacetyl, Monoepoxyoleoyl) Glyceride HM-828EC is a kind of functional environmentally friendly plasticizer synthesized from vegetable oil as raw material through the steps of transesterification, high temperature esterification, acetylation and epoxidation. It can be used as the main plasticizer. Good compatibility with PVC resin, precipitation resistance, migration resistance, aging resistance, heat resistance, solvent extraction resistance and oil resistance.

Lectromat Glass Cloth and Mats 95-147 is applied in bearing insulation.

Anchor Seal SY5300VS Amber-Clear is anchor-seal epoxy for potting compounds and encapsulants coils and transformers. It bonds to PVC and vinyl and is moisture resistant, low viscosity, extended gel time, PVC cable/wire, switch connectors, signal generating transducers.

Caplinq DK15-02 Brown is an epoxy-based coating powder developed as an epoxy resin binder when making powdered iron core or pot-core type reactors or induction devices.

Duresco NU 6110 T/NU 6110 V is a Glass fiber reinforced epoxy molding compound with very good mechanical properties for high temperature applications.

Erhard Hippe KG EP GC 201 ASF is a fiber glass cloth epoxy (epoxide) resin.

SP2 Carbon Technology G&I 1911-3 is a resilient Polyurethane acrylate additive, consisting of Graphene, carbon black, and special silane binder that can create a bonded interface with any fiberglass substrate. G&I 1911-3 is specifically designed for non-woven fiberglass that can achieve the EMI/RFI shielding and ESD elimination.

IS415 is engineered to meet the demands of Lead (Pb) free multilayer printed circuit assembly, deliver CAF resistance with strong IST results and maintain FR-4 processing. IS415 offers good electrical performance, superior chemical and thermal performance and product consistency.

Anchor Seal SY6009T* Black is anchor-seal epoxy for potting compounds and encapsulants coils and transformers. It is used in low health hazard, thermal conducting switches.